Umeda; Yoshikatsu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Umeda; Yoshikatsu.The latest application filed is for "protruding tsv tips for enhanced heat dissipation for ic devices".
- Umeda; Yoshikatsu - Beppu JP
- Umeda; Yoshikatsu - Beppu-City JP
- Umeda; Yoshikatsu - Oita-ken JP
- Umeda; Yoshikatsu - Beppu-shi JP
| Patent | Date |
|---|---|
| Protruding TSV tips for enhanced heat dissipation for IC devices Grant 8,294,261 - Mawatari , et al. October 23, 2 | 2012-10-23 |
| Protruding Tsv Tips For Enhanced Heat Dissipation For Ic Devices App 20110186990 - Mawatari; Kazuaki ; et al. | 2011-08-04 |
| Spot heat wirebonding Grant 7,926,698 - Kawakami , et al. April 19, 2 | 2011-04-19 |
| Spot Heat Wirebonding App 20100140327 - KAWAKAMI; Norihiro ; et al. | 2010-06-10 |
| Spot heat wirebonding Grant 7,677,432 - Kawakami , et al. March 16, 2 | 2010-03-16 |
| Spot heat wirebonding App 20060249561 - Kawakami; Norihiro ; et al. | 2006-11-09 |
| Method and system for improved wire bonding App 20050275073 - Kawakami, Norihiro ; et al. | 2005-12-15 |
| Semiconductor device and method of manufacturing same Grant 6,713,881 - Umehara , et al. March 30, 2 | 2004-03-30 |
| Semiconductor device and method of manufacturing same App 20020125584 - Umehara, Norito ; et al. | 2002-09-12 |
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