| Patent | Date |
|---|
Method of forming a metal silicide transparent conductive electrode
Grant 11,195,969 - Gambino , et al. December 7, 2 | 2021-12-07 |
Method of forming a metal silicide transparent conductive electrode
Grant 11,056,610 - Gambino , et al. July 6, 2 | 2021-07-06 |
Method of forming a metal silicide transparent conductive electrode
App 20180358504 - Gambino; Jeffrey P. ; et al. | 2018-12-13 |
Method of forming a metal silicide transparent conductive electrode
Grant 10,147,839 - Gambino , et al. De | 2018-12-04 |
Method of forming a metal silicide transparent conductive electrode
App 20180342642 - Gambino; Jeffrey P. ; et al. | 2018-11-29 |
Electrostatic Substrate Holder With Non-planar Surface And Method Of Etching
App 20170069518 - Cucci; Brett ; et al. | 2017-03-09 |
Wafer frontside-backside through silicon via
Grant 9,455,214 - Maling , et al. September 27, 2 | 2016-09-27 |
Method of eliminating poor reveal of through silicon vias
Grant 9,443,764 - Maling , et al. September 13, 2 | 2016-09-13 |
Integrated circuit and design structure having reduced through silicon via-induced stress
Grant 9,406,562 - Bonn , et al. August 2, 2 | 2016-08-02 |
Integrated circuit and interconnect, and method of fabricating same
Grant 9,390,969 - DeMuynck , et al. July 12, 2 | 2016-07-12 |
Structure with a metal silicide transparent conductive electrode and a method of forming the structure
Grant 9,312,426 - Gambino , et al. April 12, 2 | 2016-04-12 |
Through silicon via wafer, contacts and design structures
Grant 9,245,850 - Gambino , et al. January 26, 2 | 2016-01-26 |
Structure With A Metal Silicide Trasparent Conductive Electrode And A Method Of Forming The Structure
App 20150357512 - Gambino; Jeffrey P. ; et al. | 2015-12-10 |
Wafer Frontside-backside Through Silicon Via
App 20150332966 - MALING; Jeffrey C. ; et al. | 2015-11-19 |
Through silicon via wafer and methods of manufacturing
Grant 9,041,210 - Gambino , et al. May 26, 2 | 2015-05-26 |
Integrated Circuit And Interconnect, And Method Of Fabricating Same
App 20150140809 - DeMuynck; David A. ; et al. | 2015-05-21 |
Eliminating Poor Reveal Of Through Silicon Vias
App 20150101856 - Maling; Jeffrey C. ; et al. | 2015-04-16 |
Through Silicon Via Wafer, Contacts And Design Structures
App 20140284816 - Gambino; Jeffrey P. ; et al. | 2014-09-25 |
Semiconductor device including in wafer inductors, related method and design structure
Grant 8,809,998 - Camillo-Castillo , et al. August 19, 2 | 2014-08-19 |
Through silicon via wafer, contacts and design structures
Grant 8,791,016 - Gambino , et al. July 29, 2 | 2014-07-29 |
Through Silicon Via Wafer, Contacts And Design Structures
App 20140087557 - Gambino; Jeffrey P. ; et al. | 2014-03-27 |
Through Silicon Via Wafer And Methods Of Manufacturing
App 20130334701 - GAMBINO; Jeffrey P. ; et al. | 2013-12-19 |
Structure With A Metal Silicide Transparent Conductive Electrode And A Method Of Forming The Structure
App 20130146335 - Gambino; Jeffrey P. ; et al. | 2013-06-13 |
Semiconductor Device Including In Wafer Inductors, Related Method And Design Structure
App 20130105941 - Vanslette; Daniel S. ; et al. | 2013-05-02 |
Integrated structures of high performance active devices and passive devices
Grant 8,232,139 - Rassel , et al. July 31, 2 | 2012-07-31 |
Integrated Structures Of High Performance Active Devices And Passive Devices
App 20120192139 - RASSEL; Robert M. ; et al. | 2012-07-26 |
Integrated Circuit And Design Structure Having Reduced Through Silicon Via-induced Stress
App 20120181700 - Bonn; Jeffrey P. ; et al. | 2012-07-19 |
Integrated structures of high performance active devices and passive devices
Grant 8,188,591 - Rassel , et al. May 29, 2 | 2012-05-29 |
Integrated Circuit And Interconnect, And Method Of Fabricating Same
App 20120086101 - DeMuynck; David A. ; et al. | 2012-04-12 |
Integrated Structures Of High Performance Active Devices And Passive Devices
App 20120013017 - Rassel; Robert M. ; et al. | 2012-01-19 |
Electromigration resistant aluminum-based metal interconnect structure
Grant 8,084,864 - Chapple-Sokol , et al. December 27, 2 | 2011-12-27 |
Simultaneously formed isolation trench and through-box contact for silicon-on-insulator technology
Grant 8,021,943 - Botula , et al. September 20, 2 | 2011-09-20 |
Electromigration Resistant Aluminum-based Metal Interconnect Structure
App 20110221064 - Chapple-Sokol; Jonathan D. ; et al. | 2011-09-15 |
Electromigration resistant aluminum-based metal interconnect structure
Grant 8,003,536 - Chapple-Sokol , et al. August 23, 2 | 2011-08-23 |
Simultaneously Formed Isolation Trench And Through-box Contact For Silicon-on-insulator Technology
App 20110124177 - Botula; Alan B. ; et al. | 2011-05-26 |
Electromigration Resistant Aluminum-based Metal Interconnect Structure
App 20100237503 - Chapple-Sokol; Jonathan D. ; et al. | 2010-09-23 |
Tungsten Liner For Aluminum-based Electromigration Resistant Interconnect Structure
App 20090230555 - Chapple-Sokol; Jonathan D. ; et al. | 2009-09-17 |
Method of forming refractory metal contact in an opening, and resulting structure
Grant 6,900,505 - Chapple-Sokol , et al. May 31, 2 | 2005-05-31 |
Sputtered tungsten diffusion barrier for improved interconnect robustness
Grant 6,838,364 - Brodsky , et al. January 4, 2 | 2005-01-04 |
Method of forming refractory metal contact in an opening, and resulting structure
Grant 6,762,121 - Chapple-Sokol , et al. July 13, 2 | 2004-07-13 |
Method of forming refractory metal contact in an opening, and resulting structure
App 20030165705 - Chapple-Sokol, Jonathan D. ; et al. | 2003-09-04 |
Version with markings to show changes made
App 20010029096 - Brodsky, Stephen B. ; et al. | 2001-10-11 |
Sputtered tungsten diffusion barrier for improved interconnect robustness
Grant 6,245,668 - Brodsky , et al. June 12, 2 | 2001-06-12 |
| 