loadpatents
name:-0.056283950805664
name:-0.10547494888306
name:-0.0020999908447266
Ushikawa; Harunori Patent Filings

Ushikawa; Harunori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ushikawa; Harunori.The latest application filed is for "method for the formation of co film and method for the formation of cu interconnection film".

Company Profile
1.25.16
  • Ushikawa; Harunori - Shizuoka N/A JP
  • Ushikawa; Harunori - Shizuoka-ken JP
  • Ushikawa, Harunori - Tokyo JP
  • Ushikawa; Harunori - Sagamihara JP
  • Ushikawa; Harunori - Gunma JP
  • Ushikawa; Harunori - Kofu JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for forming NiSi film, method for forming silicide film, method for forming metal film for use in silicide-annealing, apparatus for vacuum processing and film-forming apparatus
Grant 8,815,737 - Higuchi , et al. August 26, 2
2014-08-26
Method for the formation of Co film and method for the formation of Cu interconnection film
Grant 8,809,193 - Kumamoto , et al. August 19, 2
2014-08-19
Method for forming tantalum nitride film
Grant 8,796,142 - Gonohe , et al. August 5, 2
2014-08-05
Method for forming Ni film
Grant 8,669,191 - Uehigashi , et al. March 11, 2
2014-03-11
Method for forming Cu electrical interconnection film
Grant 8,476,161 - Kumamoto , et al. July 2, 2
2013-07-02
Purge gas assembly
Grant 8,377,207 - Kagami , et al. February 19, 2
2013-02-19
Method For The Formation Of Co Film And Method For The Formation Of Cu Interconnection Film
App 20130023116 - Kumamoto; Shoichiro ;   et al.
2013-01-24
Method For Forming Ni Film
App 20120264310 - Uehigashi; Toshimitsu ;   et al.
2012-10-18
Method For Forming Nisi Film, Method For Forming Silicide Film, Method For Forming Metal Film For Use In Silicide-annealing, Apparatus For Vacuum Processing And Film-forming Apparatus
App 20120244701 - Higuchi; Yasushi ;   et al.
2012-09-27
Method for forming tantalum nitride film
Grant 8,158,198 - Gonohe , et al. April 17, 2
2012-04-17
Method for forming tantalum nitride film
Grant 8,158,197 - Gonohe , et al. April 17, 2
2012-04-17
Method for forming tantalum nitride film
Grant 8,105,468 - Gonohe , et al. January 31, 2
2012-01-31
Method For Forming Tantalum Nitride Film And Film-forming Apparatus For Forming The Same
App 20110318505 - Yamamoto; Akiko ;   et al.
2011-12-29
Method For Forming Cu Electrical Interconnection Film
App 20110104890 - Kumamoto; Shoichiro ;   et al.
2011-05-05
Method for Forming Tantalum Nitride Film
App 20100206716 - Gonohe; Narishi ;   et al.
2010-08-19
Purge Gas Assembly
App 20100139556 - Kagami; Tsuyoshi ;   et al.
2010-06-10
Method For Forming Tantalum Nitride Film
App 20090246375 - Gonohe; Narishi ;   et al.
2009-10-01
Method for Forming Tantalum Nitride Film
App 20090159430 - Gonohe; Narishi ;   et al.
2009-06-25
Method for Forming Tantalum Nitride Film
App 20090162565 - Gonohe; Narishi ;   et al.
2009-06-25
Method for Forming Tantalum Nitride Film
App 20090159431 - Gonohe; Narishi ;   et al.
2009-06-25
Method for Forming Tantalum Nitride Film
App 20090104775 - Gonohe; Narishi ;   et al.
2009-04-23
Method for Forming Cu Film
App 20090078580 - Yoshihama; Tomoyuki ;   et al.
2009-03-26
Method for Forming Tantalum Nitride Film
App 20080199601 - Gonohe; Narishi ;   et al.
2008-08-21
Capacitor for analog circuit, and manufacturing method thereof
App 20020160577 - Hosoda, Keizo ;   et al.
2002-10-31
Method and device for treating semiconductor with treating gas while substrate is heated
Grant 6,140,256 - Ushikawa October 31, 2
2000-10-31
Single-substrate-processing apparatus in semiconductor processing system
Grant 6,007,633 - Kitamura , et al. December 28, 1
1999-12-28
Transfer apparatus, transfer method, treatment apparatus and treatment method
Grant 5,984,607 - Oosawa , et al. November 16, 1
1999-11-16
Heating device, method of manufacturing the same, and processing apparatus using the same
Grant 5,904,872 - Arami , et al. May 18, 1
1999-05-18
Heat treatment process for preventing slips in semiconductor wafers
Grant 5,775,889 - Kobayashi , et al. July 7, 1
1998-07-07
Processing apparatus
Grant 5,536,320 - Ushikawa , et al. July 16, 1
1996-07-16
Treating device
Grant 5,378,283 - Ushikawa January 3, 1
1995-01-03
Heat treatment apparatus having a wafer boat
Grant 5,310,339 - Ushikawa May 10, 1
1994-05-10
Method of forming a phosphorus doped silicon film
Grant 5,225,378 - Ushikawa July 6, 1
1993-07-06
Method of forming semiconductor film
Grant 5,116,784 - Ushikawa May 26, 1
1992-05-26

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