Usukubo; Hideaki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Usukubo; Hideaki.The latest application filed is for "light emitting device and solder bond structure".
- Usukubo; Hideaki - Osaka JP
- USUKUBO; Hideaki - Kagoshima JP
| Patent | Date |
|---|---|
| Light emitting device and solder bond structure Grant 10,546,988 - Hayashi , et al. Ja | 2020-01-28 |
| Light Emitting Device And Solder Bond Structure App 20180159006 - HAYASHI; Masahiro ; et al. | 2018-06-07 |
| Light-emitting Device And Method For Manufacturing Same App 20140151734 - ITO; Kenichi ; et al. | 2014-06-05 |
| Photodetector and a method for the fabrication thereof Grant 5,721,447 - Oosawa , et al. February 24, 1 | 1998-02-24 |
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