van Gemert; Leonardus Antonius Elisabeth
Patent Applications and Registrations
Patent applications and USPTO patent grants for van Gemert; Leonardus Antonius Elisabeth.The latest application filed is for "shielded qfn package and method of making".
- van Gemert; Leonardus Antonius Elisabeth - Nijmegen NL
- van Gemert; Leonardus Antonius Elisabeth - NIijmegen NL
| Patent | Date |
|---|---|
| Reduction of defects in wafer level chip scale package (WLCSP) devices Grant 10,177,111 - Kamphuis , et al. J | 2019-01-08 |
| Shielded QFN package and method of making Grant 10,096,555 - Gulpen , et al. October 9, 2 | 2018-10-09 |
| Heatsink very-thin quad flat no-leads (HVQFN) package Grant 9,953,903 - van Gemert , et al. April 24, 2 | 2018-04-24 |
| Shielded Qfn Package And Method Of Making App 20170213797 - Gulpen; Jan ; et al. | 2017-07-27 |
| Reduction of defects in wafer level chip scale package (WLCSP) devices Grant 9,704,823 - Kamphuis , et al. July 11, 2 | 2017-07-11 |
| Reduction Of Defects In Wafer Level Chip Scale Package (wlcsp) Devices App 20170179076 - Kamphuis; Tonny ; et al. | 2017-06-22 |
| Shielded QFN package and method of making Grant 9,653,414 - Gulpen , et al. May 16, 2 | 2017-05-16 |
| Ultrathin Routable Quad Flat No-leads (qfn) Package App 20170103939 - Gulpen; Jan ; et al. | 2017-04-13 |
| Heatsink Very-thin Quad Flat No-leads (hvqfn) Package App 20170025334 - van Gemert; Leonardus Antonius Elisabeth ; et al. | 2017-01-26 |
| Shielded Qfn Package And Method Of Making App 20170025369 - Gulpen; Jan ; et al. | 2017-01-26 |
| Reducing defects in wafer level chip scale package (WLCSP) devices Grant 9,466,585 - Kamphuis , et al. October 11, 2 | 2016-10-11 |
| Reducing Defects In Wafer Level Chip Scale Package (wlcsp) Devices App 20160276306 - Kamphuis; Tonny ; et al. | 2016-09-22 |
| Reduction Of Defects In Wafer Level Chip Scale Package (wlcsp) Devices App 20160276176 - Kamphuis; Tonny ; et al. | 2016-09-22 |
| Die interconnect Grant 9,385,099 - van Gemert , et al. July 5, 2 | 2016-07-05 |
| Exposed die clip bond power package Grant 9,263,299 - van Gemert , et al. February 16, 2 | 2016-02-16 |
| Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP) Grant 9,245,804 - Zenz , et al. January 26, 2 | 2016-01-26 |
| Exposed-Heatsink Quad Flat No-Leads (QFN) Package App 20160005680 - Israel; Emil Casey ; et al. | 2016-01-07 |
| Flexible Wafer-level Chip-scale Packages With Improved Board-level Reliability App 20160005653 - Beelen-Hendrikx; Caroline Catharina Maria ; et al. | 2016-01-07 |
| Exposed Die Clip Bond Power Package App 20160005626 - van Gemert; Leonardus Antonius Elisabeth ; et al. | 2016-01-07 |
| Exposed Die Quad Flat No-leads (qfn) Package App 20160005679 - Israel; Emil Casey ; et al. | 2016-01-07 |
| Protection of a wafer-level chip scale package (WLCSP) Grant 9,196,537 - Van Gemert , et al. November 24, 2 | 2015-11-24 |
| Die Interconnect App 20150279803 - van Gemert; Leonardus Antonius Elisabeth ; et al. | 2015-10-01 |
| Encapsulated Wafer-level Chip Scale (wlscp) Pedestal Packaging App 20150162306 - VAN GEMERT; Leonardus Antonius Elisabeth ; et al. | 2015-06-11 |
| Encapsulated wafer-level chip scale (WLSCP) pedestal packaging Grant 8,987,057 - Van Gemert , et al. March 24, 2 | 2015-03-24 |
| Integrated Circuit And Method Of Manufacturing The Same App 20150069587 - Kamphuis; Tonny ; et al. | 2015-03-12 |
| Integrated circuit and method of manufacturing the same Grant 8,895,357 - Kamphuis , et al. November 25, 2 | 2014-11-25 |
| Protection Of A Wafer-level Chip Scale Package (wlcsp) App 20140138855 - VAN GEMERT; Leonardus Antonius Elisabeth ; et al. | 2014-05-22 |
| Using A Double-cut For Mechanical Protection Of A Wafer-level Chip Scale Package (wlcsp) App 20140110842 - ZENZ; Christian ; et al. | 2014-04-24 |
| Encapsulated Wafer-level Chip Scale (wlscp) Pedestal Packaging App 20140091458 - VAN GEMERT; Leonardus Antonius Elisabeth ; et al. | 2014-04-03 |
| Integrated Circuit And Method Of Manufacturing The Same App 20130264691 - Kamphuis; Tonny ; et al. | 2013-10-10 |
| Camera module, holder for use in a camera module, camera system and method of manufacturing a camera module App 20050237419 - Van Gemert, Leonardus Antonius Elisabeth | 2005-10-27 |
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