| Patent | Date |
|---|
Methods to selectively embed magnetic materials in substrate and corresponding structures
Grant 11,450,471 - Xu , et al. September 20, 2 | 2022-09-20 |
Substrate assembly with encapsulated magnetic feature
Grant 11,443,892 - Lee , et al. September 13, 2 | 2022-09-13 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures
Grant 11,417,614 - Xu , et al. August 16, 2 | 2022-08-16 |
Magnetic Inductor Structures For Package Devices
App 20220230951 - Chatterjee; Prithwish ; et al. | 2022-07-21 |
Waveguide With Self-aligned Mirror In Package For Long Range Chip-to-chip Communications
App 20220196914 - ECTON; Jeremy D. ; et al. | 2022-06-23 |
Faraday Rotator Interconnect As A Through-via Configuration In A Patch Architecture
App 20220187548 - MARIN; Brandon C. ; et al. | 2022-06-16 |
Microelectronic Structures Including Glass Cores
App 20220189880 - Pietambaram; Srinivas V. ; et al. | 2022-06-16 |
Embedding magnetic material, in a cored or coreless semiconductor package
Grant 11,355,459 - Lee , et al. June 7, 2 | 2022-06-07 |
High Bandwidth Optical Interconnection Architectures
App 20220155539 - PIETAMBARAM; Srinivas V. ; et al. | 2022-05-19 |
Magnetic inductor structures for package devices
Grant 11,335,632 - Chatterjee , et al. May 17, 2 | 2022-05-17 |
Methods Of Embedding Magnetic Structures In Substrates
App 20220130748 - Vadlamani; Sai ; et al. | 2022-04-28 |
Electronic substrates having embedded magnetic material using photo-imagable dielectric layers
Grant 11,289,263 - Vadlamani , et al. March 29, 2 | 2022-03-29 |
Electronic Substrates Having Embedded Inductors
App 20220093316 - Duong; Benjamin ; et al. | 2022-03-24 |
Magnetic Wires And Their Applications
App 20220085143 - CHOI; Beomseok ; et al. | 2022-03-17 |
Coreless Organic Packages With Embedded Die And Magnetic Inductor Structures
App 20220068847 - Brown; Andrew J. ; et al. | 2022-03-03 |
Methods of embedding magnetic structures in substrates
Grant 11,251,113 - Vadlamani , et al. February 15, 2 | 2022-02-15 |
Semiconductor package having a coaxial first layer interconnect
Grant 11,244,912 - Vadlamani , et al. February 8, 2 | 2022-02-08 |
Electronic Substrates Having Embedded Dielectric Magnetic Material To Form Inductors
App 20220013265 - Brown; Andrew J. ; et al. | 2022-01-13 |
Coreless organic packages with embedded die and magnetic inductor structures
Grant 11,205,626 - Brown , et al. December 21, 2 | 2021-12-21 |
Package With Underfill Containment Barrier
App 20210391232 - Jain; Rahul ; et al. | 2021-12-16 |
Electronic substrates having embedded dielectric magnetic material to form inductors
Grant 11,189,409 - Brown , et al. November 30, 2 | 2021-11-30 |
Package with underfill containment barrier
Grant 11,158,558 - Jain , et al. October 26, 2 | 2021-10-26 |
Package With Underfill Containment Barrier
App 20210111088 - Jain; Rahul ; et al. | 2021-04-15 |
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
Grant 10,971,492 - Xu , et al. April 6, 2 | 2021-04-06 |
Coreless Organic Packages With Embedded Die And Magnetic Inductor Structures
App 20200279819 - Brown; Andrew J. ; et al. | 2020-09-03 |
Plated through hole socketing coupled to a solder ball to engage with a pin
Grant 10,741,947 - Alur , et al. A | 2020-08-11 |
Package-embedded Thin-film Capacitors, Package-integral Magnetic Inductors, And Methods Of Assembling Same
App 20200251467 - Kind Code | 2020-08-06 |
Coreless organic packages with embedded die and magnetic inductor structures
Grant 10,700,021 - Brown , et al. | 2020-06-30 |
3D conductive ink printing method and inductor formed thereof
Grant 10,692,965 - Zhang , et al. | 2020-06-23 |
Embedded magnetic inductor
Grant 10,672,859 - Brown , et al. | 2020-06-02 |
Semiconductor Package Having A Coaxial First Layer Interconnect
App 20200168569 - VADLAMANI; Sai ; et al. | 2020-05-28 |
Asymmetric Cored Integrated Circuit Package Supports
App 20200168536 - Link; Lauren Ashley ; et al. | 2020-05-28 |
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
Grant 10,643,994 - Xu , et al. | 2020-05-05 |
3d Conductive Ink Printing Method And Inductor Formed Thereof
App 20200098848 - Zhang; Chong ; et al. | 2020-03-26 |
Coreless Organic Packages With Embedded Die And Magnetic Inductor Structures
App 20200075511 - Brown; Andrew J. ; et al. | 2020-03-05 |
Cavity Structures In Integrated Circuit Package Supports
App 20200066543 - Jain; Rahul ; et al. | 2020-02-27 |
Substrate Assembly Region With Ceramic Or Boron Fiber
App 20200006211 - BROWN; Andrew J. ; et al. | 2020-01-02 |
Substrate Assembly With Encapsulated Magnetic Feature
App 20200005994 - LEE; Kyu-Oh ; et al. | 2020-01-02 |
Patterning Of Thin Film Capacitors In Organic Substrate Packages
App 20200006005 - JAIN; Rahul ; et al. | 2020-01-02 |
Embedded Magnetic Inductor
App 20200006464 - Brown; Andrew J. ; et al. | 2020-01-02 |
Package-embedded Thin-film Capacitors, Package-integral Magnetic Inductors, And Methods Of Assembling Same
App 20190393217 - Xu; Cheng ; et al. | 2019-12-26 |
Creating A Cavity Using Plasma Gas
App 20190373736 - Jain; Rahul ; et al. | 2019-12-05 |
Embedding Magnetic Material In A Cored Or Coreless Semiconductor Package
App 20190355675 - LEE; Kyu-Oh ; et al. | 2019-11-21 |
Methods To Embed Magnetic Material As First Layer On Coreless Substrates And Corresponding Structures
App 20190304933 - XU; Cheng ; et al. | 2019-10-03 |
Methods To Selectively Embed Magnetic Materials In Substrate And Corresponding Structures
App 20190304661 - Xu; Cheng ; et al. | 2019-10-03 |
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
Grant 10,373,951 - Xu , et al. | 2019-08-06 |
Release Layer-assisted Selective Embedding Of Magnetic Material In Cored And Coreless Organic Substrates
App 20190221345 - Vadlamani; Sai ; et al. | 2019-07-18 |
Plated Through Hole Socketing
App 20190214751 - Alur; Amruthavalli Pallavi ; et al. | 2019-07-11 |
Electronic Substrates Having Embedded Dielectric Magnetic Material To Form Inductors
App 20190206597 - Brown; Andrew J. ; et al. | 2019-07-04 |
Magnetic Inductor Structures For Package Devices
App 20190206780 - Chatterjee; Prithwish ; et al. | 2019-07-04 |
Methods Of Embedding Magnetic Structures In Substrates
App 20190198436 - Vadlamani; Sai ; et al. | 2019-06-27 |
Electronic Substrates Having Embedded Magnetic Material Using Photo-imagable Dielectric Layers
App 20190198228 - Vadlamani; Sai ; et al. | 2019-06-27 |
| 