Vandentop; Gilroy J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Vandentop; Gilroy J..The latest application filed is for "microelectronic package having direct contact heat spreader and method of manufacturing same".

Company Profile

0.19.18

Vandentop; Gilroy J. - Tempe AZ
Vandentop; Gilroy J. - Aloha OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microelectronic package having direct contact heat spreader and method of manufacturing same Grant 9,508,675 - Lu , et al. November 29, 2	2016-11-29
Microelectronic Package Having Direct Contact Heat Spreader And Method Of Manufacturing Same App 20130344659 - Lu; Daoqiang ; et al.	2013-12-26
Microelectronic package having direct contact heat spreader and method of manufacturing same Grant 8,541,876 - Lu , et al. September 24, 2	2013-09-24
Electrical/optical integration scheme using direct copper bonding Grant 7,826,694 - Vandentop , et al. November 2, 2	2010-11-02
Patterned backside stress engineering for transistor performance optimization Grant 7,821,073 - Vandentop , et al. October 26, 2	2010-10-26
Flip-chip mountable optical connector for chip-to-chip optical interconnectability Grant 7,703,991 - Lu , et al. April 27, 2	2010-04-27
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package Grant 7,569,426 - Myers , et al. August 4, 2	2009-08-04
Patterned Backside Stress Engineering For Transistor Performance Optimization App 20080237729 - Vandentop; Gilroy J. ; et al.	2008-10-02
Patterned backside stress engineering for transistor performance optimization Grant 7,371,630 - Vandentop , et al. May 13, 2	2008-05-13
Integrated Circuit Die/package Interconnect App 20080096323 - Vandentop; Gilroy J. ; et al.	2008-04-24
Electrical/optical integration scheme using direct copper bonding Grant 7,359,591 - Vandentop , et al. April 15, 2	2008-04-15
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package Grant 7,355,277 - Myers , et al. April 8, 2	2008-04-08
Integrated circuit die/package interconnect Grant 7,330,357 - Vandentop , et al. February 12, 2	2008-02-12
Apparatus And Method Integrating An Electro-osmotic Pump And Microchannel Assembly Into A Die Package App 20070190695 - Myers; Alan M. ; et al.	2007-08-16
On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device Grant 7,236,666 - George, legal representative , et al. June 26, 2	2007-06-26
Microelectronic package having direct contact heat spreader and method of manufacturing same App 20070075420 - Lu; Daoqiang ; et al.	2007-04-05
Voltage regulators and systems containing same App 20070013080 - DiBene; Joseph Ted ; et al.	2007-01-18
Flip-chip mountable optical connector for chip-to-chip optical interconnectability App 20060251360 - Lu; Daoqiang ; et al.	2006-11-09
Electro-active fluid cooling system Grant 7,063,268 - Chrysler , et al. June 20, 2	2006-06-20
Patterned backside stress engineering for transistor performance optimization App 20060065935 - Vandentop; Gilroy J. ; et al.	2006-03-30
On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device App 20060067606 - Towle; Steven ; et al.	2006-03-30
Electro-active fluid cooling system App 20050279109 - Chrysler, Gregory M. ; et al.	2005-12-22
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package App 20050139996 - Myers, Alan M. ; et al.	2005-06-30
Integrated circuit die/package interconnect App 20050063164 - Vandentop, Gilroy J. ; et al.	2005-03-24
Circuit package apparatus, systems, and methods App 20040188811 - Vandentop, Gilroy J. ; et al.	2004-09-30
Optical thumbtack Grant 6,792,179 - Lu , et al. September 14, 2	2004-09-14
Optical Thumbtack App 20040126058 - Lu, Daoqiang ; et al.	2004-07-01
Optical assembly App 20040126064 - Vandentop, Gilroy J. ; et al.	2004-07-01
Electronic packages having multiple-zone interconnects and methods of manufacture Grant 6,717,066 - Vandentop , et al. April 6, 2	2004-04-06
Electrical/optical integration scheme using direct copper bonding App 20030113947 - Vandentop, Gilroy J. ; et al.	2003-06-19
Dual-sided heat removal system Grant 6,580,611 - Vandentop , et al. June 17, 2	2003-06-17
Electronic package having multiple-zone interconnects and methods of manufacture App 20030103338 - Vandentop, Gilroy J. ; et al.	2003-06-05
Highly selective etch process for submicron contacts Grant 6,001,699 - Nguyen , et al. December 14, 1	1999-12-14
Method for etching silicon oxide films in a reactive ion etch system to prevent gate oxide damage Grant 5,549,784 - Carmody , et al. August 27, 1	1996-08-27

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