Patent | Date |
---|
Image processing apparatus, image processing method, recording method, and recording medium Grant 8,791,989 - Ushio , et al. July 29, 2 | 2014-07-29 |
Image processing apparatus, image processing method, recording method, and recording medium Grant 8,675,048 - Ushio , et al. March 18, 2 | 2014-03-18 |
Image Display Apparatus And Image Display Method App 20120194905 - USHIO; Yoshijiro ;   et al. | 2012-08-02 |
Image Processing Apparatus, Image Processing Method, Recording Method, And Recording Medium App 20110310097 - Ushio; Yoshijiro ;   et al. | 2011-12-22 |
Image Processing Apparatus, Image Processing Method, Recording Method, And Recording Medium App 20110273543 - USHIO; Yoshijiro ;   et al. | 2011-11-10 |
Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing method Grant 7,203,564 - Senga , et al. April 10, 2 | 2007-04-10 |
Method and device for simulation, method and device for polishing, method and device for preparing control parameters or control program, polishing system, recording medium, and method of manufacturing semiconductor device Grant 7,108,580 - Ushio , et al. September 19, 2 | 2006-09-19 |
Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same Grant 7,052,920 - Ushio , et al. May 30, 2 | 2006-05-30 |
Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing method App 20050176348 - Senga, Tatsuya ;   et al. | 2005-08-11 |
Method and device for simulation, method and device for polishing, method and device for preparing control parameters or control program, polishing system, recording medium, and method of manufacturing semiconductor device App 20040248411 - Ushio, Yoshijiro ;   et al. | 2004-12-09 |
Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device Grant 6,679,756 - Ishikawa , et al. January 20, 2 | 2004-01-20 |
Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same Grant 6,670,200 - Ushio , et al. December 30, 2 | 2003-12-30 |
Polishing body, polishing apparatus, polishing apparatus adjustment method, polished film thickness or polishing endpoint measurement method, and semiconductor device manufacturing method Grant 6,458,014 - Ihsikawa , et al. October 1, 2 | 2002-10-01 |
Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device App 20020127951 - Ishikawa, Akira ;   et al. | 2002-09-12 |
Polishing body, polishing apparatus, polishing apparatus adjustment method, polished film thickness or polishing endpoint measurement method, and semiconductor device manufacturing method App 20020042243 - Ihsikawa, Akira ;   et al. | 2002-04-11 |
Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same App 20020001862 - Ushio, Yoshijiro ;   et al. | 2002-01-03 |
Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same App 20010039064 - Ushio, Yoshijiro ;   et al. | 2001-11-08 |
Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same Grant 6,271,047 - Ushio , et al. August 7, 2 | 2001-08-07 |
Light absorption measurement apparatus and methods Grant 6,108,096 - Ushio , et al. August 22, 2 | 2000-08-22 |
Film inspection method Grant 6,102,775 - Ushio , et al. August 15, 2 | 2000-08-15 |
Apparatus for measuring optical absorption of sample and sample holder applicable to the same Grant 5,673,114 - Ushio September 30, 1 | 1997-09-30 |
Electrochromic device with specific resistances Grant 5,148,306 - Yamada , et al. September 15, 1 | 1992-09-15 |