USHIKI; Shigeru

Patent Applications and Registrations

Patent applications and USPTO patent grants for USHIKI; Shigeru.The latest application filed is for "three-dimensional circuit board and solder resist composition used for same".

Company Profile

0.6.12

USHIKI; Shigeru - Hiki-gun JP
Ushiki; Shigeru - Saitama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Three-dimensional Circuit Board And Solder Resist Composition Used For Same App 20160360621 - SHIMAMIYA; Ayumu ; et al.	2016-12-08
Photo-curable/thermally curable composition, method for manufacturing cured product thereof, cured product, and printed wiring board including the same Grant 9,453,137 - Choi , et al. September 27, 2	2016-09-27
Photo-curable/thermally Curable Composition, Method For Manufacturing Cured Product Thereof, Cured Product, And Printed Wiring Board Including The Same App 20150064417 - Choi; Sungho ; et al.	2015-03-05
Method For Producing Liquid Ejecting Recording Head App 20120056950 - Igarashi; Koichi ; et al.	2012-03-08
White hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device Grant 8,042,976 - Ushiki , et al. October 25, 2	2011-10-25
Curable Resin Composition For Ink Jet Printer, Cured Product Thereof, And Printed Wiring Board Using The Same App 20110120753 - USHIKI; Shigeru ; et al.	2011-05-26
Composition for forming adhesive pattern, laminated structure obtained by using same, and method of producing such laminated structure Grant 7,829,180 - Ushiki , et al. November 9, 2	2010-11-09
White Heat-hardening Resin Composition, Hardened Material, Printed-wiring Board And Reflection Board For Light Emitting Device App 20090141505 - USHIKI; Shigeru ; et al.	2009-06-04
White Hardening Resin Composition, Hardened Material, Printed-wiring Board And Reflection Board For Light Emitting Device App 20090141504 - USHIKI; Shigeru ; et al.	2009-06-04
Method for producing liquid ejecting recording head Grant 7,472,480 - Igarashi , et al. January 6, 2	2009-01-06
Photocurable and thermosetting composition for ink jet system and printed circuit boards made by use thereof Grant 7,462,653 - Kakinuma , et al. December 9, 2	2008-12-09
Composition For Forming Adhesive Pattern, Laminated Structure Obtained By Using Same, And Method Of Producing Such Laminated Structure App 20080124525 - Ushiki; Shigeru ; et al.	2008-05-29
Curable Resin Composition For Ink Jet Printer, Cured Product Thereof, And Printed Wiring Board Using The Same App 20070270568 - Ushiki; Shigeru ; et al.	2007-11-22
Method For Producing Liquid Ejecting Recording Head App 20070032582 - Igarashi; Koichi ; et al.	2007-02-08
Method For Producing Liquid Ejecting Recording Head App 20070030317 - Igarashi; Koichi ; et al.	2007-02-08
Photocurable and thermosetting composition for ink jet system and printed circuit boards made by use thereof App 20060058412 - Kakinuma; Masahisa ; et al.	2006-03-16
Carboxyl group-containing photosensitive resin, alkali-developable, photocurable and thermosetting composition containing the same, and cured products thereof Grant 6,893,784 - Kohiyama , et al. May 17, 2	2005-05-17
Carboxyl group-containing photosensitive resin, alkali-developable, photocurable and thermosetting composition containing the same, and cured products thereof App 20030215746 - Kohiyama, Noboru ; et al.	2003-11-20

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