| Patent | Date |
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Method of manufacturing a glass article to provide increased bonding of metal to a glass substrate via the generation of a metal oxide layer, and glass articles such as glass interposers including the metal oxide layer
Grant 11,456,225 - Adib , et al. September 27, 2 | 2022-09-27 |
Glass Sheets With Copper Films And Methods Of Making The Same
App 20220212981 - Huang; Ming-Huang ; et al. | 2022-07-07 |
Bezel-free Display Tile With Edge-wrapped Conductors And Methods Of Manufacture
App 20220209087 - FENG; JIANGWEI ; et al. | 2022-06-30 |
Bezel-free Display Tile With Edge-wrapped Conductors And Methods Of Manufacture
App 20220173296 - FENG; JIANGWEI ; et al. | 2022-06-02 |
Polar elastomer microstructures and methods for fabricating same
Grant 11,329,228 - Manley , et al. May 10, 2 | 2022-05-10 |
Bezel-free display tile with edge-wrapped conductors and methods of manufacture
Grant 11,282,994 - Feng , et al. March 22, 2 | 2022-03-22 |
Fluidic assembly substrates and methods for making such
Grant 11,257,728 - Bellman , et al. February 22, 2 | 2022-02-22 |
Hermetic Metallized Via With Improved Reliability
App 20210407896 - Kanungo; Mandakini ; et al. | 2021-12-30 |
Hermetic metallized via with improved reliability
Grant 11,201,109 - Kanungo , et al. December 14, 2 | 2021-12-14 |
Device Including Vias And Method And Material For Fabricating Vias
App 20210359185 - Garner; Sean Matthew ; et al. | 2021-11-18 |
Hermetic metallized via with improved reliability
Grant 11,152,294 - Huang , et al. October 19, 2 | 2021-10-19 |
Method Of Manufacturing A Glass Article To Provide Increased Bonding Of Metal To A Glass Substrate Via The Generation Of A Metal Oxide Layer, And Glass Articles Such As Glass Interposers Including The Metal Oxide Layer
App 20210320041 - Adib; Kaveh ; et al. | 2021-10-14 |
Through Glass Via Fabrication Using A Protective Material
App 20210187910 - Manley; Robert George ; et al. | 2021-06-24 |
Polar Elastomer Microstructures And Methods For Fabricating Same
App 20210135114 - Manley; Robert George ; et al. | 2021-05-06 |
Systems And Methods For Adhering Copper Interconnects In A Display Device
App 20210114923 - HUANG; MING-HUANG ; et al. | 2021-04-22 |
Bottom up electroplating with release layer
Grant 10,957,628 - Bellman , et al. March 23, 2 | 2021-03-23 |
Methods For Forming Thin Film Transistors On A Glass Substrate And Liquid Crystal Displays Formed Therefrom
App 20210018780 - Huang; Ming-Huang ; et al. | 2021-01-21 |
Bezel-free Display Tile With Edge-wrapped Conductors And Methods Of Manufacture
App 20200243738 - FENG; JIANGWEI ; et al. | 2020-07-30 |
Interposer With Manganese Oxide Adhesion Layer
App 20200227277 - Brown; Philip Simon ; et al. | 2020-07-16 |
Fluidic Assembly Substrates And Methods For Making Such
App 20200194323 - Bellman; Robert Alan ; et al. | 2020-06-18 |
Hermetic Metallized Via With Improved Reliability
App 20200165160 - Kanungo; Mandakini ; et al. | 2020-05-28 |
3d Interposer With Through Glass Vias - Method Of Increasing Adhesion Between Copper And Glass Surfaces And Articles Therefrom
App 20200148593 - Kim; Hoon ; et al. | 2020-05-14 |
A Substrate With A Polar Elastomer Dielectric And A Method Of Coating A Substrate With A Polar Elastomer Dielectric
App 20200115584 - Manley; Robert George ; et al. | 2020-04-16 |
Bottom Up Electroplating With Release Layer
App 20200111726 - Bellman; Robert Alan ; et al. | 2020-04-09 |
Methods For Increasing Adhesion Between Metallic Films And Glass Surfaces And Articles Made Therefrom
App 20200095684 - Bookbinder; Dana Craig ; et al. | 2020-03-26 |
Glass Article Having A Metallic Nanofilm And Method Of Increasing Adhesion Between Metal And Glass
App 20190378773 - Brown; Philip Simon ; et al. | 2019-12-12 |
Methods Of Increasing Adhesion Between A Conductive Metal And An Oxide Substrate And Articles Made Therefrom
App 20190363010 - Brown; Philip Simon ; et al. | 2019-11-28 |
3d Interposer With Through Glass Vias - Method Of Increasing Adhesion Between Copper And Glass Surfaces And Articles Therefrom
App 20190327840 - Bookbinder; Dana Craig ; et al. | 2019-10-24 |
Systems And Methods For Reducing Substrate Surface Disruption During Via Formation
App 20190312067 - Garner; Sean Matthew ; et al. | 2019-10-10 |
Hermetic Metallized Via With Improved Reliability
App 20190313524 - Huang; Tian ; et al. | 2019-10-10 |
Systems and methods for reducing substrate surface disruption during via formation
Grant 10,424,606 - Garner , et al. Sept | 2019-09-24 |
Dehydration systems and methods for removing water from a gas
Grant 8,491,712 - Kidambi , et al. July 23, 2 | 2013-07-23 |
Dehydration Systems And Methods For Removing Water From A Gas
App 20120060690 - Kidambi; Ganesh Prasadh ; et al. | 2012-03-15 |
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