| Patent | Date |
|---|
Liquid ejection head
Grant 11,161,351 - Kato , et al. November 2, 2 | 2021-11-02 |
Liquid ejection head and method of manufacturing same
Grant 11,135,838 - Hatsui , et al. October 5, 2 | 2021-10-05 |
Liquid Ejection Apparatus And Liquid Tank
App 20210237462 - UYAMA; Masaya ; et al. | 2021-08-05 |
Method of forming film on substrate and method of manufacturing liquid ejection head
Grant 11,081,349 - Uyama , et al. August 3, 2 | 2021-08-03 |
Liquid ejection head and method of manufacturing same
Grant 11,027,548 - Takeuchi , et al. June 8, 2 | 2021-06-08 |
Liquid ejection head
Grant 11,020,971 - Minami , et al. June 1, 2 | 2021-06-01 |
Liquid ejection head and a manufacturing method of the same
Grant 11,001,062 - Teranishi , et al. May 11, 2 | 2021-05-11 |
Semiconductor element, recording element substrate, and liquid discharge head
Grant 10,906,304 - Uyama , et al. February 2, 2 | 2021-02-02 |
Method Of Forming Film On Substrate And Method Of Manufacturing Liquid Ejection Head
App 20200227252 - Uyama; Masaya ; et al. | 2020-07-16 |
Liquid Ejection Head And A Manufacturing Method Of The Same
App 20200189275 - Teranishi; Atsushi ; et al. | 2020-06-18 |
Liquid Ejection Head
App 20200147962 - Minami; Seiko ; et al. | 2020-05-14 |
Perforated substrate processing method and liquid ejection head manufacturing method
Grant 10,632,754 - Uyama , et al. | 2020-04-28 |
Liquid Ejection Head
App 20200101759 - Kato; Masataka ; et al. | 2020-04-02 |
Method for manufacturing perforated substrate, method for manufacturing liquid ejection head, and method for detecting flaw
Grant 10,538,090 - Yaginuma , et al. Ja | 2020-01-21 |
Semiconductor Element, Recording Element Substrate, And Liquid Discharge Head
App 20200001605 - Uyama; Masaya ; et al. | 2020-01-02 |
Liquid Ejection Head And Method Of Manufacturing Same
App 20200001604 - Takeuchi; Souta ; et al. | 2020-01-02 |
Liquid Ejection Head And Method Of Manufacturing Same
App 20190366713 - Hatsui; Takuya ; et al. | 2019-12-05 |
Method for forming film and method for manufacturing inkjet print head
Grant 10,343,403 - Teranishi , et al. July 9, 2 | 2019-07-09 |
Liquid ejection head, method for manufacturing the same, and printing method
Grant 10,286,664 - Terasaki , et al. | 2019-05-14 |
Perforated Substrate Processing Method And Liquid Ejection Head Manufacturing Method
App 20190111682 - Uyama; Masaya ; et al. | 2019-04-18 |
Liquid discharge head, manufacturing method therefor, and recording method
Grant 10,150,292 - Kanri , et al. Dec | 2018-12-11 |
Method For Forming Film And Method For Manufacturing Inkjet Print Head
App 20180147848 - Teranishi; Atsushi ; et al. | 2018-05-31 |
Method For Manufacturing Perforated Substrate, Method For Manufacturing Liquid Ejection Head, And Method For Detecting Flaw
App 20180147849 - Yaginuma; Seiichiro ; et al. | 2018-05-31 |
Liquid ejection head
Grant 9,914,298 - Sakurai , et al. March 13, 2 | 2018-03-13 |
Liquid Discharge Head, Manufacturing Method Therefor, And Recording Method
App 20170341390 - Kanri; Ryoji ; et al. | 2017-11-30 |
Liquid Ejection Head, Method For Manufacturing The Same, And Printing Method
App 20170341389 - Terasaki; Atsunori ; et al. | 2017-11-30 |
Method of forming through-substrate
Grant 9,789,689 - Ogata , et al. October 17, 2 | 2017-10-17 |
Substrate processing method and method of manufacturing substrate for liquid discharge head including forming hole in substrate by dry etching
Grant 9,676,193 - Kato , et al. June 13, 2 | 2017-06-13 |
Liquid discharge head and method for manufacturing the same
Grant 9,623,655 - Uyama , et al. April 18, 2 | 2017-04-18 |
Method of etching a silicon substrate
Grant 9,548,207 - Ogata , et al. January 17, 2 | 2017-01-17 |
Method for processing silicon substrate
Grant 9,511,588 - Minami , et al. December 6, 2 | 2016-12-06 |
Liquid Ejection Head
App 20160297194 - Sakurai; Makoto ; et al. | 2016-10-13 |
Liquid-discharging head and method of producing the same
Grant 9,393,781 - Terui , et al. July 19, 2 | 2016-07-19 |
Liquid Discharge Head And Method For Manufacturing The Same
App 20160152027 - Uyama; Masaya ; et al. | 2016-06-02 |
Recording-element substrate and liquid ejection apparatus
Grant 9,216,575 - Tamatsukuri , et al. December 22, 2 | 2015-12-22 |
Method Of Forming Through-substrate
App 20150360470 - Ogata; Yoshinao ; et al. | 2015-12-17 |
Method of manufacturing a liquid ejection head
Grant 9,205,654 - Uyama December 8, 2 | 2015-12-08 |
Substrate Processing Method And Method Of Manufacturing Substrate For Liquid Discharge Head
App 20150328896 - Kato; Masataka ; et al. | 2015-11-19 |
Recording-element Substrate And Liquid Ejection Apparatus
App 20150290935 - Tamatsukuri; Shuichi ; et al. | 2015-10-15 |
Liquid ejection head and method for manufacturing same
Grant 9,102,150 - Higuchi , et al. August 11, 2 | 2015-08-11 |
Liquid Discharge Head
App 20150136024 - Takeuchi; Souta ; et al. | 2015-05-21 |
Method For Processing Silicon Substrate
App 20150111321 - Minami; Seiko ; et al. | 2015-04-23 |
Process for producing substrate and substrate processing method
Grant 9,004,666 - Uyama April 14, 2 | 2015-04-14 |
Liquid Ejection Head And Method For Manufacturing Same
App 20150022590 - Higuchi; Hiroshi ; et al. | 2015-01-22 |
Method Of Etching A Silicon Substrate
App 20150024604 - Ogata; Yoshinao ; et al. | 2015-01-22 |
Method Of Manufacturing A Liquid Ejection Head
App 20140360978 - Uyama; Masaya | 2014-12-11 |
Method for producing liquid-ejection head
Grant 8,877,290 - Uyama November 4, 2 | 2014-11-04 |
Method For Producing Liquid-ejection Head
App 20140093646 - Uyama; Masaya | 2014-04-03 |
Method of manufacturing liquid ejection head substrate
Grant 8,623,674 - Uyama January 7, 2 | 2014-01-07 |
Method for manufacturing wiring board and method for manufacturing inkjet printhead substrate
Grant 8,448,333 - Uyama May 28, 2 | 2013-05-28 |
Process of producing liquid discharge head base material
Grant 8,445,298 - Takeuchi , et al. May 21, 2 | 2013-05-21 |
Liquid discharge head having an increased rigidity
Grant 8,408,681 - Sakai , et al. April 2, 2 | 2013-04-02 |
Method Of Manufacturing Liquid Ejection Head Substrate
App 20130029437 - Uyama; Masaya | 2013-01-31 |
Recording element substrate, and inkjet head and its production method
Grant 8,240,815 - Uyama , et al. August 14, 2 | 2012-08-14 |
Liquid ejection head and manufacturing method thereof
Grant 8,205,967 - Uyama , et al. June 26, 2 | 2012-06-26 |
Liquid Discharge Head
App 20120120158 - Sakai; Toshiyasu ; et al. | 2012-05-17 |
Process For Producing Substrate And Substrate Processing Method
App 20120113200 - Uyama; Masaya | 2012-05-10 |
Ink jet recording head, manufacturing method thereof, and electron device
Grant 8,141,987 - Hayakawa , et al. March 27, 2 | 2012-03-27 |
Ink-jet recording head, method for manufacturing ink-jet recording head, and semiconductor device
Grant 7,926,909 - Hayakawa , et al. April 19, 2 | 2011-04-19 |
Ink jet print head manufacturing method and ink jet print head
Grant 7,922,922 - Uyama April 12, 2 | 2011-04-12 |
Process Of Producing Liquid Discharge Head Base Material
App 20110059558 - Takeuchi; Souta ; et al. | 2011-03-10 |
Recording Element Substrate, And Inkjet Head And Its Production Method
App 20110018934 - Uyama; Masaya ; et al. | 2011-01-27 |
Method For Manufacturing Wiring Board And Method For Manufacturing Inkjet Printhead Substrate
App 20100154211 - Uyama; Masaya | 2010-06-24 |
Ink Jet Recording Head, Manufacturing Method Thereof, And Electron Device
App 20090244198 - Hayakawa; Kazuhiro ; et al. | 2009-10-01 |
Liquid Ejection Head And Manufacturing Method Thereof
App 20090212008 - Uyama; Masaya ; et al. | 2009-08-27 |
Liquid-discharging Head And Method Of Producing The Same
App 20090040266 - Terui; Makoto ; et al. | 2009-02-12 |
Ink-jet Recording Head, Method For Manufacturing Ink-jet Recording Head, And Semiconductor Device
App 20080165222 - Hayakawa; Kazuhiro ; et al. | 2008-07-10 |
Ink Jet Print Head Manufacturing Method And Ink Jet Print Head
App 20080116167 - Uyama; Masaya | 2008-05-22 |
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