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Patent applications and USPTO patent grants for Usuami, Hirohisa.The latest application filed is for "semiconductor manufacturing apparatus, semiconductor manufacturing method and wafer stage".
Patent | Date |
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Semiconductor manufacturing apparatus, semiconductor manufacturing method and wafer stage App 20050095776 - Usuami, Hirohisa | 2005-05-05 |
Process for fabricating a semiconductor integrated circuit device having the multi-layered fin structure Grant 5,661,061 - Usuami , et al. August 26, 1 | 1997-08-26 |
Apparatus for plasma processing Grant 4,985,109 - Otsubo , et al. January 15, 1 | 1991-01-15 |
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