Urashima; Kazuhiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Urashima; Kazuhiro.The latest application filed is for "cutting insert and cutting tool".

Company Profile

0.14.13

Urashima; Kazuhiro - Konan N/A JP
Urashima; Kazuhiro - Aichi JP
Urashima; Kazuhiro - Kounan JP
URASHIMA; Kazuhiro - Konan-shi JP
Urashima; Kazuhiro - Kounan city JP
Urashima; Kazuhiro - Aichiken JP
Urashima, Kazuhiro - Kounan-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing a wiring board Grant 8,863,378 - Muramatsu , et al. October 21, 2	2014-10-21
Cutting Insert And Cutting Tool App 20110182682 - Abukawa; Kohei ; et al.	2011-07-28
Wiring board and capacitor to be built into wiring board Grant 7,973,245 - Muramatsu , et al. July 5, 2	2011-07-05
Aluminum oxide-based composite sintered body and cutting insert Grant 7,951,737 - Nakayama , et al. May 31, 2	2011-05-31
Ceramic capacitor Grant 7,889,509 - Urashima , et al. February 15, 2	2011-02-15
Wiring board and capacitor Grant 7,742,314 - Urashima , et al. June 22, 2	2010-06-22
Wiring Board And Manufacturing Method Of Wiring Board App 20100139090 - MURAMATSU; Masaki ; et al.	2010-06-10
Wiring board and manufacturing method of wiring board Grant 7,696,442 - Muramatsu , et al. April 13, 2	2010-04-13
Aluminum Oxide-based Composite Sintered Body And Cutting Insert App 20090197073 - Nakayama; Hiroko ; et al.	2009-08-06
Wiring board construction including embedded ceramic capacitors(s) Grant 7,473,988 - Urashima , et al. January 6, 2	2009-01-06
Wiring Board And Capacitor To Be Built Into Wiring Board App 20080223607 - MURAMATSU; Masaki ; et al.	2008-09-18
Wiring substrate and bonding pad composition Grant 7,388,296 - Urashima , et al. June 17, 2	2008-06-17
Wiring board and capacitor to be built into wiring board Grant 7,345,246 - Muramatsu , et al. March 18, 2	2008-03-18
Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate Grant 7,317,165 - Saiki , et al. January 8, 2	2008-01-08
Wiring board and capacitor App 20070076392 - Urashima; Kazuhiro ; et al.	2007-04-05
Ceramic capacitor App 20070064375 - Urashima; Kazuhiro ; et al.	2007-03-22
Wiring board construction including embedded ceramic capacitors(s) App 20070045815 - Urashima; Kazuhiro ; et al.	2007-03-01
Wiring substrate App 20060280919 - Urashima; Kazuhiro ; et al.	2006-12-14
Wiring board and manufacturing method of wiring board App 20060272853 - Muramatsu; Masaki ; et al.	2006-12-07
Wiring board and capacitor to be built into wiring board App 20060175083 - Muramatsu; Masaki ; et al.	2006-08-10
Ceramic sintered body and process for producing the same Grant 7,037,870 - Yamamoto , et al. May 2, 2	2006-05-02
Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate App 20050023033 - Saiki, Hajime ; et al.	2005-02-03
Sintered alumina ceramic, method for producing the same, and cutting tool Grant 6,753,284 - Yamamoto , et al. June 22, 2	2004-06-22
Ceramic sintered body and process for producing the same App 20030181310 - Yamamoto, Hiroshi ; et al.	2003-09-25
Sintered alumina ceramic, method for producing the same, and cutting tool App 20030027707 - Yamamoto, Hiroshi ; et al.	2003-02-06
Silicon nitride based sintered material and method for producing same Grant 5,908,797 - Urashima , et al. June 1, 1	1999-06-01

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