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name:-0.004525899887085
name:-0.00724196434021
name:-0.0015661716461182
Van Eperen; David J. Patent Filings

Van Eperen; David J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Van Eperen; David J..The latest application filed is for "apparatus for mechanically bonding and cutting an article".

Company Profile
0.5.2
  • Van Eperen; David J. - Appleton WI
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Paper with a pattern
Grant D668,056 - Penfield , et al. October 2, 2
2012-10-02
Apparatus for mechanically bonding and cutting an article
Grant 7,341,084 - Van Eperen March 11, 2
2008-03-11
Apparatus For Mechanically Bonding And Cutting An Article
App 20070144678 - Van Eperen; David J.
2007-06-28
Apparatus and method for mechanically bonding and cutting an article
Grant 7,204,899 - Van Eperen April 17, 2
2007-04-17
Apparatus and method for mechanically bonding and cutting an article
App 20040216830 - Van Eperen, David J.
2004-11-04
Apparatus and method for depositing particulate material in a composite substrate
Grant 5,429,788 - Ribble , et al. July 4, 1
1995-07-04
Method and apparatus for applying a curved elastic to a moving web
Grant 5,275,676 - Rooyakkers , et al. January 4, 1
1994-01-04

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