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Patent applications and USPTO patent grants for Van Der Zanden; Josephus.The latest application filed is for "guard bond wires in an integrated circuit package".
Patent | Date |
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Guard bond wires in an integrated circuit package Grant 10,553,543 - Cuoco , et al. Fe | 2020-02-04 |
Guard Bond Wires In An Integrated Circuit Package App 20190006286 - CUOCO; Vittorio ;   et al. | 2019-01-03 |
Impedance matching configuration Grant 9,941,227 - Zhu , et al. April 10, 2 | 2018-04-10 |
Packaged RF power transistor device having next to each other a ground and a video lead for connecting a decoupling capacitor, RF power amplifier Grant 9,820,401 - Zhu , et al. November 14, 2 | 2017-11-14 |
Amplifier structure Grant 9,621,109 - Zhu , et al. April 11, 2 | 2017-04-11 |
Impedance matching configuration App 20160351513 - Zhu; Yi ;   et al. | 2016-12-01 |
RF power device Grant 9,413,308 - van der Zanden , et al. August 9, 2 | 2016-08-09 |
Integrated circuit arrangement Grant 9,209,118 - Cuoco , et al. December 8, 2 | 2015-12-08 |
Integrated Circuit Arrangement App 20150270198 - Cuoco; Vittorio ;   et al. | 2015-09-24 |
Amplifier Structure App 20150256130 - Zhu; Yi ;   et al. | 2015-09-10 |
Packaged Rf Power Transistor Device Having Next To Each Other A Ground And A Video Lead For Connecting A Decoupling Capacitor, Rf Power Amplifier App 20150156910 - Zhu; Yi ;   et al. | 2015-06-04 |
Rf Power Device App 20150028955 - van der Zanden; Josephus ;   et al. | 2015-01-29 |
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