loadpatents
name:-0.016085863113403
name:-0.016044855117798
name:-0.00042510032653809
Ushio; Yoshijiro Patent Filings

Ushio; Yoshijiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ushio; Yoshijiro.The latest application filed is for "image display apparatus and image display method".

Company Profile
0.15.9
  • Ushio; Yoshijiro - Yokohama N/A JP
  • USHIO; Yoshijiro - Yokohama-shi JP
  • Ushio; Yoshijiro - Kanagawa JP
  • Ushio; Yoshijiro - Yohama JP
  • Ushio; Yoshijiro - Kawasaki JP
  • Ushio; Yoshijiro - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Image processing apparatus, image processing method, recording method, and recording medium
Grant 8,791,989 - Ushio , et al. July 29, 2
2014-07-29
Image processing apparatus, image processing method, recording method, and recording medium
Grant 8,675,048 - Ushio , et al. March 18, 2
2014-03-18
Image Display Apparatus And Image Display Method
App 20120194905 - USHIO; Yoshijiro ;   et al.
2012-08-02
Image Processing Apparatus, Image Processing Method, Recording Method, And Recording Medium
App 20110310097 - Ushio; Yoshijiro ;   et al.
2011-12-22
Image Processing Apparatus, Image Processing Method, Recording Method, And Recording Medium
App 20110273543 - USHIO; Yoshijiro ;   et al.
2011-11-10
Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing method
Grant 7,203,564 - Senga , et al. April 10, 2
2007-04-10
Method and device for simulation, method and device for polishing, method and device for preparing control parameters or control program, polishing system, recording medium, and method of manufacturing semiconductor device
Grant 7,108,580 - Ushio , et al. September 19, 2
2006-09-19
Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
Grant 7,052,920 - Ushio , et al. May 30, 2
2006-05-30
Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing method
App 20050176348 - Senga, Tatsuya ;   et al.
2005-08-11
Method and device for simulation, method and device for polishing, method and device for preparing control parameters or control program, polishing system, recording medium, and method of manufacturing semiconductor device
App 20040248411 - Ushio, Yoshijiro ;   et al.
2004-12-09
Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device
Grant 6,679,756 - Ishikawa , et al. January 20, 2
2004-01-20
Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
Grant 6,670,200 - Ushio , et al. December 30, 2
2003-12-30
Polishing body, polishing apparatus, polishing apparatus adjustment method, polished film thickness or polishing endpoint measurement method, and semiconductor device manufacturing method
Grant 6,458,014 - Ihsikawa , et al. October 1, 2
2002-10-01
Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device
App 20020127951 - Ishikawa, Akira ;   et al.
2002-09-12
Polishing body, polishing apparatus, polishing apparatus adjustment method, polished film thickness or polishing endpoint measurement method, and semiconductor device manufacturing method
App 20020042243 - Ihsikawa, Akira ;   et al.
2002-04-11
Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
App 20020001862 - Ushio, Yoshijiro ;   et al.
2002-01-03
Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
App 20010039064 - Ushio, Yoshijiro ;   et al.
2001-11-08
Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
Grant 6,271,047 - Ushio , et al. August 7, 2
2001-08-07
Light absorption measurement apparatus and methods
Grant 6,108,096 - Ushio , et al. August 22, 2
2000-08-22
Film inspection method
Grant 6,102,775 - Ushio , et al. August 15, 2
2000-08-15
Apparatus for measuring optical absorption of sample and sample holder applicable to the same
Grant 5,673,114 - Ushio September 30, 1
1997-09-30
Electrochromic device with specific resistances
Grant 5,148,306 - Yamada , et al. September 15, 1
1992-09-15

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