Trademark applications and grants for Utac Headquarters Pte L T D. Utac Headquarters Pte L T D has 3 trademark applications. The latest application filed is for "GQFN"
Patent Application | Date |
---|---|
FLIP CHIP SEMICONDUCTOR PACKAGE WITH A LEADFRAME TO ENHANCE PACKAGE MECHANICAL STABILITY AND HEAT DISSIPATION 20220270942 - 17/680308 Charusabha; Nataporn ;   et al. | 2022-08-25 |
SEMICONDUCTOR PACKAGES WITH VERTICAL PASSIVE COMPONENTS 20220208746 - 17/558592 Charoenratpratoom; Jiraphat ;   et al. | 2022-06-30 |
Semiconductor Device and Method of Forming Clip Bond Having Multiple Bond Line Thicknesses 20220208716 - 17/644143 Choi; Hyung Mook ;   et al. | 2022-06-30 |
Semiconductor Device and Method of Forming Leadframe with Clip Bond for Electrical Interconnect 20220208686 - 17/643244 Kasikornrungroj; Natawat ;   et al. | 2022-06-30 |
RELIABLE SEMICONDUCTOR PACKAGES 20220093664 - 17/478978 Punzalan; Jeffrey ;   et al. | 2022-03-24 |
Mark Image Registration | Serial | Trademark Application Date |
---|---|
![]() "GQFN" 5603653 79217820 |
GQFN 2015-08-14 |
![]() "UTAC" 2932323 76466455 |
UTAC 2002-11-13 |
![]() "UTAC" 2857300 76430869 |
UTAC 2002-07-15 |
SEC | 0001722574 | UTAC HEADQUARTERS PTE. LTD. of SINGAPORE |
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