UKEGAWA; Hiroshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for UKEGAWA; Hiroshi.The latest application filed is for "semiconductor device".

Company Profile

1.5.18

UKEGAWA; Hiroshi - Toyota-city JP
Ukegawa; Hiroshi - South Lyon MI
Ukegawa; Hiroshi - Northville MI
Ukegawa; Hiroshi - Toyota JP
Ukegawa; Hiroshi - Okazaki JP
UKEGAWA; Hiroshi - Okazaki-shi JP
UKEGAWA; Hiroshi - Toyota-shi JP
Ukegawa; Hiroshi - Nisshin-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device App 20220270948 - UKEGAWA; Hiroshi ; et al.	2022-08-25
High Frequency Ac Power Distribution Network For Electric Vehicles App 20220247331 - Liu; Yanghe ; et al.	2022-08-04
Asymmetric Configurable Double-Sided Manifold Micro-Channel Cold Plates App 20220248560 - Zhou; Feng ; et al.	2022-08-04
System And Method For Wireless Power Transfer And Data Modulation For Vehicles App 20220194306 - LIU; Yanghe ; et al.	2022-06-23
Driver Board Assemblies and Methods of Forming a Driver Board Assembly App 20220192002 - Zhou; Feng ; et al.	2022-06-16
High-density Integrated Power Electronic Assembly Including Double-sided Cooling Structure App 20220167524 - Fujioka; Hitoshi ; et al.	2022-05-26
Systems Including A Vapor Chamber As The Heat Spreading Substrate Of A Power Device Embedded In A Pcb And Methods Of Forming The Same App 20220157693 - Zhou; Feng ; et al.	2022-05-19
Double-sided Hybrid Cooling Of Pcb Embedded Power Electronics And Capacitors App 20220142017 - Zhou; Feng ; et al.	2022-05-05
Ultra-compact Configurable Double-sided Manifold Micro-channel Cold Plate App 20220142013 - Zhou; Feng ; et al.	2022-05-05
Cooling Assemblies Having Channels To Supply Fluid To Wick Structures App 20220065549 - ZHOU; Feng ; et al.	2022-03-03
Electronics assemblies incorporating three-dimensional heat flow structures Grant 10,206,310 - Ukegawa , et al. Feb	2019-02-12
Solder degradation information generation apparatus Grant 10,132,693 - Ukegawa , et al. November 20, 2	2018-11-20
Hybrid vehicle Grant 10,099,680 - Ukegawa , et al. October 16, 2	2018-10-16
Electronics Assemblies Incorporating Three-dimensional Heat Flow Structures App 20180295748 - Ukegawa; Hiroshi ; et al.	2018-10-11
Methods and Systems for Predicting Failure of a Power Control Unit of a Vehicle App 20180276546 - Joshi; Shailesh ; et al.	2018-09-27
Hybrid Vehicle App 20170225671 - UKEGAWA; Hiroshi ; et al.	2017-08-10
Power supply apparatus Grant 9,653,999 - Ukegawa , et al. May 16, 2	2017-05-16
Power Supply System App 20170008404 - OBA; Tomoko ; et al.	2017-01-12
Solder Degradation Information Generation Apparatus App 20160146676 - UKEGAWA; Hiroshi ; et al.	2016-05-26
Motor Vehicle App 20160142000 - Oba; Tomoko ; et al.	2016-05-19
Power Supply Apparatus App 20160105112 - UKEGAWA; Hiroshi ; et al.	2016-04-14

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.