Umematsu; Misao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Umematsu; Misao.The latest application filed is for "information processing apparatus".

Company Profile

2.10.13

Umematsu; Misao - Kawasaki JP
UMEMATSU; Misao - Kawasaki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Information processing apparatus Grant 10,362,704 - Hirano , et al.	2019-07-23
Information Processing Apparatus App 20190045652 - Hirano; Yukihiro ; et al.	2019-02-07
Cable unit and server apparatus Grant 10,154,609 - Umematsu , et al. Dec	2018-12-11
Cable Unit And Server Apparatus App 20180124944 - Umematsu; Misao ; et al.	2018-05-03
Optical connection box Grant 9,733,433 - Kato , et al. August 15, 2	2017-08-15
Electronic Device App 20150109731 - Umematsu; Misao ; et al.	2015-04-23
Optical Connection Box App 20150078719 - KATO; Seiji ; et al.	2015-03-19
Information Processing Apparatus App 20150059388 - Hirano; Yukihiro ; et al.	2015-03-05
Electronic Device And Substrate Unit App 20150036272 - Tachibana; Masanori ; et al.	2015-02-05
Electronic Apparatus App 20150009620 - Kadotani; Yoshimi ; et al.	2015-01-08
Electronic device Grant 8,780,554 - Umematsu July 15, 2	2014-07-15
Printed Circuit Board Unit App 20140071631 - SO; Tsuyoshi ; et al.	2014-03-13
Electronic Device App 20120195001 - UMEMATSU; Misao	2012-08-02
Printed Circuit Board Unit App 20100226102 - SO; Tsuyoshi ; et al.	2010-09-09
Packaging method, packaging structure and package substrate for electronic parts Grant 7,291,901 - Koide , et al. November 6, 2	2007-11-06
Packaging method, packaging structure and package substrate for electronic parts Grant 7,268,002 - Koide , et al. September 11, 2	2007-09-11
Packaging method, packaging structure and package substrate for electronic parts App 20060063303 - Koide; Masateru ; et al.	2006-03-23
Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bonding Grant 6,891,247 - Kikuchi , et al. May 10, 2	2005-05-10
Packaging method, packaging structure and package substrate for electronic parts App 20040183193 - Koide, Masateru ; et al.	2004-09-23
Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bonding App 20020171153 - Kikuchi, Shunichi ; et al.	2002-11-21
Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same Grant 6,465,085 - Song , et al. October 15, 2	2002-10-15
Connector having skirt with holes to receive plug pins and alignment pin Grant 5,437,558 - Sakuraoka , et al. August 1, 1	1995-08-01

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