loadpatents
name:-0.03010106086731
name:-0.019674062728882
name:-0.00065803527832031
Utsumi; Masaki Patent Filings

Utsumi; Masaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Utsumi; Masaki.The latest application filed is for "semiconductor device".

Company Profile
0.17.24
  • Utsumi; Masaki - Kyoto JP
  • Utsumi; Masaki - Osaka N/A JP
  • Utsumi; Masaki - Kadoma JP
  • Utsumi; Masaki - Uji-shi JP
  • Utsumi; Masaki - Moriguchi JP
  • Utsumi; Masaki - Saitama-ken JP
  • Utsumi, Masaki - Moriguchi-shi JP
  • Utsumi; Masaki - Tokorozawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device
Grant 9,673,154 - Tsutsue , et al. June 6, 2
2017-06-06
Semiconductor Device
App 20160247771 - TSUTSUE; Makoto ;   et al.
2016-08-25
Semiconductor device
Grant 9,082,779 - Tsutsue , et al. July 14, 2
2015-07-14
Semiconductor Device
App 20150194391 - TSUTSUE; Makoto ;   et al.
2015-07-09
Semiconductor Device
App 20140210056 - TSUTSUE; Makoto ;   et al.
2014-07-31
Semiconductor device
Grant 8,710,595 - Tsutsue , et al. April 29, 2
2014-04-29
Semiconductor device
Grant 8,618,618 - Tsutsue , et al. December 31, 2
2013-12-31
Semiconductor Device
App 20130299948 - TSUTSUE; Makoto ;   et al.
2013-11-14
Semiconductor Device
App 20120280401 - TSUTSUE; Makoto ;   et al.
2012-11-08
Semiconductor device
Grant 8,247,876 - Tsutsue , et al. August 21, 2
2012-08-21
Semiconductor Device
App 20120018820 - UTSUMI; Masaki ;   et al.
2012-01-26
Semiconductor Device
App 20110254136 - TSUTSUE; Makoto ;   et al.
2011-10-20
Semiconductor Device And Electronic Apparatus
App 20110204487 - NAKANO; TAKAHIRO ;   et al.
2011-08-25
Semiconductor device and method for fabricating the same
Grant 7,994,589 - Tsutsue , et al. August 9, 2
2011-08-09
Semiconductor Device And Method Of Manufacturing The Same
App 20110147871 - UTSUMI; Masaki ;   et al.
2011-06-23
Semiconductor Device And Method Of Manufacturing The Same
App 20110147905 - Utsumi; Masaki ;   et al.
2011-06-23
Semiconductor device and method for fabricating the same
Grant 7,948,039 - Tsutsue , et al. May 24, 2
2011-05-24
Semiconductor substrate, semiconductor device and method of manufacturing the same
App 20110108957 - Utsumi; Masaki ;   et al.
2011-05-12
Method For Fabricating Semiconductor Device
App 20110039365 - UTSUMI; Masaki ;   et al.
2011-02-17
Semiconductor substrate
Grant 7,859,084 - Utsumi , et al. December 28, 2
2010-12-28
Semiconductor Device And Method For Fabricating The Same
App 20100308464 - TSUTSUE; Makoto ;   et al.
2010-12-09
Method for fabricating semiconductor device
Grant 7,838,323 - Utsumi , et al. November 23, 2
2010-11-23
Circuit substrate, molding semiconductor device, tray and inspection socket
Grant 7,777,311 - Utsumi , et al. August 17, 2
2010-08-17
Method For Fabricating Semiconductor Device
App 20100022046 - UTSUMI; Masaki ;   et al.
2010-01-28
Semiconductor Substrate, Semiconductor Device And Method Of Manufacturing The Same
App 20090218660 - Utsumi; Masaki ;   et al.
2009-09-03
Semiconductor Device And Method For Fabricating The Same
App 20090065903 - TSUTSUE; Makoto ;   et al.
2009-03-12
Circuit Substrate, Molding Semiconductor Device, Tray And Inspection Socket
App 20080283985 - Utsumi; Masaki ;   et al.
2008-11-20
Semiconductor device and method for fabricating the same
Grant 7,453,128 - Tsutsue , et al. November 18, 2
2008-11-18
Semiconductor wafer with division guide pattern
App 20080203538 - Kumakawa; Takahiro ;   et al.
2008-08-28
Method for fabricating semiconductor device
App 20070287215 - Utsumi; Masaki ;   et al.
2007-12-13
Semiconductor wafer, semiconductor device manufacturing method, and semiconductor device
App 20060163699 - Kumakawa; Takahiro ;   et al.
2006-07-27
Semiconductor device and method for fabricating the same
App 20050098893 - Tsutsue, Makoto ;   et al.
2005-05-12
Lead frame and method for fabricating resin-encapsulated semiconductor device using the same
Grant 6,835,600 - Utsumi , et al. December 28, 2
2004-12-28
Lead frame and method for fabricating resin-encapsulated semiconductor device using the same
App 20030203541 - Utsumi, Masaki ;   et al.
2003-10-30
Lead frame and method for fabricating resin-encapsulated semiconductor device using the same
Grant 6,603,194 - Utsumi , et al. August 5, 2
2003-08-05
Method and system for a distributed network computing system for providing application services
Grant 6,457,040 - Mizuhara , et al. September 24, 2
2002-09-24
Lead frame and method for fabricating resin-encapsulated semiconductor device using the same
App 20020109973 - Utsumi, Masaki ;   et al.
2002-08-15
Method And System For A Distributed Network Computing System For Providing Application Services
App 20020042829 - MIZUHARA, TORU ;   et al.
2002-04-11
Distributed network computing system for data exchange/conversion between terminals
Grant 6,195,677 - Utsumi February 27, 2
2001-02-27
Distributed network computing system, and data exchange apparatus and method and storage medium used in this system
Grant 5,966,451 - Utsumi October 12, 1
1999-10-12

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