| Patent | Date |
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Integrated Circuit Device And Oscillator
App 20220294391 - Uno; Tomohiro | 2022-09-15 |
Information processing apparatus and recording medium storing information processing program
Grant 11,429,286 - Furuta , et al. August 30, 2 | 2022-08-30 |
Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
App 20220266396 - OYAMADA; Tetsuya ; et al. | 2022-08-25 |
Bonding wire for semiconductor device
Grant 11,373,934 - Oda , et al. June 28, 2 | 2022-06-28 |
Data processing apparatus, non-transitory computer-readable storage medium, and data processing method
Grant 11,372,576 - Uno , et al. June 28, 2 | 2022-06-28 |
Bonding wire for semiconductor devices
Grant 11,342,299 - Oda , et al. May 24, 2 | 2022-05-24 |
Bonding Wire
App 20220157766 - YAMADA; Takashi ; et al. | 2022-05-19 |
Al Bonding Wire
App 20220152749 - YAMADA; Takashi ; et al. | 2022-05-19 |
Bonding Wire For Semiconductor Devices
App 20220108971 - ODA; Daizo ; et al. | 2022-04-07 |
Information Processing Device And Non-transitory Computer-readable Storage Medium
App 20220043592 - Yamashita; Shota ; et al. | 2022-02-10 |
Three-dimensional memory device containing compositionally graded word line diffusion barrier layer for and methods of forming the same
Grant 11,217,532 - Sharangpani , et al. January 4, 2 | 2022-01-04 |
Oscillation circuit, oscillator, electronic apparatus, and vehicle
Grant 11,063,557 - Uno July 13, 2 | 2021-07-13 |
Circuit apparatus, oscillator, electronic instrument, and vehicle
Grant 11,038,460 - Uno , et al. June 15, 2 | 2021-06-15 |
Data Processing Apparatus, Non-transitory Computer-readable Storage Medium, And Data Processing Method
App 20210173581 - UNO; Tomohiro ; et al. | 2021-06-10 |
Information Processing Apparatus And Recording Medium Storing Information Processing Program
App 20210132824 - Furuta; Tomonori ; et al. | 2021-05-06 |
Cu alloy bonding wire for semiconductor device
Grant 10,991,672 - Oyamada , et al. April 27, 2 | 2021-04-27 |
Cu alloy bonding wire for semiconductor device
Grant 10,985,130 - Oyamada , et al. April 20, 2 | 2021-04-20 |
Selective emitter for thermophotovoltaic power generator
Grant 10,978,988 - Tokumaru , et al. April 13, 2 | 2021-04-13 |
Composite Ceramic Layered Body And Manufacturing Method
App 20210101840 - KIMURA; Keiichi ; et al. | 2021-04-08 |
Circuit Apparatus, Oscillator, Electronic Instrument, And Vehicle
App 20210083623 - UNO; Tomohiro ; et al. | 2021-03-18 |
Bonding wire for semiconductor device
Grant 10,950,570 - Oyamada , et al. March 16, 2 | 2021-03-16 |
Bonding wire for semiconductor device
Grant 10,950,571 - Oyamada , et al. March 16, 2 | 2021-03-16 |
Information Processing Apparatus And Computer-readable Recording Medium Recording Information Processing Program
App 20210072899 - Furuta; Tomonori ; et al. | 2021-03-11 |
Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
App 20210043599 - Oyamada; Tetsuya ; et al. | 2021-02-11 |
Ceramic laminate
Grant 10,889,900 - Tokuhashi , et al. January 12, 2 | 2021-01-12 |
Ceramic laminate, ceramic insulating substrate, and method for manufacturing ceramic laminate
Grant 10,889,899 - Kimura , et al. January 12, 2 | 2021-01-12 |
Bonding Wire For Semiconductor Device
App 20200373226 - ODA; Daizo ; et al. | 2020-11-26 |
Ferritic stainless steel foil
Grant 10,844,457 - Unno , et al. November 24, 2 | 2020-11-24 |
Bonding wire for semiconductor device
Grant 10,840,208 - Oyamada , et al. November 17, 2 | 2020-11-17 |
Oscillation Circuit, Oscillator, Electronic Apparatus, And Vehicle
App 20200313613 - UNO; Tomohiro | 2020-10-01 |
Copper Alloy Bonding Wire For Semiconductor Devices
App 20200312808 - ODA; Daizo ; et al. | 2020-10-01 |
Stainless steel foil
Grant 10,786,974 - Unno , et al. September 29, 2 | 2020-09-29 |
Data presence/absence determination apparatus and computer-readable storage medium storing program for determination of data presence/absence
Grant 10,789,228 - Nagao , et al. September 29, 2 | 2020-09-29 |
Cu alloy bonding wire for semiconductor device
Grant 10,790,259 - Oyamada , et al. September 29, 2 | 2020-09-29 |
Circuit device, oscillator, electronic apparatus, and vehicle
Grant 10,771,011 - Uno Sep | 2020-09-08 |
Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
App 20200279824 - OYAMADA; Tetsuya ; et al. | 2020-09-03 |
Bonding wire for semiconductor device
Grant 10,737,356 - Yamada , et al. A | 2020-08-11 |
Cu alloy core bonding wire with Pd coating for semiconductor device
Grant 10,672,733 - Yamada , et al. | 2020-06-02 |
Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
App 20200168578 - OYAMADA; Tetsuya ; et al. | 2020-05-28 |
Selective Emitter For Thermophotovoltaic Power Generator
App 20200127596 - TOKUMARU; Shinji ; et al. | 2020-04-23 |
Bonding wire for semiconductor device
Grant 10,610,976 - Yamada , et al. | 2020-04-07 |
Three-dimensional memory device containing compositionally graded word line diffusion barrier layer for and methods of forming the same
Grant 10,615,123 - Hinoue , et al. | 2020-04-07 |
Ceramic Laminate, Ceramic Insulating Substrate, And Method For Manufacturing Ceramic Laminate
App 20200071836 - KIMURA; Keiichi ; et al. | 2020-03-05 |
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
App 20200013747 - YAMADA; Takashi ; et al. | 2020-01-09 |
Bonding Wire For Semiconductor Device
App 20200013748 - YAMADA; Takashi ; et al. | 2020-01-09 |
Bonding wire for semiconductor device
Grant 10,529,683 - Oyamada , et al. J | 2020-01-07 |
Cu alloy core bonding wire with Pd coating for semiconductor device
Grant 10,497,663 - Yamada , et al. De | 2019-12-03 |
Information Processing System And Information Processing Apparatus
App 20190361850 - UNO; Tomohiro ; et al. | 2019-11-28 |
Bonding wire for semiconductor device
Grant 10,468,370 - Yamada , et al. No | 2019-11-05 |
Circuit Device, Oscillator, Electronic Apparatus, And Vehicle
App 20190326855 - UNO; Tomohiro | 2019-10-24 |
Bonding Wire For Semiconductor Device
App 20190326246 - OYAMADA; Tetsuya ; et al. | 2019-10-24 |
Three-dimensional Memory Device Containing Compositionally Graded Word Line Diffusion Barrier Layer For And Methods Of Forming T
App 20190287982 - HINOUE; Tatsuya ; et al. | 2019-09-19 |
Three-dimensional Memory Device Containing Compositionally Graded Word Line Diffusion Barrier Layer For And Methods Of Forming T
App 20190287916 - SHARANGPANI; Rahul ; et al. | 2019-09-19 |
Bonding wire for semiconductor device
Grant 10,414,002 - Yamada , et al. Sept | 2019-09-17 |
Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium
Grant 10,381,320 - Oyamada , et al. A | 2019-08-13 |
Austenitic stainless steel foil
Grant 10,323,294 - Unno , et al. | 2019-06-18 |
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
App 20190164927 - YAMADA; Takashi ; et al. | 2019-05-30 |
Data Processing Apparatus And Computer-readable Storage Medium Storing Program For Data Processing
App 20190155927 - NAGAO; Takuya ; et al. | 2019-05-23 |
Cu alloy core bonding wire with Pd coating for semiconductor device
Grant 10,236,272 - Yamada , et al. | 2019-03-19 |
Ceramic Laminate
App 20190062923 - TOKUHASHI; Keisuke ; et al. | 2019-02-28 |
Thermophotovoltaic Conversion Member
App 20190068108 - UNO; Tomohiro ; et al. | 2019-02-28 |
Bonding Wire For Semiconductor Devices
App 20180374816 - ODA; Daizo ; et al. | 2018-12-27 |
Bonding Wire For Semiconductor Device
App 20180374815 - OYAMADA; Tetsuya ; et al. | 2018-12-27 |
Bonding wire for semiconductor device
Grant 10,137,534 - Yamada , et al. November 27, 2 | 2018-11-27 |
Resistive random access memory device containing discrete memory material portions and method of making thereof
Grant 10,121,965 - Uno , et al. November 6, 2 | 2018-11-06 |
Method for forming ball in bonding wire
Grant 10,121,764 - Araki , et al. November 6, 2 | 2018-11-06 |
Bonding wire for semiconductor device
Grant 10,121,758 - Oda , et al. November 6, 2 | 2018-11-06 |
Methods and apparatus for three-dimensional nonvolatile memory
Grant 10,115,899 - Yoshida , et al. October 30, 2 | 2018-10-30 |
Ferritic Stainless Steel Foil
App 20180282834 - UNNO; Hiroto ; et al. | 2018-10-04 |
Storage device, storage system and non-transitory computer-readable storage medium for mirroring of data
Grant 10,089,201 - Yamashita , et al. October 2, 2 | 2018-10-02 |
Austenitic Stainless Steel Foil
App 20180237882 - UNNO; Hiroto ; et al. | 2018-08-23 |
Stainless Steel Foil
App 20180229476 - UNNO; Hiroto ; et al. | 2018-08-16 |
Bonding wire for semiconductor device
Grant 10,032,741 - Oda , et al. July 24, 2 | 2018-07-24 |
Bonding Wire For Semiconductor Device
App 20180133843 - YAMADA; Takashi ; et al. | 2018-05-17 |
Bonding Wire For Semiconductor Device
App 20180130763 - YAMADA; Takashi ; et al. | 2018-05-10 |
Bonding Wire For Semiconductor Device
App 20180122765 - ODA; Daizo ; et al. | 2018-05-03 |
Method For Forming Ball In Bonding Wire
App 20180096965 - ARAKI; Noritoshi ; et al. | 2018-04-05 |
Bonding wire for semiconductor device
Grant 9,887,172 - Oda , et al. February 6, 2 | 2018-02-06 |
Conductive Joining Material And Conductive Joining Structure Which Use Metal Particles And Conductive Material Particles
App 20180033760 - ISHIKAWA; Shinji ; et al. | 2018-02-01 |
Oriented copper plate, copper-clad laminate, flexible circuit board, and electronic device
Grant 9,883,588 - Kimura , et al. January 30, 2 | 2018-01-30 |
Bonding Wire For Semiconductor Device
App 20170365576 - OYAMADA; Tetsuya ; et al. | 2017-12-21 |
Oriented Copper Plate, Copper-clad Laminate, Flexible Circuit Board, And Electronic Device
App 20170332489 - KIMURA; Keiichi ; et al. | 2017-11-16 |
Bonding Wire For Semiconductor Device
App 20170323864 - ODA; Daizo ; et al. | 2017-11-09 |
Bonding wire for semiconductor devices
Grant 9,812,421 - Uno , et al. November 7, 2 | 2017-11-07 |
Conductive Bonded Assembly Of Electronic Component, Semiconductor Device Using Same, And Method Of Production Of Conductive Bonded Assembly
App 20170317048 - MATSUBARA; Norie ; et al. | 2017-11-02 |
Bonding wire for semiconductor device
Grant 9,773,748 - Yamada , et al. September 26, 2 | 2017-09-26 |
Bonding Wire For Semiconductor Device
App 20170216974 - YAMADA; Takashi ; et al. | 2017-08-03 |
Bonding Wire For Semiconductor Device
App 20170200689 - YAMADA; Takashi ; et al. | 2017-07-13 |
Bonding Wire For Semiconductor Device
App 20170200690 - YAMADA; Takashi ; et al. | 2017-07-13 |
Bonding Wire For Semiconductor Device
App 20170194280 - ODA; Daizo ; et al. | 2017-07-06 |
Bonding Wire For Semiconductor Device
App 20170179064 - YAMADA; Takashi ; et al. | 2017-06-22 |
Bonding Wire For Semiconductor Device
App 20170117244 - YAMADA; Takashi ; et al. | 2017-04-27 |
Bonding Wire For Semiconductor Device
App 20170110430 - OYAMADA; Tetsuya ; et al. | 2017-04-20 |
Bonding Wire For Semiconductor Device
App 20170040281 - OYAMADA; Tetsuya ; et al. | 2017-02-09 |
Bonding wire for semiconductor device use and method of production of same
Grant 9,543,266 - Yamada , et al. January 10, 2 | 2017-01-10 |
Bonding wire for semiconductor device use and method of production of same
Grant 9,536,854 - Yamada , et al. January 3, 2 | 2017-01-03 |
Oscillator, electronic apparatus, and moving object
Grant 9,515,664 - Yonezawa , et al. December 6, 2 | 2016-12-06 |
Bonding Wire For Semiconductor Devices
App 20160315063 - UNO; Tomohiro ; et al. | 2016-10-27 |
Copper alloy bonding wire for semiconductor
Grant 9,427,830 - Uno , et al. August 30, 2 | 2016-08-30 |
Oscillator, Electronic Apparatus, And Moving Object
App 20160226497 - YONEZAWA; Takemi ; et al. | 2016-08-04 |
Bonding structure of bonding wire
Grant 9,331,049 - Uno , et al. May 3, 2 | 2016-05-03 |
Bonding Wire For Semiconductor Device Use And Method Of Production Of Same
App 20160111389 - YAMADA; Takashi ; et al. | 2016-04-21 |
Bonding Wire For Semiconductor Device Use And Method Of Production Of Same
App 20160104687 - YAMADA; Takashi ; et al. | 2016-04-14 |
Storage Device And Storage System
App 20160026398 - Yamashita; Hiroyuki ; et al. | 2016-01-28 |
Bonding wire for semiconductor device
Grant 9,112,059 - Uno , et al. August 18, 2 | 2015-08-18 |
Bonding structure of multilayer copper bonding wire
Grant 8,836,147 - Uno , et al. September 16, 2 | 2014-09-16 |
Bonding wire for semiconductor
Grant 8,815,019 - Uno , et al. August 26, 2 | 2014-08-26 |
Bonding wire for semiconductor
Grant 8,742,258 - Terashima , et al. June 3, 2 | 2014-06-03 |
Copper bonding wire for semiconductor device and bonding structure thereof
Grant 8,653,668 - Uno , et al. February 18, 2 | 2014-02-18 |
Copper alloy bonding wire for semiconductor device
Grant 8,610,291 - Uno , et al. December 17, 2 | 2013-12-17 |
Bonding Wire For Semiconductor
App 20130306352 - Terashima; Shinichi ; et al. | 2013-11-21 |
Semiconductor Device
App 20130285202 - KOYANAGI; Kenichi ; et al. | 2013-10-31 |
Semiconductor Device Having Capacitor Including High-k Dielectric
App 20130207171 - UNO; Tomohiro | 2013-08-15 |
Bonding Structure Of Multilayer Copper Bonding Wire
App 20130180757 - Uno; Tomohiro ; et al. | 2013-07-18 |
Gold wire for semiconductor element connection
Grant 8,415,797 - Kimura , et al. April 9, 2 | 2013-04-09 |
Bonding wire for semiconductor devices
Grant 8,389,860 - Uno , et al. March 5, 2 | 2013-03-05 |
Copper Bonding Wire For Semiconductor And Bonding Structure Thereof
App 20120299182 - Uno; Tomohiro ; et al. | 2012-11-29 |
Bonding wire for semiconductor devices
Grant 8,299,356 - Uno , et al. October 30, 2 | 2012-10-30 |
Wire bonding structure and method for forming same
Grant 8,247,911 - Uno , et al. August 21, 2 | 2012-08-21 |
Bonding Wire For Semiconductor
App 20120118610 - Terashima; Shinichi ; et al. | 2012-05-17 |
Bonding Wire For Semiconductor Device
App 20120104613 - Uno; Tomohiro ; et al. | 2012-05-03 |
Copper Alloy Bonding Wire For Semiconductor
App 20120094121 - Uno; Tomohiro ; et al. | 2012-04-19 |
Semiconductor device bonding wire and wire bonding method
Grant 8,102,061 - Uno , et al. January 24, 2 | 2012-01-24 |
Semiconductor mounting bonding wire
Grant 8,097,960 - Terashima , et al. January 17, 2 | 2012-01-17 |
Ald Film-forming Apparatus And Method Of Fabricating Semiconductor Device
App 20110203524 - UNO; Tomohiro | 2011-08-25 |
Copper alloy bonding wire for semiconductor device
Grant 8,004,094 - Uno , et al. August 23, 2 | 2011-08-23 |
Bonding wire for semiconductor device and method for producing the same
Grant 7,969,021 - Uno , et al. June 28, 2 | 2011-06-28 |
Bonding wire for semiconductor device
Grant 7,952,028 - Uno , et al. May 31, 2 | 2011-05-31 |
Bonding Wire For Semiconductor
App 20110120594 - Uno; Tomohiro ; et al. | 2011-05-26 |
Bonding Structure Of Bonding Wire
App 20110104510 - Uno; Tomohiro ; et al. | 2011-05-05 |
Copper Alloy Bonding Wire For Semiconductor Device
App 20110011618 - UNO; Tomohiro ; et al. | 2011-01-20 |
Bonding Wire For Semiconductor Devices
App 20110011619 - Uno; Tomohiro ; et al. | 2011-01-20 |
Semiconductor Device Bonding Wire And Wire Bonding Method
App 20100327450 - Uno; Tomohiro ; et al. | 2010-12-30 |
Bonding Wire For Semiconductor Devices
App 20100294532 - Uno; Tomohiro ; et al. | 2010-11-25 |
Bonding Wire For Semiconductor Device
App 20100282495 - Uno; Tomohiro ; et al. | 2010-11-11 |
Gold wire for connecting semiconductor chip
Grant 7,830,008 - Kimura , et al. November 9, 2 | 2010-11-09 |
Bonding wire for semiconductor device
Grant 7,820,913 - Uno , et al. October 26, 2 | 2010-10-26 |
Bonding Structure Of Bonding Wire And Method For Forming Same
App 20100213619 - Uno; Tomohiro ; et al. | 2010-08-26 |
Method for fabricating a cylindrical capacitor including implanting impurities into the upper sections of the lower electrode to prevent the formation of hemispherical grain silicon on the upper sections
Grant 7,741,176 - Uno , et al. June 22, 2 | 2010-06-22 |
Bonding wire for semiconductor device
App 20090188696 - Uno; Tomohiro ; et al. | 2009-07-30 |
Gold Wire For Semiconductor Element Connection
App 20090115059 - Kimura; Keiichi ; et al. | 2009-05-07 |
Semiconductor Mounting Bonding Wire
App 20090072399 - Terashima; Shinichi ; et al. | 2009-03-19 |
Semiconductor Device Fabrication Method And Semiconductor Device
App 20080173980 - Uno; Tomohiro ; et al. | 2008-07-24 |
Gold bonding wires for semiconductor devices and method of producing the wires
Grant 7,390,370 - Uno , et al. June 24, 2 | 2008-06-24 |
Gold Wire for Connecting Semiconductor Chip
App 20080105975 - Kimura; Keiichi ; et al. | 2008-05-08 |
Copper Alloy Bonding Wire For Semiconductor Device
App 20080061440 - Uno; Tomohiro ; et al. | 2008-03-13 |
Semiconductor device including a capacitor having reduced leakage current
App 20070269954 - Nakamura; Yoshitaka ; et al. | 2007-11-22 |
Gold alloy bonding wire for semiconductor device and process for producing the same
App 20050079347 - Uno, Tomohiro ; et al. | 2005-04-14 |
Bonding wire for semiconductor and method of manufacturing the bonding wire
App 20040014266 - Uno, Tomohiro ; et al. | 2004-01-22 |
Semiconductor device and method to produce the same
App 20020113322 - Terashima, Shinichi ; et al. | 2002-08-22 |
Gold alloy thin wire for semiconductor devices
Grant 6,210,637 - Uno , et al. April 3, 2 | 2001-04-03 |
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