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Patent applications and USPTO patent grants for Um; JungHwan.The latest application filed is for "system for fabricating a semiconductor device".
Patent | Date |
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System for fabricating a semiconductor device Grant 10,892,142 - Jeon , et al. January 12, 2 | 2021-01-12 |
Ring assembly and chuck assembly having the same Grant 10,672,629 - Kim , et al. | 2020-06-02 |
System For Fabricating A Semiconductor Device App 20190287766 - JEON; SANGJEAN ;   et al. | 2019-09-19 |
Ring member with air holes and substrate processing system including the same Grant 10,312,059 - Seok , et al. | 2019-06-04 |
Ring Assembly And Chuck Assembly Having The Same App 20180090344 - KIM; SungHyup ;   et al. | 2018-03-29 |
Ring Member With Air Holes And Substrate Processing System Including The Same App 20170069471 - SEOK; Chulkyun ;   et al. | 2017-03-09 |
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