Ushiki; Hiroshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ushiki; Hiroshi.The latest application filed is for "conveying apparatus for plate-form members".
- Ushiki; Hiroshi - Iruma JP
- Ushiki, Hiroshi - Iruma-shi JP
- Ushiki; Hiroshi - Saitama JP
- Ushiki; Hiroshi - Tokyo JP
- Ushiki; Hiroshi - Yokohama JP
| Patent | Date |
|---|---|
| Conveying apparatus for plate-form members Grant 6,793,066 - Ushiki , et al. September 21, 2 | 2004-09-21 |
| Conveying apparatus for plate-form members App 20040040823 - Ushiki, Hiroshi ; et al. | 2004-03-04 |
| Method and apparatus for positioning a semiconductor pellet Grant 6,632,703 - Ushiki , et al. October 14, 2 | 2003-10-14 |
| Wire bonding apparatus Grant 6,619,530 - Ushiki , et al. September 16, 2 | 2003-09-16 |
| Method And Apparatus For Positioning A Semiconductor Pellet App 20020175202 - USHIKI, HIROSHI ; et al. | 2002-11-28 |
| Wire bonding apparatus App 20020027152 - Ushiki, Hiroshi ; et al. | 2002-03-07 |
| Apparatus for positioning a semiconductor pellet App 20010005640 - Ushiki, Hiroshi ; et al. | 2001-06-28 |
| Conveying devices used in a semiconductor assembly line Grant 5,397,213 - Ushiki March 14, 1 | 1995-03-14 |
| Device for detecting height of bonding surface Grant 5,046,655 - Ohashi , et al. September 10, 1 | 1991-09-10 |
| Wire bonding method and apparatus Grant 5,044,543 - Yamazaki , et al. September 3, 1 | 1991-09-03 |
| Display control circuit Grant 4,958,151 - Ushiki , et al. September 18, 1 | 1990-09-18 |
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