| Patent | Date |
|---|
Method Of Manufacturing A Light Emitting Device
App 20220123187 - URASAKI; Naoyuki ; et al. | 2022-04-21 |
Light Emitting Device
App 20220123186 - URASAKI; Naoyuki ; et al. | 2022-04-21 |
Optical Semiconductor Element Mounting Package And Optical Semiconductor Device Using The Same
App 20210296545 - URASAKI; Naoyuki ; et al. | 2021-09-23 |
Method Of Manufacturing An Optical Semiconductor Device
App 20210296546 - URASAKI; Naoyuki ; et al. | 2021-09-23 |
Optical Semiconductor Element Mounting Package And Optical Semiconductor Device Using The Same
App 20210159374 - URASAKI; Naoyuki ; et al. | 2021-05-27 |
Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
Grant 10,950,767 - Urasaki , et al. March 16, 2 | 2021-03-16 |
Light-emitting Device And Method Of Preparing Same, Optical Semiconductor Element Mounting Package, And Optical Semiconductor De
App 20190252582 - Urasaki; Naoyuki ; et al. | 2019-08-15 |
Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflection
Grant 10,381,533 - Kotani , et al. A | 2019-08-13 |
Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
Grant 10,326,063 - Urasaki , et al. | 2019-06-18 |
Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
Grant 10,205,072 - Urasaki , et al. Feb | 2019-02-12 |
Light-emitting Device And Method Of Preparing Same, Optical Semiconductor Element Mounting Package, And Optical Semiconductor Device Using The Same
App 20180130931 - Urasaki; Naoyuki ; et al. | 2018-05-10 |
Light-emitting Device And Method Of Preparing Same, Optical Semiconductor Element Mounting Package, And Optical Semiconductor Device Using The Same
App 20170263832 - Urasaki; Naoyuki ; et al. | 2017-09-14 |
Optical semiconductor element mounting package, and optical semiconductor device using the same
Grant 9,673,362 - Urasaki June 6, 2 | 2017-06-06 |
Optical semiconductor element mounting package, and optical semiconductor device using the same
Grant 9,660,156 - Urasaki , et al. May 23, 2 | 2017-05-23 |
Optical semiconductor element mounting package, and optical semiconductor device using the same
Grant 9,608,184 - Urasaki , et al. March 28, 2 | 2017-03-28 |
Optical Semiconductor Element Mounting Substrate And Optical Semiconductor Device Using Thermosetting Resin Composition For Light Reflection
App 20170040513 - Kotani; Hayato ; et al. | 2017-02-09 |
Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition
Grant 9,387,608 - Kotani , et al. July 12, 2 | 2016-07-12 |
Optical Semiconductor Element Mounting Package, And Optical Semiconductor Device Using The Same
App 20160035951 - Urasaki; Naoyuki ; et al. | 2016-02-04 |
Optical semiconductor element mounting package, and optical semiconductor device using the same
Grant 9,076,932 - Urasaki , et al. July 7, 2 | 2015-07-07 |
Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
Grant 9,067,906 - Kotani , et al. June 30, 2 | 2015-06-30 |
Optical Semiconductor Element Mounting Package, And Optical Semiconductor Device Using The Same
App 20140319569 - Urasaki; Naoyuki ; et al. | 2014-10-30 |
Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device
Grant 8,785,525 - Kotani , et al. July 22, 2 | 2014-07-22 |
Thermosetting Resin Composition, Epoxy Resin Molding Material, And Polyvalent Carboxylic Acid Condensate
App 20140128621 - KOTANI; Hayato ; et al. | 2014-05-08 |
Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
Grant 8,637,593 - Kotani , et al. January 28, 2 | 2014-01-28 |
Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
Grant 8,585,272 - Kotani , et al. November 19, 2 | 2013-11-19 |
Electronic device incorporating the white resin
Grant 8,421,113 - Urasaki , et al. April 16, 2 | 2013-04-16 |
Method of using white resin in an electronic device
Grant 8,367,153 - Urasaki , et al. February 5, 2 | 2013-02-05 |
Substrate For Mounting Optical Semiconductor Element And Manufacturing Method Thereof, Optical Semiconductor Device And Manufacturing Method For Thereof
App 20130001622 - KOTANI; Hayato ; et al. | 2013-01-03 |
Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device
Grant 8,343,616 - Urasaki , et al. January 1, 2 | 2013-01-01 |
Substrate for mounting an optical semiconductor element, manufacturing method thereof, an optical semiconductor device, and manufacturing method thereof
Grant 8,212,271 - Kotani , et al. July 3, 2 | 2012-07-03 |
Wiring Board, Electronic Device Package, And Methods Of Production Of The Same
App 20110297424 - Yoshida; Hideki ; et al. | 2011-12-08 |
Method of using white resin in an electronic device
App 20110294241 - URASAKI; Naoyuki ; et al. | 2011-12-01 |
Electronic device incorporating the white resin
App 20110284915 - Urasaki; Naoyuki ; et al. | 2011-11-24 |
Coating Agent, Substrate For Mounting Optical Semiconductor Element Using Same, And Optical Semiconductor Device
App 20110278630 - Urasaki; Naoyuki ; et al. | 2011-11-17 |
Optical Semiconductor Element Mounting Package, And Optical Semiconductor Device Using The Same
App 20110241055 - Urasaki; Naoyuki ; et al. | 2011-10-06 |
Thermosetting Resin Composition, Epoxy Resin Molding Material, And Polyvalent Carboxylic Acid Condensate
App 20110039978 - Kotani; Hayato ; et al. | 2011-02-17 |
Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
App 20110031527 - Kotani; Hayato ; et al. | 2011-02-10 |
Thermosetting Light-reflecting Resin Composition, Optical Semiconductor Element Mounting Board Produced Therewith, Method For Manufacture Thereof, And Optical Semiconductor Device
App 20100200882 - Kotani; Hayato ; et al. | 2010-08-12 |
Thermosetting Resin Composition For Light Reflection, Method For Manufacturing The Resin Composition And Optical Semiconductor Element Mounting Substrate And Optical Semiconductor Device Using The Resin Composition
App 20100140638 - Kotani; Hayato ; et al. | 2010-06-10 |
Optical Semiconductor Element Mounting Package, And Optical Semiconductor Device Using The Same
App 20090315049 - Urasaki; Naoyuki ; et al. | 2009-12-24 |
Substrate for mounting an optical semiconductor element, manufacturing method thereof, an optical semiconductor device, and manufacturing method thereof
App 20090095969 - Kotani; Hayato ; et al. | 2009-04-16 |
Substrate for mounting semiconductor chips
Grant 6,281,450 - Urasaki , et al. August 28, 2 | 2001-08-28 |
Production of insulating varnishes and multilayer printed circuit boards using these varnishes
Grant 6,197,149 - Kobayashi , et al. March 6, 2 | 2001-03-06 |
Process for producing multilayer printed circuit board for wire bonding
Grant 5,879,568 - Urasaki , et al. March 9, 1 | 1999-03-09 |
Metal foil for printed wiring board and production thereof
Grant 5,689,879 - Urasaki , et al. November 25, 1 | 1997-11-25 |
Process for producing a printed wiring board
Grant 5,638,598 - Nakaso , et al. June 17, 1 | 1997-06-17 |
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