Urushima; Michitaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Urushima; Michitaka.The latest application filed is for "semiconductor device and manufacturing method of the same".

Company Profile

0.6.4

Urushima; Michitaka - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and manufacturing method of the same Grant 6,791,195 - Urushima September 14, 2	2004-09-14
Semiconductor device and manufacturing method of the same App 20020132463 - Urushima, Michitaka	2002-09-19
Semiconductor package and semiconductor package fabrication method App 20020072152 - Urushima, Michitaka	2002-06-13
Semiconductor package and semiconductor package fabrication method Grant 6,372,549 - Urushima April 16, 2	2002-04-16
Semiconductor device and manufacturing method of the same App 20010036711 - Urushima, Michitaka	2001-11-01
Semiconductor package and semiconductor package fabrication method App 20010034082 - Urushima, Michitaka	2001-10-25
Semiconductor package fabricated by using automated bonding tape Grant 5,869,887 - Urushima February 9, 1	1999-02-09
Bonding tool employed in ultrasonic compression bonding apparatus Grant 5,503,321 - Urushima April 2, 1	1996-04-02
Process of mounting tape automated bonded semiconductor chip on printed circuit board through bumps Grant 5,474,957 - Urushima December 12, 1	1995-12-12
Film carrier semiconductor device Grant 5,350,947 - Takekawa , et al. September 27, 1	1994-09-27

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