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Method for manufacturing semiconductor substrate
Grant 10,424,514 - Kato , et al. Sept | 2019-09-24 |
Method For Manufacturing Semiconductor Substrate
App 20180047630 - KATO; Mitsuharu ; et al. | 2018-02-15 |
High-speed semiconductor device and method for manufacturing the same
Grant 8,217,466 - Otsuka , et al. July 10, 2 | 2012-07-10 |
Wiring And Composite Wiring
App 20110042120 - Otsuka; Kanji ; et al. | 2011-02-24 |
Antenna apparatus utilizing aperture of transmission line
Grant 7,872,612 - Otsuka , et al. January 18, 2 | 2011-01-18 |
Electrostatic discharge protection circuit and terminating resistor circuit
Grant 7,791,852 - Otsuka , et al. September 7, 2 | 2010-09-07 |
Method of manufacturing wiring substrate having terminated buses
Grant 7,631,422 - Otsuka , et al. December 15, 2 | 2009-12-15 |
Semiconductor Device and Manufacturing Method Thereof
App 20090096029 - Otsuka; Kanji ; et al. | 2009-04-16 |
Antenna apparatus utilizing aperture of transmission line
App 20080316136 - Otsuka; Kanji ; et al. | 2008-12-25 |
Narrow impedance conversion device
Grant 7,446,625 - Otsuka , et al. November 4, 2 | 2008-11-04 |
Signal transmission apparatus and interconnection structure
Grant 7,446,567 - Otsuka , et al. November 4, 2 | 2008-11-04 |
Electrostatic discharge protection circuit and terminating resistor circuit
App 20080042686 - Otsuka; Kanji ; et al. | 2008-02-21 |
High-speed signal transmission system
Grant 7,295,032 - Otsuka , et al. November 13, 2 | 2007-11-13 |
Semiconductor memory device
Grant 7,280,385 - Otsuka , et al. October 9, 2 | 2007-10-09 |
Narrow impedance conversion device
App 20070176708 - Otsuka; Kanji ; et al. | 2007-08-02 |
Signal transmission system, and signal transmission line
Grant 7,190,188 - Otsuka , et al. March 13, 2 | 2007-03-13 |
Signal transmission system
Grant 7,173,449 - Otsuka , et al. February 6, 2 | 2007-02-06 |
Method of terminating bus,bus termination resistor and wiring subtrate having terminated buses and method of its manufacture
App 20060226927 - Otsuka; Kanji ; et al. | 2006-10-12 |
Method of terminating bus, bus termination resistor, and wiring substrate having terminated buses and method of its manufacture
Grant 7,116,184 - Otsuka , et al. October 3, 2 | 2006-10-03 |
Transmission cable structure for GHz frequency band signals and connector used for transmission of GHz frequency band signals
Grant 7,113,002 - Otsuka , et al. September 26, 2 | 2006-09-26 |
Semiconductor memory device
App 20060203586 - Otsuka; Kanji ; et al. | 2006-09-14 |
Circuit structure and semiconductor integrated circuit
Grant 6,975,489 - Otsuka , et al. December 13, 2 | 2005-12-13 |
Electronic circuit device
Grant 6,961,229 - Otsuka , et al. November 1, 2 | 2005-11-01 |
High-speed signal transmission system
App 20050179465 - Otsuka, Kanji ; et al. | 2005-08-18 |
Wiring structure for transmission line having grooved conductors
Grant 6,914,502 - Otsuka , et al. July 5, 2 | 2005-07-05 |
Signal transmission system, and signal transmission line
App 20050040846 - Otsuka, Kanji ; et al. | 2005-02-24 |
Transmission cable structure for GHz frequency band signals and connector used for transmission of GHz frequency band signals
App 20040227580 - Otsuka, Kanji ; et al. | 2004-11-18 |
Electronic device
Grant 6,812,742 - Otsuka , et al. November 2, 2 | 2004-11-02 |
Electronic circuit device
App 20040207432 - Otsuka, Kanji ; et al. | 2004-10-21 |
Signal transmission apparatus and interconnection structure
App 20040165669 - Otsuka, Kanji ; et al. | 2004-08-26 |
Semiconductor integrated circuit having switching transistors and varactors
Grant 6,731,153 - Otsuka , et al. May 4, 2 | 2004-05-04 |
Driver circuit, receiver circuit, and signal transmission bus system
Grant 6,670,830 - Otsuka , et al. December 30, 2 | 2003-12-30 |
Wiring substrate
Grant 6,630,629 - Otsuka , et al. October 7, 2 | 2003-10-07 |
Circuit structure and semiconductor integrated circuit
App 20030184311 - Otsuka, Kanji ; et al. | 2003-10-02 |
Semiconductor circuit device having power and ground lines adapted for high-frequency operation
Grant 6,625,005 - Otsuka , et al. September 23, 2 | 2003-09-23 |
Signal transmission system
App 20030143964 - Otsuka, Kanji ; et al. | 2003-07-31 |
Electronic device
App 20030132821 - Otsuka, Kanji ; et al. | 2003-07-17 |
Wiring substrate
App 20030006063 - Otsuka, Kanji ; et al. | 2003-01-09 |
Method of terminating bus, bus termination resistor, and wiring substrate having terminated buses and method of its manufacture
App 20020184426 - Otsuka, Kanji ; et al. | 2002-12-05 |
Wiring substrate and process for producing the same
Grant 6,476,330 - Otsuka , et al. November 5, 2 | 2002-11-05 |
Wiring structure for transmission line
App 20020070825 - Otsuka, Kanji ; et al. | 2002-06-13 |
Semiconductor integrated circuit having varactor devices
App 20020044012 - Otsuka, Kanji ; et al. | 2002-04-18 |
Semiconductor circuit device having power and ground lines adapted for high-frequency operation
App 20020008597 - Otsuka, Kanji ; et al. | 2002-01-24 |
Driver circuit, receiver circuit, and signal transmission bus system
App 20010013075 - Otsuka, Kanji ; et al. | 2001-08-09 |
Wiring substrate and process for producing the same
App 20010010272 - Otsuka, Kanji ; et al. | 2001-08-02 |
Wire bonding apparatus
Grant 4,527,730 - Shirai , et al. July 9, 1 | 1985-07-09 |
Method for manufacturing composite sintered structure
Grant 3,978,248 - Usami August 31, 1 | 1976-08-31 |
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