Van Tooren; Michael Johannes Leonardus
Patent Applications and Registrations
Patent applications and USPTO patent grants for Van Tooren; Michael Johannes Leonardus.The latest application filed is for "3d printed continuous fiber reinforced part".
- Van Tooren; Michael Johannes Leonardus - Elgin SC
- van Tooren; Michael Johannes Leonardus - Columbia SC
- Van Tooren; Michael Johannes Leonardus - Delft N/A NL
| Patent | Date |
|---|---|
| Composite continuous filament for additive manufacturing Grant 11,192,297 - Van Tooren , et al. December 7, 2 | 2021-12-07 |
| 3D printed continuous fiber reinforced part Grant 11,117,362 - van Tooren , et al. September 14, 2 | 2021-09-14 |
| Integrated robotic 3D printing system for printing of fiber reinforced parts Grant 10,814,607 - van Tooren , et al. October 27, 2 | 2020-10-27 |
| 3d Printed Continuous Fiber Reinforced Part App 20180356118 - van Tooren; Michael Johannes Leonardus ; et al. | 2018-12-13 |
| Printable Susceptor For Use In Induction Welding App 20180063895 - Van Tooren; Michael Johannes Leonardus ; et al. | 2018-03-01 |
| Composite Continuous Filament for Additive Manufacturing App 20170341301 - Van Tooren; Michael Johannes Leonardus ; et al. | 2017-11-30 |
| Integrated Robotic 3d Printing System For Printing Of Fiber Reinforced Parts App 20170057167 - van Tooren; Michael Johannes Leonardus ; et al. | 2017-03-02 |
| Method for bonding a thermoplastic polymer to a thermosetting polymer component Grant 9,211,674 - Van Tooren December 15, 2 | 2015-12-15 |
| Method For Bonding A Thermoplastic Polymer To A Thermosetting Polymer Component App 20140220356 - Van Tooren; Michael Johannes Leonardus | 2014-08-07 |
| Method for the production of a laminate and bent product consisting of laminate Grant 6,875,501 - Labordus , et al. April 5, 2 | 2005-04-05 |
| Laminate with butt-welded metal layers App 20040151921 - Labordus, Maarten ; et al. | 2004-08-05 |
| Method for the production of a laminate and bent product consisting of laminate App 20040053027 - Labordus, Maarten ; et al. | 2004-03-18 |
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