Unisem (Mauritius) Holdings Limited

Patent Applications and Registrations

Patent applications and USPTO patent grants for Unisem (Mauritius) Holdings Limited.The latest application filed is for "semiconductor device package with electromagnetic shielding".

Company Profile

0.18.1

Unisem (Mauritius) Holdings Limited - Mauritius
Unisem (Mauritius ) Holdings Limited - Port Louis MU

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lead frame routed chip pads for semiconductor packages Grant 8,304,864 - San Antonio , et al. November 6, 2	2012-11-06
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 8,236,612 - San Antonio , et al. August 7, 2	2012-08-07
Semiconductor Device Package With Electromagnetic Shielding App 20120126378 - San Antonio; Romarico S. ; et al.	2012-05-24
RF shielding for a singulated laminate semiconductor device package Grant 8,084,300 - San Antonio , et al. December 27, 2	2011-12-27
Reversible leadless package and methods of making and using same Grant 8,058,104 - Islam , et al. November 15, 2	2011-11-15
Package having exposed integrated circuit device Grant 8,053,869 - McKerreghan , et al. November 8, 2	2011-11-08
Leadless semiconductor package and method of manufacture Grant 7,943,431 - San Antonio , et al. May 17, 2	2011-05-17
Lead frame routed chip pads for semiconductor packages Grant 7,820,480 - Islam , et al. October 26, 2	2010-10-26
Method for making QFN package with power and ground rings Grant 7,816,186 - San Antonio , et al. October 19, 2	2010-10-19
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 7,799,611 - Ramos , et al. September 21, 2	2010-09-21
Lead frame routed chip pads for semiconductor packages Grant 7,795,710 - Islam , et al. September 14, 2	2010-09-14
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 7,790,500 - Ramos , et al. September 7, 2	2010-09-07
Method of making thermally enhanced substrate-base package Grant 7,741,158 - Leung , et al. June 22, 2	2010-06-22
Reversible leadless package and methods of making and using same Grant 7,709,935 - Islam , et al. May 4, 2	2010-05-04
Method of making flip-chip package with underfill Grant 7,700,414 - San Antonio , et al. April 20, 2	2010-04-20
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 7,622,332 - Islam , et al. November 24, 2	2009-11-24
Semiconductor device package and method for manufacturing same Grant 7,563,648 - Islam , et al. July 21, 2	2009-07-21
Package having exposed integrated circuit device Grant 7,554,180 - McKerreghan , et al. June 30, 2	2009-06-30
Taped lead frames and methods of making and using the same in semiconductor packaging Grant 7,439,097 - Islam , et al. October 21, 2	2008-10-21

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