Umeyama; Nobuhiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Umeyama; Nobuhiro.The latest application filed is for "method of manufacturing wire wound electronic component".
- Umeyama; Nobuhiro - Fujioka JP
- Umeyama; Nobuhiro - Tokyo JP
- Umeyama, Nobuhiro - Fujioka-shi JP
| Patent | Date |
|---|---|
| Electronic chip component and manufacturing method thereof Grant 6,856,229 - Ogawa , et al. February 15, 2 | 2005-02-15 |
| Method of manufacturing wire wound electronic component Grant 6,727,792 - Amada , et al. April 27, 2 | 2004-04-27 |
| Method of manufacturing wire wound electronic component App 20020190832 - Amada, Yoshihiro ; et al. | 2002-12-19 |
| Method of manufacturing wire wound electronic component Grant 6,449,830 - Amada , et al. September 17, 2 | 2002-09-17 |
| Electronic chip component and manufacturing method thereof App 20020125979 - Ogawa, Hideki ; et al. | 2002-09-12 |
| Wire wound electronic component and method of manufacturing the same Grant 6,144,280 - Amada , et al. November 7, 2 | 2000-11-07 |
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