Ulrich; Holger

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ulrich; Holger.The latest application filed is for "thermal management module and operating method".

Company Profile

7.9.16

Ulrich; Holger - Korntal-Muenchingen DE
Ulrich; Holger - Eisendorf DE
Ulrich; Holger - Munich DE
Ulrich; Holger - Nordborg DK
ULRICH; Holger - Muenchen DE
Ulrich, Holger - Rastatt DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Operating Method For A Thermo-management Module App 20220305955 - Haase; Kristian ; et al.	2022-09-29
Thermal Management Module And Operating Method App 20220305954 - Haase; Kristian ; et al.	2022-09-29
Sintering tool and method for sintering an electronic subassembly Grant 11,400,514 - Osterwald , et al. August 2, 2	2022-08-02
Component Node And A Component Carrier For The Component Node App 20220227220 - Ulrich; Holger	2022-07-21
Longitudinal driver assistance system in a motor vehicle Grant 11,292,448 - Ulrich , et al. April 5, 2	2022-04-05
Process And Device For Low-temperature Pressure Sintering App 20210104488 - Eisele; Ronald ; et al.	2021-04-08
Sintering Tool And Method For Sintering An Electronic Subassembly App 20210016353 - Osterwald; Frank ; et al.	2021-01-21
Method Of Assembling A Semiconductor Power Module Component And A Semiconductor Power Module With Such A Module Component And Manufacturing System Therefor App 20210013175 - Osterwald; Frank ; et al.	2021-01-14
Sintering tool for the lower die of a sintering device Grant 10,818,633 - Osterwald , et al. October 27, 2	2020-10-27
Sintering tool and method for sintering an electronic subassembly Grant 10,814,396 - Osterwald , et al. October 27, 2	2020-10-27
Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component Grant 10,622,331 - Hinrich , et al.	2020-04-14
Method for manufacturing semiconductor chips Grant 10,607,962 - Osterwald , et al.	2020-03-31
Sintering device Grant 10,483,229 - Osterwald , et al. Nov	2019-11-19
Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module Grant 10,438,924 - Becker , et al. O	2019-10-08
Power semiconductor module Grant 10,381,283 - Osterwald , et al. A	2019-08-13
Longitudinal Driver Assistance System in a Motor Vehicle App 20180345948 - ULRICH; Holger ; et al.	2018-12-06
Method For Manufacturing Semiconductor Chips App 20180240776 - Osterwald; Frank ; et al.	2018-08-23
Power Semiconductor Module App 20180218957 - Osterwald; Frank ; et al.	2018-08-02
Method For Cohesively Connecting A First Component Of A Power Semiconductor Module To A Second Component Of A Power Semiconductor Module App 20170317051 - Becker; Martin ; et al.	2017-11-02
Sintering Device App 20170229418 - Osterwald; Frank ; et al.	2017-08-10
Process And Device For Low-temperature Pressure Sintering App 20170229424 - Eisele; Ronald ; et al.	2017-08-10
Sintering Tool And Method For Sintering An Electronic Subassembly App 20170216920 - Osterwald; Frank ; et al.	2017-08-03
Sintering Tool For The Lower Die Of A Sintering Device App 20170221852 - Osterwald; Frank ; et al.	2017-08-03
A Flow Distribution Module With A Patterned Cover Plate App 20160109190 - Olesen; Klaus ; et al.	2016-04-21
Air conditioner with internal heat exchanger and heat exchanger tube therefor App 20020046830 - Ulrich, Holger ; et al.	2002-04-25

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