| Patent | Date |
|---|
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20220013434 - Vadhavkar; Sameer S. ; et al. | 2022-01-13 |
Methods And Systems For Manufacturing Pillar Structures On Semiconductor Devices
App 20210343670 - Yeruva; Suresh ; et al. | 2021-11-04 |
Bonding pads with thermal pathways
Grant 11,139,258 - Gandhi , et al. October 5, 2 | 2021-10-05 |
Methods and systems for manufacturing pillar structures on semiconductor devices
Grant 11,081,460 - Yeruva , et al. August 3, 2 | 2021-08-03 |
Pillar-last Methods For Forming Semiconductor Devices
App 20210166996 - Chandolu; Anilkumar ; et al. | 2021-06-03 |
Pillar-last methods for forming semiconductor devices
Grant 10,957,625 - Chandolu , et al. March 23, 2 | 2021-03-23 |
Apparatuses and methods for semiconductor die heat dissipation
Grant 10,916,527 - Vadhavkar , et al. February 9, 2 | 2021-02-09 |
Apparatuses And Methods For Semiconductor Die Heat Dissipation
App 20200350294 - VADHAVKAR; SAMEER S. ; et al. | 2020-11-05 |
Semiconductor devices with underfill control features, and associated systems and methods
Grant 10,784,224 - Yeruva , et al. Sept | 2020-09-22 |
Apparatuses and methods for semiconductor die heat dissipation
Grant 10,770,435 - Vadhavkar , et al. Sep | 2020-09-08 |
Semiconductor device assembly with heat transfer structure formed from semiconductor material
Grant 10,748,878 - Vadhavkar , et al. A | 2020-08-18 |
Methods And Systems For Manufacturing Pillar Structures On Semiconductor Devices
App 20200211993 - Yeruva; Suresh ; et al. | 2020-07-02 |
Bonding Pads With Thermal Pathways
App 20200176404 - GANDHI; JASPREET S. ; et al. | 2020-06-04 |
Solid-state Radiation Transducer Devices Having Flip-chip Mounted Solid-state Radiation Transducers And Associated Systems And M
App 20200098965 - Vadhavkar; Sameer S. | 2020-03-26 |
Bonding pads with thermal pathways
Grant 10,580,746 - Gandhi , et al. | 2020-03-03 |
Bonding pads with thermal pathways
Grant 10,573,612 - Gandhi , et al. Feb | 2020-02-25 |
Semiconductor device assembly with heat transfer structure formed from semiconductor material
Grant 10,559,551 - Vadhavkar , et al. Feb | 2020-02-11 |
Apparatuses and methods for semiconductor die heat dissipation
Grant 10,541,229 - Vadhavkar , et al. Ja | 2020-01-21 |
Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods
Grant 10,541,355 - Vadhavkar Ja | 2020-01-21 |
Semiconductor Devices With Underfill Control Features, And Associated Systems And Methods
App 20190371755 - Yeruva; Suresh ; et al. | 2019-12-05 |
Semiconductor Device Assembly With Heat Transfer Structure Formed From Semiconductor Material
App 20190348401 - Vadhavkar; Sameer S. ; et al. | 2019-11-14 |
Apparatuses and methods for semiconductor die heat dissipation
Grant 10,461,061 - Vadhavkar , et al. Oc | 2019-10-29 |
Apparatuses And Methods For Semiconductor Die Heat Dissipation
App 20190326260 - VADHAVKAR; SAMEER S. ; et al. | 2019-10-24 |
Apparatuses and methods for semiconductor die heat dissipation
Grant 10438928 - | 2019-10-08 |
Semiconductor devices with underfill control features, and associated systems and methods
Grant 10,424,553 - Yeruva , et al. Sept | 2019-09-24 |
Semiconductor Device Assembly With Heat Transfer Structure Formed From Semiconductor Material
App 20190229096 - Vadhavkar; Sameer S. ; et al. | 2019-07-25 |
Pillar-last Methods For Forming Semiconductor Devices
App 20190206766 - Chandolu; Anilkumar ; et al. | 2019-07-04 |
Apparatuses And Methods For Semiconductor Die Heat Dissipation
App 20190172817 - VADHAVKAR; SAMEER S. ; et al. | 2019-06-06 |
Semiconductor device assembly with heat transfer structure formed from semiconductor material
Grant 10,297,577 - Vadhavkar , et al. | 2019-05-21 |
Bonding Pads With Thermal Pathways
App 20180374810 - Gandhi; Jaspreet S. ; et al. | 2018-12-27 |
Bonding pads with thermal pathways
Grant 10,163,830 - Gandhi , et al. Dec | 2018-12-25 |
Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
Grant 10,163,755 - Vadhavkar , et al. Dec | 2018-12-25 |
Bonding Pads With Thermal Pathways
App 20180358314 - Gandhi; Jaspreet S. ; et al. | 2018-12-13 |
Solid-state Radiation Transducer Devices Having Flip-chip Mounted Solid-state Radiation Transducers And Associated Systems And Methods
App 20180358526 - Vadhavkar; Sameer S. | 2018-12-13 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20180308785 - Vadhavkar; Sameer S. ; et al. | 2018-10-25 |
Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods
Grant 10,079,333 - Vadhavkar September 18, 2 | 2018-09-18 |
Semiconductor Devices With Underfill Control Features, And Associated Systems And Methods
App 20180122762 - Yeruva; Suresh ; et al. | 2018-05-03 |
Semiconductor Device Assembly With Heat Transfer Structure Formed From Semiconductor Material
App 20170365584 - Vadhavkar; Sameer S. ; et al. | 2017-12-21 |
Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods
Grant 9,837,396 - Vadhavkar , et al. December 5, 2 | 2017-12-05 |
Semiconductor device assembly with heat transfer structure formed from semiconductor material
Grant 9,768,149 - Vadhavkar , et al. September 19, 2 | 2017-09-19 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20170229439 - Vadhavkar; Sameer S. ; et al. | 2017-08-10 |
Solid-state Radiation Transducer Devices Having Flip-chip Mounted Solid-state Radiation Transducers And Associated Systems And Methods
App 20170222111 - Vadhavkar; Sameer S. | 2017-08-03 |
Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
Grant 9,691,746 - Vadhavkar , et al. June 27, 2 | 2017-06-27 |
Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods
Grant 9,647,167 - Vadhavkar May 9, 2 | 2017-05-09 |
Bonding Pads With Thermal Pathways
App 20170053881 - GANDHI; JASPREET S. ; et al. | 2017-02-23 |
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Associated Methods
App 20160372452 - Vadhavkar; Sameer S. ; et al. | 2016-12-22 |
Bonding pads with thermal pathways
Grant 9,515,002 - Gandhi , et al. December 6, 2 | 2016-12-06 |
Semiconductor Device Assembly With Heat Transfer Structure Formed From Semiconductor Material
App 20160343687 - Vadhavkar; Sameer S. ; et al. | 2016-11-24 |
Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods
Grant 9,443,744 - Vadhavkar , et al. September 13, 2 | 2016-09-13 |
Apparatuses And Methods For Semiconductor Die Heat Dissipation
App 20160247742 - VADHAVKAR; SAMEER S. ; et al. | 2016-08-25 |
Bonding Pads With Thermal Pathways
App 20160233139 - GANDHI; JASPREET S. ; et al. | 2016-08-11 |
Semiconductor device assembly with underfill containment cavity
Grant 9,397,078 - Chandolu , et al. July 19, 2 | 2016-07-19 |
Stacked semiconductor die assemblies with high efficiency thermal paths and associated systems
Grant 9,337,119 - Vadhavkar , et al. May 10, 2 | 2016-05-10 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20160013173 - Vadhavkar; Sameer S. ; et al. | 2016-01-14 |
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Associated Systems
App 20160013114 - Vadhavkar; Sameer S. ; et al. | 2016-01-14 |
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Associated Methods
App 20160013115 - Vadhavkar; Sameer S. ; et al. | 2016-01-14 |
Magnetically adjusting color-converting materials within a matrix and associated devices, systems, and methods
Grant 9,039,474 - Vadhavkar , et al. May 26, 2 | 2015-05-26 |
Solid-state Radiation Transducer Devices Having Flip-chip Mounted Solid-state Radiation Transducers And Associated Systems And Methods
App 20150132874 - Vadhavkar; Sameer S. | 2015-05-14 |
Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods
Grant 8,952,402 - Vadhavkar February 10, 2 | 2015-02-10 |
Magnetically Adjusting Color-converting Materials Within A Matrix And Associated Devices, Systems, And Methods
App 20130119419 - Vadhavkar; Sameer S. ; et al. | 2013-05-16 |
Solid-state Radiation Transducer Devices Having Flip-chip Mounted Solid-state Radiation Transducers And Associated Systems And Methods
App 20130049039 - Vadhavkar; Sameer S. | 2013-02-28 |
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