Uzoh; Cyprian E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Uzoh; Cyprian E..The latest application filed is for "selenium containing electrodeposition solution and methods".

Company Profile

0.51.42

Uzoh; Cyprian E. - San Jose CA
Uzoh; Cyprian E. - Milpitas CA
Uzoh; Cyprian E. - Hopewell Junction NY
Uzoh; Cyprian E. - Beacon NY
Uzoh; Cyprian E. - Dutchess NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Selenium Containing Electrodeposition Solution And Methods App 20100140098 - Uzoh; Cyprian E. ; et al.	2010-06-10
Method of forming contact layers on substrates Grant 7,704,880 - Uzoh , et al. April 27, 2	2010-04-27
Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same Grant 7,670,473 - Uzoh , et al. March 2, 2	2010-03-02
Method to plate C4 to copper stud Grant RE40,983 - Uzoh , et al. November 17, 2	2009-11-17
Apparatus for reduction of defects in wet processed layers Grant 7,503,830 - Basol , et al. March 17, 2	2009-03-17
Method and system for controlled material removal by electrochemical polishing App 20090020437 - Basol; Bulent M. ; et al.	2009-01-22
Method of forming contact layers on substrates Grant 7,416,975 - Uzoh , et al. August 26, 2	2008-08-26
Method and system for optically enhanced metal planarization Grant 7,250,104 - Uzoh , et al. July 31, 2	2007-07-31
Method and system to provide electrical contacts for electrotreating processes Grant 7,244,347 - Basol , et al. July 17, 2	2007-07-17
Low-force electrochemical mechanical processing method and apparatus Grant 7,238,092 - Basol , et al. July 3, 2	2007-07-03
Apparatus for reduction of defects in wet procssed layers App 20070135022 - Basol; Bulent M. ; et al.	2007-06-14
Method and system to provide electrical contacts for electrotreating processes Grant 7,211,174 - Basol , et al. May 1, 2	2007-05-01
Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same Grant 7,204,917 - Uzoh , et al. April 17, 2	2007-04-17
Method of electroplating copper layers with flat topography Grant 7,195,700 - Uzoh , et al. March 27, 2	2007-03-27
Electrode assembly for electrochemical processing of workpiece Grant 7,195,696 - Uzoh , et al. March 27, 2	2007-03-27
Method of forming contact layers on substrates App 20070066054 - Uzoh; Cyprian E. ; et al.	2007-03-22
Method for reduction of defects in wet processed layers Grant 7,189,146 - Basol , et al. March 13, 2	2007-03-13
Edge and bevel cleaning process and system Grant 7,122,473 - Ashjaee , et al. October 17, 2	2006-10-17
Method for electrochemically processing a workpiece Grant 7,115,510 - Basol , et al. October 3, 2	2006-10-03
Electrochemical mechanical processing with advancible sweeper Grant 7,097,755 - Basol , et al. August 29, 2	2006-08-29
Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate App 20060118425 - Basol; Bulent M. ; et al.	2006-06-08
Multi step electrodeposition process for reducing defects and minimizing film thickness App 20060011485 - Basol; Bulent M. ; et al.	2006-01-19
Method for plating copper conductors and devices formed Grant 6,979,393 - Rodbell , et al. December 27, 2	2005-12-27
Multi step electrodeposition process for reducing defects and minimizing film thickness Grant 6,946,066 - Basol , et al. September 20, 2	2005-09-20
Electroetching methods and systems using chemical and mechanical influence App 20050133380 - Basol, Bulent M. ; et al.	2005-06-23
Methods for depositing high yield and low defect density conductive films in damascene structures App 20050095854 - Uzoh, Cyprian E. ; et al.	2005-05-05
Edge and bevel cleaning process and system App 20050079713 - Ashjaee, Jalal ; et al.	2005-04-14
Method for electrochemically processing a workpiece Grant 6,867,136 - Basol , et al. March 15, 2	2005-03-15
Method and system monitoring and controlling film thickness profile during plating and electroetching Grant 6,866,763 - Basol , et al. March 15, 2	2005-03-15
Method and structure to reduce defects in integrated circuits and substrates Grant 6,861,354 - Uzoh , et al. March 1, 2	2005-03-01
Method and system to provide electroplanarization of a workpiece with a conducting material layer App 20050042873 - Uzoh, Cyprian E. ; et al.	2005-02-24
Method and system for optically enhanced metal planarization App 20050029123 - Uzoh, Cyprian E. ; et al.	2005-02-10
Electrode assembly for electrochemical processing of workpiece App 20050006244 - Uzoh, Cyprian E. ; et al.	2005-01-13
Method of electroplating copper layers with flat topography App 20040265562 - Uzoh, Cyprian E. ; et al.	2004-12-30
Electroetching methods and systems using chemical and mechanical influence Grant 6,821,409 - Basol , et al. November 23, 2	2004-11-23
Method and apparatus for reduction of defects in wet processed layers App 20040198190 - Basol, Bulent M. ; et al.	2004-10-07
Method of supplying solution for electrochemical processes from double-cavity electrode housing App 20040163963 - Uzoh, Cyprian E. ; et al.	2004-08-26
Method and system to provide electroplanarization of a workpiece with a conducting material layer Grant 6,780,772 - Uzoh , et al. August 24, 2	2004-08-24
Edge and bevel cleaning process and system Grant 6,777,338 - Ashjaee , et al. August 17, 2	2004-08-17
Open-bottomed via liner structure and method for fabricating same Grant 6,768,203 - Simon , et al. July 27, 2	2004-07-27
Method and system to provide material removal and planarization employing a reactive pad App 20040102049 - Basol, Bulent M. ; et al.	2004-05-27
Carrier head for holding a wafer and allowing processing on a front face thereof to occur Grant 6,716,084 - Basol , et al. April 6, 2	2004-04-06
Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs Grant 6,695,962 - Uzoh , et al. February 24, 2	2004-02-24
Method for enhancing the uniformity of electrodeposition or electroetching Grant 6,685,814 - Uzoh , et al. February 3, 2	2004-02-03
Method and system monitoring and controlling film thickness profile during plating and electroetching App 20030230491 - Basol, Bulent M. ; et al.	2003-12-18
Method and system to provide material removal and planarization employing a reactive pad Grant 6,649,523 - Basol , et al. November 18, 2	2003-11-18
Electroetching methods and systems using chemical and mechanical influence App 20030178319 - Basol, Bulent M. ; et al.	2003-09-25
Method and structure to reduce defects in integrated circuits and substrates App 20030160326 - Uzoh, Cyprian E. ; et al.	2003-08-28
Seedlayer for plating metal in deep submicron structures Grant 6,600,230 - Uzoh , et al. July 29, 2	2003-07-29
Method and system to provide electroplanarization of a workpiece with a conducting material layer App 20030139053 - Uzoh, Cyprian E. ; et al.	2003-07-24
Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same App 20030121774 - Uzoh, Cyprian E. ; et al.	2003-07-03
Planar metal electroprocessing App 20030119311 - Basol, Bulent M. ; et al.	2003-06-26
Electrochemical mechanical processing with advancible sweeper App 20030106807 - Basol, Bulent M. ; et al.	2003-06-12
Electromigration-resistant copper microstructure Grant 6,572,982 - Uzoh , et al. June 3, 2	2003-06-03
Graded composition diffusion barriers for chip wiring applications Grant 6,569,783 - Uzoh , et al. May 27, 2	2003-05-27
Method and system to provide electrical contacts for electrotreating processes App 20030089598 - Basol, Bulent M. ; et al.	2003-05-15
Method and system to provide electrical contacts for electrotreating processes App 20030089612 - Basol, Bulent M. ; et al.	2003-05-15
Low-force electrochemical mechanical processing method and apparatus App 20030064669 - Basol, Bulent M. ; et al.	2003-04-03
Multi step electrodeposition process for reducing defects and minimizing film thickness App 20030038038 - Basol, Bulent M. ; et al.	2003-02-27
Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs App 20020162750 - Uzoh, Cyprian E. ; et al.	2002-11-07
Edge and bevel cleaning process and system App 20020155648 - Ashjaee, Jalal ; et al.	2002-10-24
Carrier head for holding a wafer and allowing processing on a front face thereof to occur App 20020151257 - Basol, Bulent M. ; et al.	2002-10-17
Planarity detection methods and apparatus for electrochemical mechanical processing systems App 20020134748 - Basol, Bulent M. ; et al.	2002-09-26
Wiring structures containing interconnected metal and wiring levels including a continuous, single crystalline or polycrystalline conductive material having one or more twin boundaries Grant 6,429,519 - Uzoh August 6, 2	2002-08-06
Method to build multi level structure Grant 6,413,854 - Uzoh , et al. July 2, 2	2002-07-02
Method and system to provide material removal and planarization employing a reactive pad App 20020068456 - Basol, Bulent M. ; et al.	2002-06-06
Method for plating copper conductors and devices formed App 20020066673 - Rodbell, Kenneth P. ; et al.	2002-06-06
Graded composition diffusion barriers for chip wiring applications App 20020058163 - Uzoh, Cyprian E. ; et al.	2002-05-16
Microstructure liner having improved adhesion Grant 6,380,628 - Miller , et al. April 30, 2	2002-04-30
Wiring Structures Containing Interconnected Metal And Wiring Levels Including A Continous, Single Crystalline Or Polycrystalline Conductive Material Having One Or More Twin Boundaries App 20020047206 - UZOH, CYPRIAN E.	2002-04-25
Method of improving contact reliability for electroplating App 20020027082 - Andricacos, Panayotis C. ; et al.	2002-03-07
Method for plating copper conductors and devices formed Grant 6,344,129 - Rodbell , et al. February 5, 2	2002-02-05
Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies App 20020011673 - Uzoh, Cyprian E.	2002-01-31
Graded composition diffusion barriers for chip wiring applications Grant 6,337,151 - Uzoh , et al. January 8, 2	2002-01-08
Method for enhancing the uniformity of electrodeposition or electroetching App 20010050233 - Uzoh, Cyprian E. ; et al.	2001-12-13
Method to produce high quality metal fill in deep submicron vias and lines App 20010046565 - Uzoh, Cyprian E. ; et al.	2001-11-29
Method to plate C4 to copper stud App 20010032787 - Uzoh, Cyprian E. ; et al.	2001-10-25
Microstructure Liner Having Improved Adhesion App 20010019884 - MILLER, JOHN A. ; et al.	2001-09-06
Copper wire-bonding pad Grant 6,274,935 - Uzoh August 14, 2	2001-08-14
Method and apparatus for enhancing the uniformity of electrodeposition or electroetching Grant 6,261,426 - Uzoh , et al. July 17, 2	2001-07-17
Triple damascence tungsten-copper interconnect structure Grant 6,258,707 - Uzoh July 10, 2	2001-07-10
Method to produce high quality metal fill in deep submicron vias and lines Grant 6,258,717 - Uzoh , et al. July 10, 2	2001-07-10
Anode design for semiconductor deposition Grant 6,251,251 - Uzoh , et al. June 26, 2	2001-06-26
Serial intelligent electro-chemical-mechanical wafer processor Grant 6,234,870 - Uzoh , et al. May 22, 2	2001-05-22
Copper film including laminated impurities Grant 6,235,406 - Uzoh May 22, 2	2001-05-22
Copper Wire-bonding Pad App 20010000416 - Uzoh, Cyprian E.	2001-04-26
Electroplating electrical contacts Grant 6,217,734 - Uzoh April 17, 2	2001-04-17
Electromigration-resistant copper microstructure and process of making Grant 6,123,825 - Uzoh , et al. September 26, 2	2000-09-26
Anode design for semiconductor deposition having novel electrical contact assembly Grant 6,113,759 - Uzoh September 5, 2	2000-09-05
Electroplating workpiece fixture having liquid gap spacer Grant 6,071,388 - Uzoh June 6, 2	2000-06-06
Electroetch and chemical mechanical polishing equipment Grant 6,066,030 - Uzoh May 23, 2	2000-05-23
Open-bottomed via liner structure and method for fabricating same Grant 5,933,753 - Simon , et al. August 3, 1	1999-08-03
Continuous highly conductive metal wiring structures and method for fabricating the same Grant 5,930,669 - Uzoh July 27, 1	1999-07-27

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