Usami; Sensho

Patent Applications and Registrations

Patent applications and USPTO patent grants for Usami; Sensho.The latest application filed is for "semiconductor device".

Company Profile

3.10.14

Usami; Sensho - Akita JP
Usami; Sensho - Tokyo JP
Usami; Sensho - Akita-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device including two or more chips mounted over wiring substrate Grant 11,069,655 - Usami , et al. July 20, 2	2021-07-20
Semiconductor device Grant 10,537,018 - Usami Ja	2020-01-14
Semiconductor device including semiconductor chips mounted over both surfaces of substrate Grant 10,431,556 - Usami , et al. O	2019-10-01
Semiconductor Device App 20190254160 - Usami; Sensho	2019-08-15
Semiconductor device Grant 10,342,118 - Usami	2019-07-02
Semiconductor Device Including Two Or More Chips Mounted Over Wiring Substrate App 20180076173 - Usami; Sensho ; et al.	2018-03-15
Semiconductor Device Including Semiconductor Chips Mounted Over Both Surfaces Of Substrate App 20170373021 - Usami; Sensho ; et al.	2017-12-28
Semiconductor device including two or more chips mounted over wiring substrate Grant 9,837,377 - Usami , et al. December 5, 2	2017-12-05
Semiconductor device including semiconductor chips mounted over both surfaces of substrate Grant 9,799,611 - Usami , et al. October 24, 2	2017-10-24
Semiconductor device including semiconductor chips stacked over substrate Grant 9,748,204 - Usami , et al. August 29, 2	2017-08-29
Semiconductor device including plural semiconductor chips stacked on substrate Grant 9,601,447 - Usami March 21, 2	2017-03-21
Method For Manufacturing Semiconductor Device App 20170005020 - Usami; Sensho	2017-01-05
Semiconductor Device Including Semiconductor Chips Mounted Over Both Surfaces Of Substrate App 20160343675 - Usami; Sensho ; et al.	2016-11-24
Semiconductor device including semiconductor chips mounted over both surfaces of substrate Grant 9,418,968 - Usami , et al. August 16, 2	2016-08-16
Method for manufacturing semiconductor device Grant 9,418,907 - Usami August 16, 2	2016-08-16
Semiconductor Device Including Semiconductor Chips Stacked Over Substrate App 20160064358 - Usami; Sensho ; et al.	2016-03-03
Semiconductor Device App 20160050748 - Usami; Sensho	2016-02-18
Method For Manufacturing Semiconductor Device App 20150357251 - Usami; Sensho	2015-12-10
Semiconductor Device Including Plural Semiconductor Chips Stacked On Substrate App 20150340311 - Usami; Sensho	2015-11-26
Semiconductor Device Including Semiconductor Chips Mounted Over Both Surfaces Of Substrate App 20150279820 - Usami; Sensho ; et al.	2015-10-01
Semiconductor Device Including Two Or More Chips Mounted Over Wiring Substrate App 20150108637 - Usami; Sensho ; et al.	2015-04-23
Semiconductor Device App 20140008775 - USAMI; Sensho ; et al.	2014-01-09
Method Of Manufacturing Semiconductor Device App 20130137217 - KINDO; Osamu ; et al.	2013-05-30
Semiconductor Device And Method Of Manufacturing The Same App 20120273971 - USAMI; Sensho	2012-11-01

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