Uppal; Aastha

Patent Applications and Registrations

Patent applications and USPTO patent grants for Uppal; Aastha.The latest application filed is for "thermally enhanced silicon back end layers for improved thermal performance".

Company Profile

11.2.17

Uppal; Aastha - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interposer package-on-package (PoP) with solder array thermal contacts Grant 11,387,175 - Mallik , et al. July 12, 2	2022-07-12
Thermally Enhanced Silicon Back End Layers For Improved Thermal Performance App 20210391244 - JHA; Chandra Mohan ; et al.	2021-12-16
Substrate Cooling Using Heat Pipe Vapor Chamber Stiffener And Ihs Legs App 20210259134 - UPPAL; Aastha ; et al.	2021-08-19
Heat Dissipation Devices Having Thermal Interface Material Containment Structures App 20210249326 - Uppal; Aastha ; et al.	2021-08-12
Heat Dissipation Device Having Shielding/containment Extensions App 20210235596 - Uppal; Aastha ; et al.	2021-07-29
Integrated Circuit Assemblies Having Metal Foam Structures App 20210233832 - Uppal; Aastha ; et al.	2021-07-29
Embedded Substrate Heat Sink For Bottom Side Cooling App 20210111091 - UPPAL; Aastha ; et al.	2021-04-15
Thermoelectric Coolers Combined With Phase-change Material In Integrated Circuit Packages App 20200294884 - Shaikh; Javed ; et al.	2020-09-17
Coupled Cooling Fins In Ultra-small Systems App 20200273772 - Uppal; Aastha ; et al.	2020-08-27
Active Package Cooling Structures Using Molded Substrate Packaging Technology App 20200273775 - Karhade; Omkar ; et al.	2020-08-27
Crystalline Carbon Heat Spreading Materials For Ic Die Hot Spot Reduction App 20200273768 - Karhade; Omkar ; et al.	2020-08-27
Ic Die Package Thermal Spreader And Emi Shield Comprising Graphite App 20200273811 - Mallik; Debendra ; et al.	2020-08-27
Thermal Management Solutions For Integrated Circuit Packages App 20200227332 - Singh; Kumar Abhishek ; et al.	2020-07-16
Phase Change Materials For Electromagnetic Interference Shielding And Heat Dissipation In Integrated Circuit Assemblies App 20200219790 - Uppal; Aastha ; et al.	2020-07-09
Thermal Management Solutions For Integrated Circuit Assemblies Using Phase Change Materials App 20200219789 - Uppal; Aastha ; et al.	2020-07-09
Apparatus for inspection of a package assembly with a thermal solution Grant 10,600,699 - Uppal , et al.	2020-03-24
Interposer Package-on-package (pop) With Solder Array Thermal Contacts App 20200051899 - MALLIK; Debendra ; et al.	2020-02-13
Thermally-optimized Tunable Stack In Cavity Package-on-package App 20200043894 - VAKANAS; George ; et al.	2020-02-06
Apparatus For Inspection Of A Package Assembly With A Thermal Solution App 20190067135 - Uppal; Aastha ; et al.	2019-02-28

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