| Patent | Date |
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Use Of Rotation To Correct For Azimuthal Non-uniformities In Semiconductor Substrate Processing
App 20220243323 - CHANDRASEKHARAN; Ramesh ; et al. | 2022-08-04 |
Deposition Of Metal Films
App 20220195598 - Collins; Joshua ; et al. | 2022-06-23 |
Method To Create Air Gaps
App 20210343579 - van Cleemput; Patrick A. ; et al. | 2021-11-04 |
Method to create air gaps
Grant 11,088,019 - Van Cleemput , et al. August 10, 2 | 2021-08-10 |
Method Of Depositing Tungsten And Other Metals In 3d Nand Structures
App 20210238736 - Butail; Gorun ; et al. | 2021-08-05 |
Suppressing interfacial reactions by varying the wafer temperature throughout deposition
Grant 11,075,127 - Varadarajan , et al. July 27, 2 | 2021-07-27 |
Method To Create Air Gaps
App 20200219758 - van Cleemput; Patrick ; et al. | 2020-07-09 |
Suppressing Interfacial Reactions By Varying The Wafer Temperature Throughout Deposition
App 20200066607 - Varadarajan; Seshasayee ; et al. | 2020-02-27 |
Electrolyte concentration control system for high rate electroplating
Grant 10,472,730 - Mayer , et al. Nov | 2019-11-12 |
Low volume showerhead with faceplate holes for improved flow uniformity
Grant 10,378,107 - Chandrasekharan , et al. A | 2019-08-13 |
Suppressing interfacial reactions by varying the wafer temperature throughout deposition
Grant 10,347,547 - Varadarajan , et al. July 9, 2 | 2019-07-09 |
Method To Create Air Gaps
App 20180233398 - Van Cleemput; Patrick A. ; et al. | 2018-08-16 |
Method for depositing ALD films using halide-based precursors
Grant 10,020,188 - Sims , et al. July 10, 2 | 2018-07-10 |
Method For Depositing Ald Films Using Halide-based Precursors
App 20180102245 - Sims; James S. ; et al. | 2018-04-12 |
Suppressing Interfacial Reactions By Varying The Wafer Temperature Throughout Deposition
App 20180047645 - Varadarajan; Seshasayee ; et al. | 2018-02-15 |
Method for depositing metals free ald silicon nitride films using halide-based precursors
Grant 9,824,884 - Sims , et al. November 21, 2 | 2017-11-21 |
Method for RF compensation in plasma assisted atomic layer deposition
Grant 9,624,578 - Qian , et al. April 18, 2 | 2017-04-18 |
Method For Encapsulating A Chalcogenide Material
App 20170092856 - Henri; Jon ; et al. | 2017-03-30 |
Method for encapsulating a chalcogenide material
Grant 9,601,693 - Henri , et al. March 21, 2 | 2017-03-21 |
Low Volume Showerhead With Faceplate Holes For Improved Flow Uniformity
App 20160340782 - Chandrasekharan; Ramesh ; et al. | 2016-11-24 |
Two-step Deposition With Improved Selectivity
App 20160273113 - KOLICS; Artur ; et al. | 2016-09-22 |
Two-step deposition with improved selectivity
Grant 9,353,444 - Kolics , et al. May 31, 2 | 2016-05-31 |
Method and apparatus for electroplating
Grant 9,309,604 - Mayer , et al. April 12, 2 | 2016-04-12 |
Method And Apparatus For Rf Compensation In Plasma Assisted Atomic Layer Deposition
App 20160090650 - Qian; Jun ; et al. | 2016-03-31 |
Methods And Apparatuses For Stable Deposition Rate Control In Low Temperature Ald Systems By Showerhead Active Heating And/or Pedestal Cooling
App 20160056032 - Baldasseroni; Chloe ; et al. | 2016-02-25 |
Electrolyte Concentration Control System For High Rate Electroplating
App 20150315720 - Mayer; Steven T. ; et al. | 2015-11-05 |
Two-step Deposition With Improved Selectivity
App 20150275374 - KOLICS; Artur ; et al. | 2015-10-01 |
Electrolyte concentration control system for high rate electroplating
Grant 9,109,295 - Reid , et al. August 18, 2 | 2015-08-18 |
Control of electrolyte composition in a copper electroplating apparatus
Grant 9,045,841 - Buckalew , et al. June 2, 2 | 2015-06-02 |
Through silicon via metallization
Grant 9,029,258 - Nalla , et al. May 12, 2 | 2015-05-12 |
Through Silicon Via Metallization
App 20140217590 - NALLA; Praveen Reddy ; et al. | 2014-08-07 |
Method And Apparatus For Electroplating
App 20130327650 - Mayer; Steven ; et al. | 2013-12-12 |
Split Pumping Method, Apparatus, And System
App 20130237063 - VARADARAJAN; SESHASAYEE ; et al. | 2013-09-12 |
Method and apparatus for electroplating
Grant 8,475,636 - Mayer , et al. July 2, 2 | 2013-07-02 |
Method and apparatus for electroplating
Grant 8,475,644 - Mayer , et al. July 2, 2 | 2013-07-02 |
Rapidly cleanable electroplating cup seal
Grant 8,398,831 - Ghongadi , et al. March 19, 2 | 2013-03-19 |
Electroplating cup assembly
Grant 8,377,268 - Rash , et al. February 19, 2 | 2013-02-19 |
High compressive stress carbon liners for MOS devices
Grant 8,362,571 - Wu , et al. January 29, 2 | 2013-01-29 |
Method and apparatus for electroplating
Grant 8,308,931 - Reid , et al. November 13, 2 | 2012-11-13 |
Remote plasma processing of interface surfaces
Grant 8,217,513 - Antonelli , et al. July 10, 2 | 2012-07-10 |
Control of electrolyte composition in a copper electroplating apparatus
Grant 8,128,791 - Buckalew , et al. March 6, 2 | 2012-03-06 |
Remote plasma processing of interface surfaces
Grant 8,084,339 - Antonelli , et al. December 27, 2 | 2011-12-27 |
Electroplating Cup Assembly
App 20110233056 - Rash; Robert ; et al. | 2011-09-29 |
Method for making high stress boron-doped carbon films
Grant 7,998,881 - Wu , et al. August 16, 2 | 2011-08-16 |
Rapidly Cleanable Electroplating Cup Seal
App 20110181000 - Ghongadi; Shantinath ; et al. | 2011-07-28 |
Closed contact electroplating cup assembly
Grant 7,985,325 - Rash , et al. July 26, 2 | 2011-07-26 |
Remote Plasma Processing Of Interface Surfaces
App 20110120377 - Antonelli; George Andrew ; et al. | 2011-05-26 |
Rapidly cleanable electroplating cup assembly
Grant 7,935,231 - Ghongadi , et al. May 3, 2 | 2011-05-03 |
Electrolyte Concentration Control System for High Rate Electroplating
App 20110083965 - Reid; Jonathan D. ; et al. | 2011-04-14 |
High compressive stress carbon liners for MOS devices
Grant 7,906,817 - Wu , et al. March 15, 2 | 2011-03-15 |
Interfacial layers for electromigration resistance improvement in damascene interconnects
Grant 7,858,510 - Banerji , et al. December 28, 2 | 2010-12-28 |
Method and apparatus for electroplating including remotely positioned second cathode
Grant 7,854,828 - Reid , et al. December 21, 2 | 2010-12-21 |
Remote Plasma Processing Of Interface Surfaces
App 20100317198 - Antonelli; George Andrew ; et al. | 2010-12-16 |
Remote Plasma Processing Of Interface Surfaces
App 20100317178 - Antonelli; George Andrew ; et al. | 2010-12-16 |
Interfacial layers for electromigration resistance improvement in damascene interconnects
Grant 7,799,671 - Banerji , et al. September 21, 2 | 2010-09-21 |
Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers
Grant 7,799,684 - Reid , et al. September 21, 2 | 2010-09-21 |
Edge bevel removal of copper from silicon wafers
Grant 7,780,867 - Mayer , et al. August 24, 2 | 2010-08-24 |
Method And Apparatus For Electroplating
App 20100116672 - Mayer; Steven ; et al. | 2010-05-13 |
Methods and apparatus for controlled-angle wafer positioning
Grant 7,686,927 - Reid , et al. March 30, 2 | 2010-03-30 |
Method And Apparatus For Electroplating
App 20100044236 - Mayer; Steven ; et al. | 2010-02-25 |
Method and apparatus for electroplating including remotely positioned second cathode
App 20100032303 - Reid; Jonathan ; et al. | 2010-02-11 |
Method and apparatus for electroplating
App 20100032310 - Reid; Jonathan ; et al. | 2010-02-11 |
Interfacial layers for electromigration resistance improvement in damascene interconnects
Grant 7,648,899 - Banerji , et al. January 19, 2 | 2010-01-19 |
Closed Contact Electroplating Cup Assembly
App 20090107836 - Rash; Robert ; et al. | 2009-04-30 |
Rapidly Cleanable Electroplating Cup Assembly
App 20090107835 - Ghongadi; Shantinath ; et al. | 2009-04-30 |
Electroless copper fill process
Grant 7,456,102 - Varadarajan , et al. November 25, 2 | 2008-11-25 |
Multistep immersion of wafer into liquid bath
App 20080149489 - Varadarajan; Seshasayee ; et al. | 2008-06-26 |
Methods and apparatus for controlled-angle wafer positioning
Grant 7,097,410 - Reid , et al. August 29, 2 | 2006-08-29 |
Methods and apparatus for controlling electrolyte flow for uniform plating
Grant 6,964,792 - Mayer , et al. November 15, 2 | 2005-11-15 |
Anode and anode chamber for copper electroplating
Grant 6,821,407 - Reid , et al. November 23, 2 | 2004-11-23 |
Edge bevel removal of copper from silicon wafers
Grant 6,586,342 - Mayer , et al. July 1, 2 | 2003-07-01 |
Methods and apparatus for controlled-angle wafer immersion
Grant 6,551,487 - Reid , et al. April 22, 2 | 2003-04-22 |
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