Utesch; Nils

Patent Applications and Registrations

Patent applications and USPTO patent grants for Utesch; Nils.The latest application filed is for "pressure-sensitive adhesive compound".

Company Profile

0.7.7

Utesch; Nils - Shanghai CN
Utesch; Nils - Hamburg N/A DE
Utesch; Nils - Chino CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pressure-sensitive adhesive compound Grant 9,080,006 - Utesch July 14, 2	2015-07-14
Adhesive tape, particularly for bonding photovoltaic modules Grant 8,597,447 - Utesch , et al. December 3, 2	2013-12-03
PSA tapes for splicing flat web materials Grant 8,173,252 - Ellringmann , et al. May 8, 2	2012-05-08
Pressure-Sensitive Adhesive Compound App 20120040180 - Husemann; Marc ; et al.	2012-02-16
Pressure-Sensitive Adhesive Compound App 20120028020 - Utesch; Nils	2012-02-02
Bimodal acrylate PSA for bonding low-energy and rough surfaces Grant 7,838,599 - Zollner , et al. November 23, 2	2010-11-23
Adhesive Tape, Particularly For Bonding Photovoltaic Modules App 20100147443 - Utesch; Nils ; et al.	2010-06-17
Use of a double-sided PSA tape for bonding in the production of electronics articles Grant 7,569,278 - Utesch , et al. August 4, 2	2009-08-04
Psa Tapes For Splicing Flat Web Materials App 20090117310 - ELLRINGMANN; KAI ; et al.	2009-05-07
Process for Temporary Fixing of a Polymeric Layer Material on Rough Surfaces App 20080271845 - Keite-Telgenbuscher; Klaus ; et al.	2008-11-06
Bimodal acrylate PSA for bonding low-energy and rough surfaces App 20080027179 - Zollner; Stephan ; et al.	2008-01-31
Use of a double-sided PSA tape for bonding in the production of electronics articles App 20070110941 - Utesch; Nils ; et al.	2007-05-17

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