Urayama; Daisuke
Patent Applications and Registrations
Patent applications and USPTO patent grants for Urayama; Daisuke.The latest application filed is for "substrate processing apparatus and substrate processing method".
- Urayama; Daisuke - Miyagi JP
- URAYAMA; Daisuke - Kurokawa-gun Miyagi
| Patent | Date |
|---|---|
| Substrate processing apparatus and substrate processing method Grant 10,923,329 - Nishimura , et al. February 16, 2 | 2021-02-16 |
| Method for etching copper layer Grant 10,825,688 - Tahara , et al. November 3, 2 | 2020-11-03 |
| Substrate Processing Apparatus And Substrate Processing Method App 20200111646 - NISHIMURA; Eiichi ; et al. | 2020-04-09 |
| Method For Etching Copper Layer App 20190272997 - TAHARA; Shigeru ; et al. | 2019-09-05 |
| Plasma processing method and plasma processing apparatus Grant 9,660,182 - Sone , et al. May 23, 2 | 2017-05-23 |
| Substrate Processing Apparatus And Substrate Processing Method App 20150132970 - Nishimura; Eiichi ; et al. | 2015-05-14 |
| Plasma Processing Method And Plasma Processing Apparatus App 20150050750 - Sone; Takashi ; et al. | 2015-02-19 |
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