Umemura; Keishiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Umemura; Keishiro.The latest application filed is for "cement bonded wood chip product, resin bonded wood chip product, simulated wood product".
- Umemura; Keishiro - Suginami-ku JP
| Patent | Date |
|---|---|
| Cement bonded wood chip product, resin bonded wood chip product, simulated wood product Grant 7,005,463 - Taguchi , et al. February 28, 2 | 2006-02-28 |
| Cement bonded wood chip product, resin bonded wood chip product, simulated wood product App 20010009309 - Taguchi, Hidenori ; et al. | 2001-07-26 |
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