Unitive International Limited

Patent Applications and Registrations

Patent applications and USPTO patent grants for Unitive International Limited.The latest application filed is for "solder structures including barrier layers with nickel and/or copper".

Company Profile

0.21.7

Unitive International Limited - Curacao AN
Unitive International Limited -
Unitive International Limited - AN AN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods of forming electronic structures including conductive shunt layers and related structures Grant 7,879,715 - Nair , et al. February 1, 2	2011-02-01
Solder structures including barrier layers with nickel and/or copper Grant 7,839,000 - Mis , et al. November 23, 2	2010-11-23
Electronic structures including barrier layers defining lips Grant 7,834,454 - Rinne , et al. November 16, 2	2010-11-16
Electronic devices including metallurgy structures for wire and solder bonding Grant 7,665,652 - Mis , et al. February 23, 2	2010-02-23
Solder structures for out of plane connections Grant 7,659,621 - Rinne February 9, 2	2010-02-09
Solder Structures Including Barrier Layers with Nickel and/or Copper App 20090212427 - Mis; J. Daniel ; et al.	2009-08-27
Electronic devices including offset conductive bumps Grant 7,579,694 - Jan , et al. August 25, 2	2009-08-25
Conductive structures including titanium-tungsten base layers Grant 7,550,849 - Mis , et al. June 23, 2	2009-06-23
Methods of forming lead free solder bumps Grant 7,547,623 - Mis , et al. June 16, 2	2009-06-16
Non-Circular via holes for bumping pads and related structures Grant 7,531,898 - Batchelor , et al. May 12, 2	2009-05-12
Stacked electronic structures including offset substrates Grant 7,495,326 - Rinne February 24, 2	2009-02-24
Electronic Structures Including Barrier Layers Defining Lips App 20080308931 - Rinne; Glenn A. ; et al.	2008-12-18
Methods of forming bumps using barrier layers as etch masks Grant 7,427,557 - Rinne , et al. September 23, 2	2008-09-23
Methods Of Forming Electronic Structures Including Conductive Shunt Layers And Related Structures App 20080026560 - Nair; Krishna K. ; et al.	2008-01-31
Methods of forming electronic structures including conductive shunt layers and related structures Grant 7,297,631 - Nair , et al. November 20, 2	2007-11-20
Conductive Structures Including Titanium-Tungsten Base Layers App 20070241460 - Mis; J. Daniels ; et al.	2007-10-18
Methods of forming conductive structures including titanium-tungsten base layers and related structures Grant 7,244,671 - Mis , et al. July 17, 2	2007-07-17
Optical Structures Including Liquid Bumps App 20070152020 - Rinne; Glenn A.	2007-07-05
Optical structures including liquid bumps and related methods Grant 7,213,740 - Rinne May 8, 2	2007-05-08
Low temperature methods of bonding components and related structures Grant 7,156,284 - Rinne , et al. January 2, 2	2007-01-02
Methods of providing solder structures for out plane connections Grant 7,049,216 - Rinne May 23, 2	2006-05-23
Methods of forming electronic structures including conductive shunt layers and related structures App 20060009023 - Nair; Krishna K. ; et al.	2006-01-12
Electronic structures including conductive shunt layers Grant 6,960,828 - Nair , et al. November 1, 2	2005-11-01
Low temperature methods of bonding components and related structures App 20020074381 - Rinne, Glenn A. ; et al.	2002-06-20
Methods for forming integrated redistribution routing conductors and solder bumps Grant 6,389,691 - Rinne , et al. May 21, 2	2002-05-21
Controlled-shaped solder reservoirs for increasing the volume of solder bumps Grant 6,392,163 - Rinne , et al. May 21, 2	2002-05-21
Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby Grant 6,388,203 - Rinne , et al. May 14, 2	2002-05-14
Key-shaped solder bumps and under bump metallurgy Grant 6,329,608 - Rinne , et al. December 11, 2	2001-12-11

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