loadpatents
name:-0.01146411895752
name:-0.018516063690186
name:-0.015788793563843
Van Meer; Johannes Patent Filings

Van Meer; Johannes

Patent Applications and Registrations

Patent applications and USPTO patent grants for Van Meer; Johannes.The latest application filed is for "fin damage reduction during punch through implantation of finfet device".

Company Profile
13.16.10
  • Van Meer; Johannes - Middleton MA
  • van Meer; Johannes - Newburgh NY US
  • van Meer; Johannes - Fishkill NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Replacement gate formation with angled etch and deposition
Grant 11,217,491 - Sung , et al. January 4, 2
2022-01-04
Structure and method of forming fin device having improved fin liner
Grant 10,971,403 - Sung , et al. April 6, 2
2021-04-06
Method of forming transistor device having fin cut regions
Grant 10,720,357 - Sung , et al.
2020-07-21
Fin damage reduction during punch through implantation of FinFET device
Grant 10,692,775 - Sung , et al.
2020-06-23
Fin damage reduction during punch through implantation of FinFET device
Grant 10,686,033 - Sung , et al.
2020-06-16
Method and device for power rail in a fin type field effect transistor
Grant 10,685,865 - Sung , et al.
2020-06-16
Fin Damage Reduction During Punch Through Implantation Of Finfet Device
App 20200152519 - Sung; Min Gyu ;   et al.
2020-05-14
Fin Damage Reduction During Punch Through Implantation Of Finfet Device
App 20200152735 - Sung; Min Gyu ;   et al.
2020-05-14
Structure And Method Of Forming Fin Device Having Improved Fin Liner
App 20200135573 - Sung; Min Gyu ;   et al.
2020-04-30
Method And Device For Shallow Trench Isolation In A Fin Type Field Effect Transistors
App 20200135928 - Sung; Min Gyu ;   et al.
2020-04-30
Method and device for shallow trench isolation in a fin type field effect transistors
Grant 10,629,741 - Sung , et al.
2020-04-21
Techniques for forming device having etch-resistant isolation oxide
Grant 10,510,870 - Sung , et al. Dec
2019-12-17
Structure and method of forming fin device having improved fin liner
Grant 10,510,610 - Sung , et al. Dec
2019-12-17
Replacement Gate Formation With Angled Etch And Deposition
App 20190341315 - Sung; Min Gyu ;   et al.
2019-11-07
Structure And Method Of Forming Fin Device Having Improved Fin Liner
App 20190304841 - Sung; Min Gyu ;   et al.
2019-10-03
Method Of Forming Transistor Device Having Fin Cut Regions
App 20190273011 - Sung; Min Gyu ;   et al.
2019-09-05
Replacement gate formation with angled etch and deposition
Grant 10,403,552 - Sung , et al. Sep
2019-09-03
Structure And Method Of Forming Device Having Improved Isolation Oxide
App 20190259859 - Sung; Min Gyu ;   et al.
2019-08-22
CMOS circuit having a tensile stress layer overlying an NMOS transistor and overlapping a portion of compressive stress layer
Grant 9,373,548 - Pei , et al. June 21, 2
2016-06-21
Methods of forming multiple N-type semiconductor devices with different threshold voltages on a semiconductor substrate
Grant 8,846,476 - Liu , et al. September 30, 2
2014-09-30
Methods Of Forming Multiple N-type Semiconductor Devices With Different Threshold Voltages On A Semiconductor Substrate
App 20140227845 - Liu; Yanxiang ;   et al.
2014-08-14
Raised source and drain process with disposable spacers
Grant 7,745,296 - van Meer , et al. June 29, 2
2010-06-29
Stress Enhanced Cmos Circuits
App 20090008718 - PEI; Gen ;   et al.
2009-01-08
Stress enhanced CMOS circuits and methods for their fabrication
Grant 7,442,601 - Pei , et al. October 28, 2
2008-10-28
Method for fabricating a semiconductor device
Grant 7,329,599 - Wirbeleit , et al. February 12, 2
2008-02-12

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