Unicap Electronics Industrial Corporation
Patent Applications and Registrations
Patent applications and USPTO patent grants for Unicap Electronics Industrial Corporation.The latest application filed is for "metal core substrate printed wiring board enabling thermally enhanced ball grid array ( bga) packages and method".
- Unicap Electronics Industrial Corporation -
- Unicap Electronics Industrial Corporation - Taipei TW
- Unicap Electronics Industrial Corporation - Hsien TW
| Patent | Date |
|---|---|
| Metal core substrate printed wiring board enabling thermally enhanced ball grid array ( BGA) packages and method App 20040163248 - Lu, Jane ; et al. | 2004-08-26 |
| Burrless castellation via process and product for plastic chip carrier App 20040141299 - Huang, Edward ; et al. | 2004-07-22 |
| Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages Grant 6,711,812 - Lu , et al. March 30, 2 | 2004-03-30 |
| Process and structure for manufacturing plastic chip carrier Grant 6,675,472 - Huang , et al. January 13, 2 | 2004-01-13 |
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