VAN SCHRAVENDIJK; Bart

Patent Applications and Registrations

Patent applications and USPTO patent grants for VAN SCHRAVENDIJK; Bart.The latest application filed is for "dielectric gapfill using atomic layer deposition (ald), inhibitor plasma and etching".

Company Profile

4.84.49

VAN SCHRAVENDIJK; Bart - Palo Alto CA
van Schravendijk; Bart - Cupertino CA
van Schravendijk; Bart - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Dielectric Gapfill Using Atomic Layer Deposition (ald), Inhibitor Plasma And Etching App 20220205096 - ABEL; Joseph ; et al.	2022-06-30
Dielectric gapfill using atomic layer deposition (ALD), inhibitor plasma and etching Grant 11,293,098 - Abel , et al. April 5, 2	2022-04-05
Dielectric Gapfill Using Atomic Layer Deposition (ald), Inhibitor Plasma And Etching App 20200017967 - ABEL; Joseph ; et al.	2020-01-16
Semiconductor substrate processing apparatus including uniformity baffles Grant 10,351,955 - Keshavamurthy , et al. July 16, 2	2019-07-16
Systems and methods for creating airgap seals using atomic layer deposition and high density plasma chemical vapor deposition Grant 10,224,235 - Park , et al.	2019-03-05
Ultra-high vacuum transport and storage Grant 10,153,282 - Panagopoulos , et al. Dec	2018-12-11
Plasma activated conformal dielectric film deposition Grant 10,043,655 - Swaminathan , et al. August 7, 2	2018-08-07
UV and reducing treatment for K recovery and surface clean in semiconductor processing Grant 10,037,905 - Varadarajan , et al. July 31, 2	2018-07-31
Inhibitor plasma mediated atomic layer deposition for seamless feature fill Grant 9,966,299 - Tang , et al. May 8, 2	2018-05-08
Method of densifying films in semiconductor device Grant 9,786,496 - van Schravendijk , et al. October 10, 2	2017-10-10
Densification of dielectric film using inductively coupled high density plasma Grant 9,741,584 - Park , et al. August 22, 2	2017-08-22
Systems And Methods For Creating Airgap Seals Using Atomic Layer Deposition And High Density Plasma Chemical Vapor Deposition App 20170229337 - Park; Jason Daejin ; et al.	2017-08-10
Method for depositing a chlorine-free conformal SiN film Grant 9,670,579 - Hausmann , et al. June 6, 2	2017-06-06
Plasma Activated Conformal Dielectric Film Deposition App 20170148628 - Swaminathan; Shankar ; et al.	2017-05-25
Method Of Densifying Films In Semiconductor Device App 20170053799 - van Schravendijk; Bart ; et al.	2017-02-23
Plasma activated conformal dielectric film deposition Grant 9,570,274 - Swaminathan , et al. February 14, 2	2017-02-14
Air gap spacer integration for improved fin device performance Grant 9,515,156 - Besser , et al. December 6, 2	2016-12-06
Inhibitor Plasma Mediated Atomic Layer Deposition For Seamless Feature Fill App 20160329238 - Tang; Wei ; et al.	2016-11-10
Dual plenum, axi-symmetric showerhead with edge-to-center gas delivery Grant 9,447,499 - Roy , et al. September 20, 2	2016-09-20
Inhibitor plasma mediated atomic layer deposition for seamless feature fill Grant 9,425,078 - Tang , et al. August 23, 2	2016-08-23
Systems and methods for eliminating seams in atomic layer deposition of silicon dioxide film in gap fill applications Grant 9,406,544 - Tang , et al. August 2, 2	2016-08-02
Method for forming a mask by etching conformal film on patterned ashable hardmask Grant 9,362,133 - Shamma , et al. June 7, 2	2016-06-07
Conformal film deposition for gapfill Grant 9,355,886 - Swaminathan , et al. May 31, 2	2016-05-31
Air Gap Spacer Integration For Improved Fin Device Performance App 20160111515 - Besser; Paul Raymond ; et al.	2016-04-21
Flowable oxide film with tunable wet etch rate Grant 9,299,559 - Draeger , et al. March 29, 2	2016-03-29
CVD flowable gap fill Grant 9,257,302 - Wang , et al. February 9, 2	2016-02-09
Systems and methods for at least partially converting films to silicon oxide and/or improving film quality using ultraviolet curing in steam and densification of films using UV curing in ammonia Grant 9,147,589 - Varadarajan , et al. September 29, 2	2015-09-29
Method For Depositing A Chlorine-free Conformal Sin Film App 20150259791 - Hausmann; Dennis ; et al.	2015-09-17
Inhibitor Plasma Mediated Atomic Layer Deposition For Seamless Feature Fill App 20150243545 - Tang; Wei ; et al.	2015-08-27
Plasma Activated Conformal Dielectric Film Deposition App 20150206719 - Swaminathan; Shankar ; et al.	2015-07-23
Method for depositing a chlorine-free conformal sin film Grant 9,070,555 - Hausmann , et al. June 30, 2	2015-06-30
Semiconductor Substrate Processing Apparatus Including Uniformity Baffles App 20150167168 - Keshavamurthy; Arun ; et al.	2015-06-18
In-situ deposition of film stacks Grant 9,028,924 - Haverkamp , et al. May 12, 2	2015-05-12
Atomic Layer Removal Process With Higher Etch Amount App 20150118848 - Draeger; Nerissa ; et al.	2015-04-30
Conformal doping via plasma activated atomic layer deposition and conformal film deposition Grant 8,956,983 - Swaminathan , et al. February 17, 2	2015-02-17
Flowable Oxide Film With Tunable Wet Etch Rate App 20150044882 - Draeger; Nerissa ; et al.	2015-02-12
Methods And Apparatus For Dielectric Deposition App 20140302689 - Ashtiani; Kaihan ; et al.	2014-10-09
Flowable oxide film with tunable wet etch rate Grant 8,846,536 - Draeger , et al. September 30, 2	2014-09-30
Hardmask materials Grant 8,846,525 - Rangarajan , et al. September 30, 2	2014-09-30
Image Reversal With Ahm Gap Fill For Multiple Patterning App 20140170853 - Shamma; Nader ; et al.	2014-06-19
In-situ deposition of film stacks Grant 8,741,394 - Haverkamp , et al. June 3, 2	2014-06-03
Method For Depositing A Chlorine-free Conformal Sin Film App 20140141626 - Hausmann; Dennis ; et al.	2014-05-22
Gap fill integration Grant 8,728,958 - Ashtiani , et al. May 20, 2	2014-05-20
Conformal Film Deposition For Gapfill App 20140134827 - Swaminathan; Shankar ; et al.	2014-05-15
Smooth silicon-containing films Grant 8,709,551 - Fox , et al. April 29, 2	2014-04-29
Premetal dielectric integration process Grant 8,685,867 - Danek , et al. April 1, 2	2014-04-01
Defect Reduction In Plasma Processing App 20140049162 - Thomas; George ; et al.	2014-02-20
Systems And Methods For At Least Partially Converting Films To Silicon Oxide And/or Improving Film Quality Using Ultraviolet Curing In Steam And Densification Of Films Using Uv Curing In Ammonia App 20140020259 - Varadarajan; Bhadri N. ; et al.	2014-01-23
Dual Plenum, Axi-symmetric Showerhead With Edge-to-center Gas Delivery App 20130341433 - Roy; Shambhu N. ; et al.	2013-12-26
Hardmask Materials App 20130330932 - Rangarajan; Vishwanathan ; et al.	2013-12-12
Method for depositing a chlorine-free conformal sin film Grant 8,592,328 - Hausmann , et al. November 26, 2	2013-11-26
PECVD flowable dielectric gap fill Grant 8,557,712 - Antonelli , et al. October 15, 2	2013-10-15
Hardmask materials Grant 8,536,073 - Rangarajan , et al. September 17, 2	2013-09-17
Systems and methods for at least partially converting films to silicon oxide and/or improving film quality using ultraviolet curing in steam and densification of films using UV curing in ammonia Grant 8,528,224 - Varadarajan , et al. September 10, 2	2013-09-10
Flowable Oxide Film With Tunable Wet Etch Rate App 20130230987 - Draeger; Nerissa ; et al.	2013-09-05
Method For Depositing A Chlorine-free Conformal Sin Film App 20130189854 - Hausmann; Dennis ; et al.	2013-07-25
In-situ Deposition Of Film Stacks App 20130171834 - Haverkamp; Jason ; et al.	2013-07-04
Carbon containing low-k dielectric constant recovery using UV treatment Grant 8,465,991 - Varadarajan , et al. June 18, 2	2013-06-18
Protective self-aligned buffer layers for damascene interconnects Grant 8,430,992 - Chattopadhyay , et al. April 30, 2	2013-04-30
Conformal Doping Via Plasma Activated Atomic Layer Deposition And Conformal Film Deposition App 20130040447 - Swaminathan; Shankar ; et al.	2013-02-14
Protective self-aligned buffer layers for damascene interconnects Grant 8,317,923 - Chattopadhyay , et al. November 27, 2	2012-11-27
Hardmask Materials App 20120276752 - RANGARAJAN; Vishwanathan ; et al.	2012-11-01
Multistep method of depositing metal seed layers Grant 8,298,936 - Rozbicki , et al. October 30, 2	2012-10-30
Interfacial capping layers for interconnects Grant 8,268,722 - Yu , et al. September 18, 2	2012-09-18
Hardmask materials Grant 8,247,332 - Rangarajan , et al. August 21, 2	2012-08-21
UV treatment of etch stop and hard mask films for selectivity and hermeticity enhancement Grant 8,242,028 - van Schravendijk , et al. August 14, 2	2012-08-14
Remote plasma processing of interface surfaces Grant 8,217,513 - Antonelli , et al. July 10, 2	2012-07-10
Bottom Up Fill In High Aspect Ratio Trenches App 20120149213 - Nittala; Lakshminarayana ; et al.	2012-06-14
Pecvd Deposition Of Smooth Polysilicon Films App 20120142172 - FOX; Keith ; et al.	2012-06-07
Hardmask materials Grant 8,178,443 - Rangarajan , et al. May 15, 2	2012-05-15
Methods for reducing UV and dielectric diffusion barrier interaction Grant 8,173,537 - Chattopadhyay , et al. May 8, 2	2012-05-08
Protective layer to enable damage free gap fill Grant 8,133,797 - van Schravendijk , et al. March 13, 2	2012-03-13
Reducing UV and dielectric diffusion barrier interaction through the modulation of optical properties Grant 8,124,522 - Wu , et al. February 28, 2	2012-02-28
Remote plasma processing of interface surfaces Grant 8,084,339 - Antonelli , et al. December 27, 2	2011-12-27
Atomic layer removal process with higher etch amount Grant 8,058,179 - Draeger , et al. November 15, 2	2011-11-15
Protection of Cu damascene interconnects by formation of a self-aligned buffer layer Grant 8,030,777 - van Schravendijk , et al. October 4, 2	2011-10-04
In-Situ Deposition of Film Stacks App 20110236594 - Haverkamp; Jason ; et al.	2011-09-29
Smooth Silicon-Containing Films App 20110236600 - Fox; Keith ; et al.	2011-09-29
Methods of forming moisture barrier for low K film integration with anti-reflective layers Grant 8,003,549 - Li , et al. August 23, 2	2011-08-23
Atomic layer removal for high aspect ratio gapfill Grant 7,981,763 - van Schravendijk , et al. July 19, 2	2011-07-19
Novel Gap Fill Integration App 20110151678 - Ashtiani; Kaihan ; et al.	2011-06-23
Hardmask Materials App 20110133313 - Rangarajan; Vishwanathan ; et al.	2011-06-09
Hardmask Materials App 20110135557 - Rangarajan; Vishwanathan ; et al.	2011-06-09
Remote Plasma Processing Of Interface Surfaces App 20110120377 - Antonelli; George Andrew ; et al.	2011-05-26
Carbon Containing Low-k Dielectric Constant Recovery Using Uv Treatment App 20110117678 - Varadarajan; Bhadri N. ; et al.	2011-05-19
Uv And Reducing Treatment For K Recovery And Surface Clean In Semiconductor Processing App 20110111533 - Varadarajan; Bhadri ; et al.	2011-05-12
Uv Treatment For Carbon-containing Low-k Dielectric Repair In Semiconductor Processing App 20110045610 - van Schravendijk; Bart ; et al.	2011-02-24
Interfacial layers for electromigration resistance improvement in damascene interconnects Grant 7,858,510 - Banerji , et al. December 28, 2	2010-12-28
Remote Plasma Processing Of Interface Surfaces App 20100317198 - Antonelli; George Andrew ; et al.	2010-12-16
UV treatment for carbon-containing low-k dielectric repair in semiconductor processing Grant 7,851,232 - van Schravendijk , et al. December 14, 2	2010-12-14
Interfacial Capping Layers For Interconnects App 20100308463 - Yu; Jengyi ; et al.	2010-12-09
Apparatus For Uv Damage Repair Of Low K Films Prior To Copper Barrier Deposition App 20100267231 - van Schravendijk; Bart ; et al.	2010-10-21
Uv Treatment For Carbon-containing Low-k Dielectric Repair In Semiconductor Processing App 20100261349 - van Schravendijk; Bart ; et al.	2010-10-14
Interfacial layers for electromigration resistance improvement in damascene interconnects Grant 7,799,671 - Banerji , et al. September 21, 2	2010-09-21
Protective self-aligned buffer layers for damascene interconnects Grant 7,727,880 - Chattopadhyay , et al. June 1, 2	2010-06-01
Protective self-aligned buffer layers for damascene interconnects Grant 7,727,881 - Chattopadhyay , et al. June 1, 2	2010-06-01
Method of improving adhesion between two dielectric films Grant 7,705,431 - Sanganeria , et al. April 27, 2	2010-04-27
Method For Improving Process Control And Film Conformality Of Pecvd Film App 20100099271 - Hausmann; Dennis ; et al.	2010-04-22
Multistep method of depositing metal seed layers Grant 7,682,966 - Rozbicki , et al. March 23, 2	2010-03-23
Interfacial layers for electromigration resistance improvement in damascene interconnects Grant 7,648,899 - Banerji , et al. January 19, 2	2010-01-19
Methods of forming moisture barrier for low k film integration with anti-reflective layers Grant 7,642,202 - Li , et al. January 5, 2	2010-01-05
Method of improving adhesion between two dielectric films Grant 7,622,380 - Sanganeria , et al. November 24, 2	2009-11-24
UV treatment of STI films for increasing tensile stress Grant 7,622,162 - van Schravendijk , et al. November 24, 2	2009-11-24
Protective Layer To Enable Damage Free Gap Fill App 20090286381 - van Schravendijk; Bart ; et al.	2009-11-19
Protection of Cu damascene interconnects by formation of a self-aligned buffer layer Grant 7,396,759 - van Schravendijk , et al. July 8, 2	2008-07-08
Gap fill for high aspect ratio structures Grant 7,067,440 - Bayman , et al. June 27, 2	2006-06-27
Applications and methods of making nitrogen-free anti-reflective layers for semiconductor processing Grant 7,052,988 - van Schravendijk , et al. May 30, 2	2006-05-30
Method of improving adhesion between two dielectric films Grant 6,972,252 - Sanganeria , et al. December 6, 2	2005-12-06
Process for depositing F-doped silica glass in high aspect ratio structures Grant 6,846,391 - Papasouliotis , et al. January 25, 2	2005-01-25
Applications and methods of making nitrogen-free anti-reflective layers for semiconductor processing Grant 6,720,251 - van Schravendijk , et al. April 13, 2	2004-04-13
Gap fill for high aspect ratio structures Grant 6,596,654 - Bayman , et al. July 22, 2	2003-07-22
Very high aspect ratio gapfill using HDP Grant 6,395,150 - Van Cleemput , et al. May 28, 2	2002-05-28