| Patent | Date |
|---|
Process For Producing A High-frequency-compatible Electronic Module
App 20210335755 - VAL; Christian | 2021-10-28 |
Process For Metallizing Holes Of An Electronic Module By Liquid-phase Deposition
App 20210040620 - VAL; Christian | 2021-02-11 |
Process for the wafer-scale fabrication of hermetic electronic modules
Grant 10,483,180 - Val , et al. Nov | 2019-11-19 |
Method of miniaturized chip on chip interconnection of a 3D electronic module
Grant 10,332,863 - Val | 2019-06-25 |
Method Of Miniaturized Chip On Chip Interconnection Of A 3d Electronic Module
App 20190103380 - VAL; Christian | 2019-04-04 |
3D electronic module comprising a ball grid array stack
Grant 10,064,278 - Val August 28, 2 | 2018-08-28 |
Process For The Wafer-scale Fabrication Of Hermetic Electronic Modules
App 20180182683 - VAL; Christian ; et al. | 2018-06-28 |
Electronic Chip Device With Improved Thermal Resistance And Associated Manufacturing Process
App 20180061731 - VAL; Christian | 2018-03-01 |
Method of collective fabrication of 3D electronic modules configured to operate at more than 1 GHz
Grant 9,899,250 - Val February 20, 2 | 2018-02-20 |
Method Of Collective Fabrication Of 3d Electronic Modules Configured To Operate At More Than 1 Ghz
App 20170372935 - VAL; Christian | 2017-12-28 |
3d Electronic Module Comprising A Ball Grid Array Stack
App 20160381799 - VAL; Christian | 2016-12-29 |
Method for producing reconstituted wafers with support of the chips during their encapsulation
Grant 9,111,688 - Val August 18, 2 | 2015-08-18 |
Method For Producing Reconstituted Wafers With Support Of The Chips During Their Encapsulation
App 20140349008 - Val; Christian | 2014-11-27 |
Method for positioning chips during the production of a reconstituted wafer
Grant 8,735,220 - Val May 27, 2 | 2014-05-27 |
Method for collective fabrication of 3D electronic modules comprising only validated PCBs
Grant 8,716,036 - Val May 6, 2 | 2014-05-06 |
Process for the vertical interconnection of 3D electronic modules by vias
Grant 8,567,051 - Val October 29, 2 | 2013-10-29 |
Method for positioning chips during the production of a reconstituted wafer
Grant 8,546,190 - Val October 1, 2 | 2013-10-01 |
Method for Collective Fabrication of 3D Electronic Modules Comprising Only Validated PCBs
App 20130171752 - VAL; Christian | 2013-07-04 |
Process for the wafer-scale fabrication of electronic modules for surface mounting
Grant 8,359,740 - Val , et al. January 29, 2 | 2013-01-29 |
3D electronic module
Grant 8,264,853 - Val , et al. September 11, 2 | 2012-09-11 |
Low-thickness electronic module comprising a stack of electronic packages provided with connection balls
Grant 8,243,468 - Val August 14, 2 | 2012-08-14 |
Method for Positioning Chips During the Production of a Reconstituted Wafer
App 20120094439 - Val; Christian | 2012-04-19 |
Method of interconnecting electronic wafers
Grant 8,136,237 - Val March 20, 2 | 2012-03-20 |
Method For Positioning Chips During The Production Of A Reconstituted Wafer
App 20110312132 - Val; Christian | 2011-12-22 |
Process For The Wafer-scale Fabrication Of Electronic Modules For Surface Mounting
App 20110247210 - Val; Christian ; et al. | 2011-10-13 |
Process for the collective fabrication of 3D electronic modules
Grant 7,951,649 - Val May 31, 2 | 2011-05-31 |
Process for the collective fabrication of 3D electronic modules
Grant 7,877,874 - Val February 1, 2 | 2011-02-01 |
Method Of Interconnecting Electronic Wafers
App 20100276081 - Val; Christian | 2010-11-04 |
Method for the interconnection of active and passive components and resulting thin heterogeneous component
Grant 7,635,639 - Val , et al. December 22, 2 | 2009-12-22 |
Process For The Vertical Interconnection Of 3d Electronic Modules By Vias
App 20090260228 - Val; Christian | 2009-10-22 |
Process For The Collective Fabrication Of 3d Electronic Modules
App 20090209052 - Val; Christian | 2009-08-20 |
Electronic device with integrated heat distributor
Grant 7,476,965 - Val , et al. January 13, 2 | 2009-01-13 |
3D Electronic Module
App 20080316727 - Val; Christian ; et al. | 2008-12-25 |
Process for the Collective Fabrication of 3D Electronic Modules
App 20080289174 - Val; Christian | 2008-11-27 |
Low-Thickness Electronic Module Comprising a Stack of Electronic Packages Provided with Connection Balls
App 20080170374 - Val; Christian | 2008-07-17 |
Electronic Device with Integrated Heat Distributor
App 20070262443 - Val; Christian ; et al. | 2007-11-15 |
Method for interconnecting active and passive components, and a resulting thin heterogeneous component
App 20070117369 - Val; Christian ; et al. | 2007-05-24 |
Device for the hermetic encapsulation of a component that must be protected against all stresses
App 20050012188 - Val, Christian | 2005-01-20 |
Device for interconnecting, in three dimensions, electronic components
Grant 6,809,367 - Val October 26, 2 | 2004-10-26 |
Three dimensional interconnection method and electronic device obtained by same
Grant 6,716,672 - Val April 6, 2 | 2004-04-06 |
Method for distributed shielding and/or bypass for electronic device with three dimensional interconnection
App 20030173673 - Val, Christian | 2003-09-18 |
Three dimensionals interconnection method and electronic device obtained by same
App 20030013231 - Val, Christian | 2003-01-16 |
Method and device for interconnecting, electronic components in three dimensions
App 20020191380 - Val, Christian | 2002-12-19 |
Method for the manufacturing of a semiconductor device which comprises at least one chip and corresponding device
Grant 6,307,261 - Val , et al. October 23, 2 | 2001-10-23 |
Method for the 3D interconnection of packages of electronic components, and device obtained by this method
Grant 5,885,850 - Val March 23, 1 | 1999-03-23 |
Method and device for interconnecting integrated circuits in three dimensions
Grant 5,847,448 - Val , et al. December 8, 1 | 1998-12-08 |
Method for interconnecting semiconductor chips in three dimensions, and component resulting therefrom
Grant 5,637,536 - Val June 10, 1 | 1997-06-10 |
Process and device for hermetic encapsulation of electronic components
Grant 5,461,545 - Leroy , et al. October 24, 1 | 1995-10-24 |
Method of producing coaxial connections for an electronic component, and component package
Grant 5,323,533 - Val June 28, 1 | 1994-06-28 |
Electric potential distribution device and an electronic component case incorporating such a device
Grant 5,237,204 - Val * August 17, 1 | 1993-08-17 |
Wire bonding method with a frame, for connecting an electronic component for testing and mounting
Grant 5,002,895 - Le Parquier , et al. March 26, 1 | 1991-03-26 |
Housing for encapsulating an electronic circuit
Grant 4,755,910 - Val July 5, 1 | 1988-07-05 |
Electronic component box supplied with a capacitor
Grant 4,654,694 - Val March 31, 1 | 1987-03-31 |
Radiation-hardened casing for an electronic component
Grant 4,639,826 - Val , et al. January 27, 1 | 1987-01-27 |
Device for the protection of an electronic component and/or circuit against the disturbances (voltages) generated by an external electromagnetic field
Grant 4,559,579 - Val December 17, 1 | 1985-12-17 |
Electronic component package comprising a moisture-retention element
Grant 4,553,020 - Val November 12, 1 | 1985-11-12 |
Composite substrate with high heat conduction
Grant 4,546,028 - Val October 8, 1 | 1985-10-08 |
Encapsulating case able to resist high external pressures
Grant 4,518,818 - Le Ny , et al. May 21, 1 | 1985-05-21 |
Process for polymerizing thermosetting resins
Grant 4,517,356 - Lambert , et al. May 14, 1 | 1985-05-14 |
Thermal printing head
Grant 4,413,170 - Val , et al. November 1, 1 | 1983-11-01 |
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