| Patent | Date |
|---|
Method for dividing wafer, method for manufacturing silicon devices, and method for manufacturing liquid ejecting heads
Grant 7,829,446 - Takahashi , et al. November 9, 2 | 2010-11-09 |
Mask, mask forming method, pattern forming method, and wiring pattern forming method
Grant 7,709,159 - Umetsu , et al. May 4, 2 | 2010-05-04 |
Workpiece Splitting Method And Object Producing Method
App 20100089883 - UMETSU; Kazushige ; et al. | 2010-04-15 |
Laser processing apparatus and laser processing method
Grant 7,521,649 - Umetsu , et al. April 21, 2 | 2009-04-21 |
Manufacturing method of quartz crystal resonator, apparatus therefor, and quartz crystal resonator manufactured thereby
Grant 7,518,294 - Umetsu April 14, 2 | 2009-04-14 |
Method of machining substrate and method of manufacturing element
Grant 7,468,310 - Yamazaki , et al. December 23, 2 | 2008-12-23 |
Method for repair of liquid crystal display device light point defects using detection of corrective laser light in real time
Grant 7,440,074 - Umetsu October 21, 2 | 2008-10-21 |
Method for manufacturing a crystal device
Grant 7,411,649 - Umetsu August 12, 2 | 2008-08-12 |
Method for manufacturing a piezoelectric resonator
Grant 7,406,756 - Umetsu , et al. August 5, 2 | 2008-08-05 |
Mask and method of manufacturing the same, electroluminescent device and method of manufacturing the same, and electronic instrument
Grant 7,387,739 - Yotsuya , et al. June 17, 2 | 2008-06-17 |
Method For Dividing Wafer, Method For Manufacturing Silicon Devices, And Method For Manufacturing Liquid Ejecting Heads
App 20080113459 - TAKAHASHI; Wataru ; et al. | 2008-05-15 |
Testing method and testing apparatus for liquid crystal panel
Grant 7,307,444 - Umetsu , et al. December 11, 2 | 2007-12-11 |
Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device
Grant 7,241,967 - Umetsu , et al. July 10, 2 | 2007-07-10 |
Mask, mask forming method, pattern forming method, and wiring pattern forming method
App 20060166111 - Umetsu; Kazushige ; et al. | 2006-07-27 |
Method of laser processing and head for ejecting droplet
Grant 7,070,700 - Sawaki , et al. July 4, 2 | 2006-07-04 |
Method of machining substrate and method of manufacturing element
App 20060134885 - Yamazaki; Yutaka ; et al. | 2006-06-22 |
Method for manufacturing a crystal device
App 20060126868 - Umetsu; Kazushige | 2006-06-15 |
Manufacturing method of substrate
App 20060113284 - Umetsu; Kazushige | 2006-06-01 |
Testing method and testing apparatus for liquid crystal panel
App 20060055931 - Umetsu; Kazushige ; et al. | 2006-03-16 |
Method for repair of liquid crystal display device defects and defect repair apparatus
App 20060050223 - Umetsu; Kazushige | 2006-03-09 |
Manufacturing method of quartz crystal resonator, apparatus therefor, and quartz crystal resonator manufactured thereby
App 20050258146 - Umetsu, Kazushige | 2005-11-24 |
Optical module and method of manufacture thereof, semiconductor device, and optical transmission device
Grant 6,918,705 - Sakurai , et al. July 19, 2 | 2005-07-19 |
Package sealing method, manufacturing method of electronic device modules, sealing apparatus, and packaged product
App 20050150875 - Amako, Jun ; et al. | 2005-07-14 |
Method for manufacturing a piezoelectric resonator
App 20050115038 - Umetsu, Kazushige ; et al. | 2005-06-02 |
Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment
Grant 6,852,621 - Hanaoka , et al. February 8, 2 | 2005-02-08 |
Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
Grant 6,812,549 - Umetsu , et al. November 2, 2 | 2004-11-02 |
Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device
Grant 6,781,089 - Umetsu , et al. August 24, 2 | 2004-08-24 |
Package sealing method, manufacturing method of electronic device modules, sealing apparatus, and packaged product
Grant 6,775,958 - Amako , et al. August 17, 2 | 2004-08-17 |
Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device
App 20040155018 - Umetsu, Kazushige ; et al. | 2004-08-12 |
Method of laser processing and head for ejecting droplet
App 20040129684 - Sawaki, Daisuke ; et al. | 2004-07-08 |
Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment
App 20040092099 - Hanaoka, Terunao ; et al. | 2004-05-13 |
Mask and method of manufacturing the same, electroluminescent device and method of manufacturing the same, and electronic instrument
App 20040026360 - Yotsuya, Shinichi ; et al. | 2004-02-12 |
Optical module and method of manufacture thereof, semiconductor device, and optical transmission device
App 20040028352 - Sakurai, Kazunori ; et al. | 2004-02-12 |
Electro-optical device and method of manufacture thereof, and electronic instrument
Grant 6,690,032 - Umetsu February 10, 2 | 2004-02-10 |
Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them
Grant 6,677,237 - Umetsu , et al. January 13, 2 | 2004-01-13 |
Semiconductor device and manufacturing thereof, including a through-hole with a wider intermediate cavity
Grant 6,667,551 - Hanaoka , et al. December 23, 2 | 2003-12-23 |
Optical module and method of manufacture thereof, semiconductor device, and optical transmission device
Grant 6,623,178 - Sakurai , et al. September 23, 2 | 2003-09-23 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
Grant 6,608,371 - Kurashima , et al. August 19, 2 | 2003-08-19 |
Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
Grant 6,596,634 - Umetsu , et al. July 22, 2 | 2003-07-22 |
Method for machining work by laser beam
Grant 6,563,079 - Umetsu , et al. May 13, 2 | 2003-05-13 |
Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device
App 20030085208 - Umetsu, Kazushige ; et al. | 2003-05-08 |
Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
App 20030060000 - Umetsu, Kazushige ; et al. | 2003-03-27 |
Method and apparatus for laser processing
Grant 6,507,003 - Amako , et al. January 14, 2 | 2003-01-14 |
Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them
App 20020151169 - Umetsu, Kazushige ; et al. | 2002-10-17 |
Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
App 20020127839 - Umetsu, Kazushige ; et al. | 2002-09-12 |
Motor laminated core, method of manufacturing same, motor and ink jet recording device
Grant 6,448,682 - Sakagami , et al. September 10, 2 | 2002-09-10 |
Method and apparatus for laser processing
App 20020021723 - Amako, Jun ; et al. | 2002-02-21 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
App 20020017710 - Kurashima, Yohei ; et al. | 2002-02-14 |
Package sealing method, manufacturing method of electronic device modules, sealing apparatus, and packaged product
App 20010027633 - Amako, Jun ; et al. | 2001-10-11 |
Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment
App 20010027011 - Hanaoka, Terunao ; et al. | 2001-10-04 |
Motor laminated core, method of manufacturing same, motor and ink jet recording device
App 20010015589 - Sakagami, Eimatsu ; et al. | 2001-08-23 |
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