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Urakawa; Toshiya Patent Filings

Urakawa; Toshiya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Urakawa; Toshiya.The latest application filed is for "semiconductor wafer surface protecting sheet and semiconductor wafer protecting method using such protecting sheet".

Company Profile
0.1.3
  • Urakawa; Toshiya - Nagoya-shi JP
  • Urakawa; Toshiya - Sodegaura JP
  • Urakawa, Toshiya - Sodegaura-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor wafer surface protecting sheet and semiconductor wafer protecting method using such protecting sheet
App 20080020575 - Saimoto; Yoshihisa ;   et al.
2008-01-24
Circuit board and method of producing the same
Grant 6,764,747 - Urakawa , et al. July 20, 2
2004-07-20
Circuit board and method of producing the same
App 20030129371 - Urakawa, Toshiya ;   et al.
2003-07-10
Epoxy resin composition and its use
App 20030087992 - Togashi, Eiki ;   et al.
2003-05-08

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