UTAC - United Test and Assembly Test Center Ltd.
Patent Applications and Registrations
Patent applications and USPTO patent grants for UTAC - United Test and Assembly Test Center Ltd..The latest application filed is for "semiconductor package and method of attaching semiconductor dies to substrates".
- UTAC - United Test and Assembly Test Center Ltd. - Singapore SG
| Patent | Date |
|---|---|
| Multi-chip ball grid array package and method of manufacture Grant 7,851,899 - Chen , et al. December 14, 2 | 2010-12-14 |
| Semiconductor chip package and method of manufacture Grant 7,678,610 - Wang , et al. March 16, 2 | 2010-03-16 |
| Semiconductor Package And Method Of Attaching Semiconductor Dies To Substrates App 20090194871 - Castillo; Denver Paul C. ; et al. | 2009-08-06 |
| Molded high density electronic packaging structure for high performance applications Grant 7,361,995 - Goh , et al. April 22, 2 | 2008-04-22 |
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