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Vakanas; George Patent Filings

Vakanas; George

Patent Applications and Registrations

Patent applications and USPTO patent grants for Vakanas; George.The latest application filed is for "stacked wire-bond dice attached by pillars or bumps above a flip-chip die on a semiconductor package substrate".

Company Profile
3.5.8
  • Vakanas; George - Tempe AZ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Stacked Wire-bond Dice Attached By Pillars Or Bumps Above A Flip-chip Die On A Semiconductor Package Substrate
App 20200098727 - Mallik; Debendra ;   et al.
2020-03-26
Thermally-optimized Tunable Stack In Cavity Package-on-package
App 20200043894 - VAKANAS; George ;   et al.
2020-02-06
Thin NiB or CoB capping layer for non-noble metallic bonding landing pads
Grant 10,066,303 - Beyne , et al. September 4, 2
2018-09-04
Thin Nib Or Cob Capping Layer For Non-noble Metallic Bonding Landing Pads
App 20150247244 - Beyne; Eric ;   et al.
2015-09-03
Laser-assisted chemical singulation of a wafer
Grant 8,426,250 - Vakanas , et al. April 23, 2
2013-04-23
Clipless integrated heat spreader process and materials
Grant 8,163,598 - Kostiew , et al. April 24, 2
2012-04-24
Clipless Integrated Heat Spreader Process and Materials
App 20110129963 - Kostiew; George ;   et al.
2011-06-02
Clipless integrated heat spreader process and materials
Grant 7,892,883 - Kostiew , et al. February 22, 2
2011-02-22
Wafer Singulation In High Volume Manufacturing
App 20100129984 - Vakanas; George ;   et al.
2010-05-27
Laser-assisted chemical singulation of a wafer
App 20100099238 - Vakanas; George ;   et al.
2010-04-22
Clipless Integrated Heat Spreader Process And Materials
App 20090298235 - Kostiew; George ;   et al.
2009-12-03

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