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name:-0.0072469711303711
name:-0.0067079067230225
name:-0.0057229995727539
UNIFLEX Technology Inc. Patent Filings

UNIFLEX Technology Inc.

Patent Applications and Registrations

Patent applications and USPTO patent grants for UNIFLEX Technology Inc..The latest application filed is for "substrate structure with high reflectance and method for manufacturing the same".

Company Profile
16.20.19
  • UNIFLEX Technology Inc. - Taichung City TW
  • UNIFLEX Technology Inc. - Taichung TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Substrate Structure With High Reflectance And Method For Manufacturing The Same
App 20210400805 - Tu; Cheng-I ;   et al.
2021-12-23
Substrate Structure With High Reflectance And Method For Manufacturing The Same
App 20210385943 - Tu; Cheng-I ;   et al.
2021-12-09
Substrate structure with high reflectance and method for manufacturing the same
Grant 11,147,157 - Tu , et al. October 12, 2
2021-10-12
Substrate structure with high reflectance and method for manufacturing the same
Grant 11,140,773 - Tu , et al. October 5, 2
2021-10-05
Substrate Structure With High Reflectance And Method For Manufacturing The Same
App 20200305276 - Tu; Cheng-I ;   et al.
2020-09-24
Substrate Structure With High Reflectance And Method For Manufacturing The Same
App 20200305275 - Tu; Cheng-I ;   et al.
2020-09-24
Substrate structure with high reflectance and method for manufacturing the same
Grant 10,729,007 - Tu , et al.
2020-07-28
Substrate Structure With High Reflectance And Method For Manufacturing The Same
App 20200205283 - Tu; Cheng-I ;   et al.
2020-06-25
Package structure for backlight module
Grant 10,580,951 - Liu , et al.
2020-03-03
Micro light emitting diode module and manufacturing method thereof
Grant 10,580,350 - Lee , et al.
2020-03-03
Package Structure For Backlight Module
App 20190305200 - Liu; Yi-Chun ;   et al.
2019-10-03
Micro Light Emitting Diode Module And Manufacturing Method Thereof
App 20190251894 - LEE; YUAN-CHIH ;   et al.
2019-08-15
Package structure for display
Grant 10,333,042 - Liu , et al.
2019-06-25
Manufacturing method for forming substrate structure comprising vias
Grant 10,306,767 - Liu , et al.
2019-05-28
Manufacturing Method For Forming Substrate Structure Comprising Vias
App 20190008049 - Liu; Yi-Chun ;   et al.
2019-01-03
Flexible printed circuit board structure
Grant 10,104,778 - Liu , et al. October 16, 2
2018-10-16
Flexible Printed Circuit Board Structure
App 20180146552 - Liu; Yi-Chun ;   et al.
2018-05-24
Rigid-flex board structure
Grant 9,860,978 - Liu , et al. January 2, 2
2018-01-02
Rigid-flex circuit board and manufacturing method thereof
Grant 9,844,131 - Liu , et al. December 12, 2
2017-12-12
Rigid-flex Circuit Board And Manufacturing Method Thereof
App 20170156205 - Liu; Yi-Chun ;   et al.
2017-06-01

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