loadpatents
name:-0.019845962524414
name:-0.014285802841187
name:-0.00041389465332031
Vandamme; Roland R. Patent Filings

Vandamme; Roland R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Vandamme; Roland R..The latest application filed is for "methods for post-epitaxial warp prediction and control".

Company Profile
0.14.23
  • Vandamme; Roland R. - Wentzville MO
  • Vandamme; Roland R. - St. Peters MO
  • Vandamme; Roland R. - St. Charles MO
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Methods for post-epitaxial warp prediction and control
Grant 9,601,395 - Bhagavat , et al. March 21, 2
2017-03-21
Methods For Post-epitaxial Warp Prediction And Control
App 20150371909 - Bhagavat; Sumeet S. ;   et al.
2015-12-24
Methods for mounting an ingot on a wire saw
Grant 9,156,187 - Bhagavat , et al. October 13, 2
2015-10-13
Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder
Grant 8,712,575 - Bhagavat , et al. April 29, 2
2014-04-29
Methods and Systems For Removing Contaminants From A Wire Of A Saw
App 20130206163 - Zavattari; Carlo ;   et al.
2013-08-15
Methods For Mounting An Ingot On A Wire Saw
App 20130174829 - Bhagavat; Sumeet S. ;   et al.
2013-07-11
Systems and Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw
App 20130174828 - Zavattari; Carlo ;   et al.
2013-07-11
Methods For Controlling Displacement Of Bearings In A Wire Saw
App 20130139801 - Zavattari; Carlo ;   et al.
2013-06-06
Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw
App 20130139800 - Zavattari; Carlo ;   et al.
2013-06-06
Systems For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw
App 20130144420 - Zavattari; Carlo ;   et al.
2013-06-06
Systems For Controlling Temperature Of Bearings In A Wire Saw
App 20130144421 - Zavattari; Carlo ;   et al.
2013-06-06
Semiconductor and solar wafers
Grant 8,310,031 - Zhang , et al. November 13, 2
2012-11-13
Methods for etching the edge of a silicon wafer
Grant 8,309,464 - Erk , et al. November 13, 2
2012-11-13
Methods of grinding semiconductor wafers having improved nanotopology
Grant 8,267,745 - Bhagavat , et al. September 18, 2
2012-09-18
Edge etched silicon wafers
Grant 8,192,822 - Erk , et al. June 5, 2
2012-06-05
Methods and systems for adjusting operation of a wafer grinder using feedback from warp data
Grant 8,145,342 - Bhagavat , et al. March 27, 2
2012-03-27
Semiconductor And Solar Wafers And Method For Processing Same
App 20120028439 - Zhang; Guoqiang David ;   et al.
2012-02-02
Hydrostatic Pad Pressure Modulation in a Simultaneous Double Side Wafer Grinder
App 20110237160 - Bhagavat; Sumeet S. ;   et al.
2011-09-29
Methods of Grinding Semiconductor Wafers Having Improved Nanotopology
App 20110101504 - Bhagavat; Milind S. ;   et al.
2011-05-05
Nanotopography control and optimization using feedback from warp data
Grant 7,930,058 - Bhagavat , et al. April 19, 2
2011-04-19
Method for assessing workpiece nanotopology using a double side wafer grinder
Grant 7,927,185 - Vandamme , et al. April 19, 2
2011-04-19
Methods and Systems For Adjusting Operation Of A Wafer Grinder Using Feedback from Warp Data
App 20110045740 - Bhagavat; Sumeet S. ;   et al.
2011-02-24
Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control
Grant 7,878,883 - Gupta , et al. February 1, 2
2011-02-01
Method For Assessing Workpiece Nanotopology Using A Double Side Wafer Grinder
App 20100087123 - Vandamme; Roland R. ;   et al.
2010-04-08
Double side wafer grinder and methods for assessing workpiece nanotopology
Grant 7,601,049 - Bhagavat , et al. October 13, 2
2009-10-13
Methods For Etching The Edge Of A Silicon Wafer
App 20090247055 - Erk; Henry F. ;   et al.
2009-10-01
Edge Etched Silicon Wafers
App 20090246444 - Erk; Henry F. ;   et al.
2009-10-01
Nanotopography Control And Optimization Using Feedback From Warp Data
App 20080166948 - Bhagavat; Sumeet S. ;   et al.
2008-07-10
Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control
App 20070178807 - Gupta; Puneet ;   et al.
2007-08-02
Double side wafer grinder and methods for assessing workpiece nanotopology
App 20070179660 - Bhagavat; Sumeet S. ;   et al.
2007-08-02
Process and apparatus for etching semiconductor wafers
Grant 5,340,437 - Erk , et al. August 23, 1
1994-08-23

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