USA; DAISUKE
Patent Applications and Registrations
Patent applications and USPTO patent grants for USA; DAISUKE.The latest application filed is for "solid electrolytic capacitor and method for manufacturing same".
- USA; DAISUKE - Osaka JP
- USA; Daisuke - Tokyo JP
- USA; Daisuke - Amagasaki-shi JP
| Patent | Date |
|---|---|
| Solid Electrolytic Capacitor And Method For Manufacturing Same App 20220102081 - HIROTA; KEI ; et al. | 2022-03-31 |
| Molded Article And Method For Manufacturing Molded Article App 20210199860 - USA; Daisuke ; et al. | 2021-07-01 |
| Laminate, Molded Article And Method For Producing Same App 20200384743 - USA; Daisuke ; et al. | 2020-12-10 |
| Polyorganosilsesquioxane, Transfer Film, In-mold Molded Article, And Hard Coat Film App 20200079910 - SHIBAMOTO; Akihiro ; et al. | 2020-03-12 |
| Adhesive Composition, Cured Product, Laminate, And Device App 20200071579 - SHIBAMOTO; Akihiro ; et al. | 2020-03-05 |
| Transfer Mold Releasing Film And Method For Manufacturing Matte Molded Body App 20200031089 - SUGAWARA; Yoshitaka ; et al. | 2020-01-30 |
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