loadpatents
Patent applications and USPTO patent grants for Vanfleteren; Jan.The latest application filed is for "electron microscopy grid".
Patent | Date |
---|---|
Method of manufacturing a flat device Grant 11,406,020 - Vanfleteren , et al. August 2, 2 | 2022-08-02 |
Electron Microscopy Grid App 20220157559 - VAN PUTTE; Wouter ;   et al. | 2022-05-19 |
Method For Integrating An Electronic Circuit In Or On A Stent App 20220015930 - Verplancke; Rik ;   et al. | 2022-01-20 |
Method And System For Determining Biomarker Concentration App 20200232968 - VANFLETEREN; Jan ;   et al. | 2020-07-23 |
Method for Manufacturing Shape-Retaining Non-Flat Devices App 20200029440 - Vanfleteren; Jan ;   et al. | 2020-01-23 |
Multiplexed Microfluidic Proteomic Platform App 20170010259 - Amoabediny; Ghassem ;   et al. | 2017-01-12 |
Stretchable electronic device Grant 9,418,927 - Axisa , et al. August 16, 2 | 2016-08-16 |
Stretchable electronic device Grant 9,247,648 - Vanfleteren , et al. January 26, 2 | 2016-01-26 |
Semiconductor package Grant 8,450,825 - Limaye , et al. May 28, 2 | 2013-05-28 |
Composite substrate Grant 8,431,828 - Vanfleteren , et al. April 30, 2 | 2013-04-30 |
Method for manufacturing a stretchable electronic device Grant 8,207,473 - Axisa , et al. June 26, 2 | 2012-06-26 |
Method of fabricating a porous elastomer Grant 8,182,872 - Axisa , et al. May 22, 2 | 2012-05-22 |
Stretchable Electronic Device App 20120051005 - Vanfleteren; Jan ;   et al. | 2012-03-01 |
Stretchable Electronic Device App 20120052268 - Axisa; Fabrice ;   et al. | 2012-03-01 |
Semiconductor Package App 20110037179 - Limaye; Paresh ;   et al. | 2011-02-17 |
Method for embedding dies Grant 7,759,167 - Vanfleteren , et al. July 20, 2 | 2010-07-20 |
Method Of Fabricating A Porous Elastomer App 20100075056 - Axisa; Fabrice ;   et al. | 2010-03-25 |
Method For Manufacturing A Stretchable Electronic Device App 20090317639 - Axisa; Fabrice ;   et al. | 2009-12-24 |
Composite Substrate App 20090107704 - Vanfleteren; Jan ;   et al. | 2009-04-30 |
Methods of producing a composite substrate Grant 7,487,587 - Vanfleteren , et al. February 10, 2 | 2009-02-10 |
Method for embedding dies App 20070134849 - Vanfleteren; Jan ;   et al. | 2007-06-14 |
Methods for embedding conducting material and devices resulting from the methods App 20060231288 - Vanfleteren; Jan ;   et al. | 2006-10-19 |
Method for plating and plating solution therefor App 20050048210 - Siau, Sam ;   et al. | 2005-03-03 |
Flip-chip assembly of semiconductor devices using adhesives Grant 6,555,414 - Vanfleteren , et al. April 29, 2 | 2003-04-29 |
Low cost electroless plating process for single chips and wafer parts and products obtained thereof App 20020001670 - Pauw, Herbert De ;   et al. | 2002-01-03 |
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